Skyworks Solutions Inc. CDC7630-000

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

The parameter "Diode Element Material" refers to the specific semiconductor material used in the construction of a diode. This material determines the electrical characteristics and performance of the diode, including its forward voltage drop, reverse breakdown voltage, and switching speed. Common diode element materials include silicon, germanium, and gallium arsenide, each offering different advantages for various applications. The choice of material impacts the diode's efficiency, thermal stability, and overall suitability for specific electronic circuits.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

a count of all of the component leads (or pins)

JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

The "Max Current Rating" parameter in electronic components refers to the maximum amount of electrical current that the component can safely handle without being damaged. It is an important specification to consider when designing or selecting components for a circuit, as exceeding the maximum current rating can lead to overheating, malfunction, or even permanent damage to the component. The max current rating is typically provided in amperes (A) and is determined by the component's internal construction, materials used, and thermal characteristics. It is crucial to ensure that the current flowing through the component does not exceed this specified limit to maintain the component's reliability and longevity.

In electronic components, the parameter "Diode Type" refers to the specific type or configuration of a diode, which is a semiconductor device that allows current to flow in one direction only. There are various types of diodes, each designed for specific applications and functions. Common diode types include rectifier diodes, zener diodes, light-emitting diodes (LEDs), and Schottky diodes, among others. The diode type determines the diode's characteristics, such as forward voltage drop, reverse breakdown voltage, and maximum current rating, making it crucial for selecting the right diode for a particular circuit or application. Understanding the diode type is essential for ensuring proper functionality and performance in electronic circuits.

Impedance-Max is a parameter in electronic components that specifies the maximum impedance that the component can handle without experiencing damage or malfunction. Impedance refers to the opposition that a circuit presents to the flow of alternating current. In the context of electronic components, Impedance-Max is crucial for ensuring proper performance and preventing overloading or overheating. Designers and engineers use this parameter to select components that are compatible with the impedance requirements of a circuit, helping to maintain the integrity and reliability of the overall system.

Voltage - Peak Reverse (Max) refers to the maximum voltage that a semiconductor device, typically a diode, can withstand in the reverse-bias direction without undergoing breakdown. It is crucial for ensuring reliable operation in circuits where the direction of the voltage may change. Exceeding this parameter can result in permanent damage to the component, leading to failure in its intended function. This specification is particularly important in applications involving rectification or signal modulation.

Frequency band refers to a range of frequencies within the electromagnetic spectrum that a particular electronic component or device is designed to operate within. It is a crucial parameter that determines the performance and functionality of the component. The frequency band specifies the upper and lower limits of frequencies that the component can effectively transmit, receive, or process signals. Components such as antennas, filters, amplifiers, and transceivers are designed with specific frequency bands in mind to ensure optimal performance and compatibility with other components in a system. Understanding the frequency band of electronic components is essential for designing and integrating them into electronic systems for efficient and reliable operation.

The "Type of Schottky Barrier" parameter in electronic components refers to the specific characteristics of the Schottky barrier formed at the junction between a metal and a semiconductor material. The Schottky barrier is a type of barrier that forms at the interface between the metal and semiconductor due to differences in their work functions. The type of Schottky barrier is determined by the materials used, their properties, and the method of fabrication. Different types of Schottky barriers can affect the electrical properties of the component, such as the rectification behavior, leakage current, and switching speed. Understanding the type of Schottky barrier is important for designing and selecting electronic components for various applications.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.