

Skyworks Solutions, Inc. DMJ2823-000
Manufacturer No:
DMJ2823-000
Tiny WHSLManufacturer:
Utmel No:
2293-DMJ2823-000
Package:
-
Description:
MIXER DIODE Diode Rectifier Tray
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- TypeParameter
- Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES - Diode Element Material
The parameter "Diode Element Material" refers to the specific semiconductor material used in the construction of a diode. This material determines the electrical characteristics and performance of the diode, including its forward voltage drop, reverse breakdown voltage, and switching speed. Common diode element materials include silicon, germanium, and gallium arsenide, each offering different advantages for various applications. The choice of material impacts the diode's efficiency, thermal stability, and overall suitability for specific electronic circuits.
SILICON - Number of Terminals2
- RoHSDetails
- Factory Pack QuantityFactory Pack Quantity100
- Risk Rank5.26
- Ihs ManufacturerSKYWORKS SOLUTIONS INC
- Part Life Cycle CodeActive
- Number of Elements1
- Package ShapeRECTANGULAR
- Manufacturer Part NumberDMJ2823-000
- Operating Frequency (Max)4 GHz
- Rohs CodeYes
- Reflow Temperature-Max (s)40
- Manufacturer Package CodeCASE 491-011
- Package Body MaterialCERAMIC, METAL-SEALED COFIRED
- Moisture Sensitivity Levels1
- Package StyleMICROWAVE
- Package DescriptionR-CDMW-F2
- Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
DMJ2823 - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - Pbfree Code
The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.
Yes - ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - HTS Code
HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.
8541.10.00.60 - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
DUAL - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
FLAT - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Reach Compliance Code
Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.
compliant - Pin Count
a count of all of the component leads (or pins)
2 - JESD-30 Code
JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.
R-CDMW-F2 - Qualification Status
An indicator of formal certification of qualifications.
Not Qualified - Configuration
The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.
SINGLE - Diode Type
In electronic components, the parameter "Diode Type" refers to the specific type or configuration of a diode, which is a semiconductor device that allows current to flow in one direction only. There are various types of diodes, each designed for specific applications and functions. Common diode types include rectifier diodes, zener diodes, light-emitting diodes (LEDs), and Schottky diodes, among others. The diode type determines the diode's characteristics, such as forward voltage drop, reverse breakdown voltage, and maximum current rating, making it crucial for selecting the right diode for a particular circuit or application. Understanding the diode type is essential for ensuring proper functionality and performance in electronic circuits.
MIXER DIODE - Operating Frequency-Min
Operating Frequency-Min is a parameter in electronic components that specifies the minimum frequency at which the component can function reliably. This parameter is crucial for determining the performance and compatibility of the component within a given system or circuit. It indicates the lowest frequency at which the component can operate without experiencing issues such as signal degradation, timing errors, or malfunctions. Designers and engineers use this specification to ensure that the component will meet the required performance criteria under specific operating conditions.
2 GHz - Frequency Band
Frequency band refers to a range of frequencies within the electromagnetic spectrum that a particular electronic component or device is designed to operate within. It is a crucial parameter that determines the performance and functionality of the component. The frequency band specifies the upper and lower limits of frequencies that the component can effectively transmit, receive, or process signals. Components such as antennas, filters, amplifiers, and transceivers are designed with specific frequency bands in mind to ensure optimal performance and compatibility with other components in a system. Understanding the frequency band of electronic components is essential for designing and integrating them into electronic systems for efficient and reliable operation.
S BAND - Diode Capacitance-Max
The parameter "Diode Capacitance-Max" refers to the maximum capacitance value that a diode can exhibit under specified conditions. Capacitance in a diode is a measure of its ability to store and release electrical charge, which can affect the diode's performance in certain applications. A higher capacitance value can lead to slower response times and increased signal distortion in high-frequency circuits. It is important to consider the maximum capacitance of a diode when designing electronic circuits to ensure proper functionality and performance.
0.5 pF - Noise Figure-Max
Noise Figure-Max, or NFmax, is a parameter that quantifies the maximum degradation of signal-to-noise ratio that can occur in a given communication system due to the inherent noise generated by an electronic component, such as an amplifier. It represents the worst-case scenario for the noise performance of the device under specified conditions. A lower NFmax indicates better performance, as it reflects a component's ability to minimize the additional noise it contributes to the signal. This parameter is critical in designing high-performance RF and microwave systems, especially in low-signal applications.
6 dB - Type of Schottky Barrier
The "Type of Schottky Barrier" parameter in electronic components refers to the specific characteristics of the Schottky barrier formed at the junction between a metal and a semiconductor material. The Schottky barrier is a type of barrier that forms at the interface between the metal and semiconductor due to differences in their work functions. The type of Schottky barrier is determined by the materials used, their properties, and the method of fabrication. Different types of Schottky barriers can affect the electrical properties of the component, such as the rectification behavior, leakage current, and switching speed. Understanding the type of Schottky barrier is important for designing and selecting electronic components for various applications.
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