

Skyworks Solutions Inc. SMV1130-040LF
Manufacturer No:
SMV1130-040LF
Tiny WHSLManufacturer:
Utmel No:
2293-SMV1130-040LF
Package:
-
Description:
Quantity:
Unit Price: $0.623720
Ext Price: $0.62
Delivery:





Payment:











In Stock : 7000
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$0.623720
$0.62
10
$0.588415
$5.88
100
$0.555109
$55.51
500
$0.523687
$261.84
1000
$0.494045
$494.04
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- TypeParameter
- Factory Lead Time13 Weeks
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Cut Tape (CT) - Published2006
- Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
1 (Unlimited) - Termination
Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.
SMD/SMT - ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - Max Operating Temperature
The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
125°C - Min Operating Temperature
The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.
-55°C - Capacitance
Capacitance is a fundamental electrical property of electronic components that describes their ability to store electrical energy in the form of an electric field. It is measured in farads (F) and represents the ratio of the amount of electric charge stored on a component to the voltage across it. Capacitors are passive components that exhibit capacitance and are commonly used in electronic circuits for various purposes such as filtering, energy storage, timing, and coupling. Capacitance plays a crucial role in determining the behavior and performance of electronic systems by influencing factors like signal propagation, frequency response, and power consumption.
18.5pF - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
NOT SPECIFIED - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
NOT SPECIFIED - Element Configuration
The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.
Single - Forward Current
Current which flows upon application of forward voltage.
20mA - Reverse Voltage (DC)
Reverse Voltage (DC) refers to the maximum voltage that an electronic component, typically a semiconductor device like a diode, can withstand in the reverse direction without undergoing breakdown or failure. It indicates the threshold at which the device will start to conduct in reverse, potentially damaging the component. This parameter is crucial for ensuring the reliability and safety of circuits that may experience reverse polarity or unexpected voltage conditions. Exceeding the specified reverse voltage can lead to permanent damage or catastrophic failure of the component.
26V - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
RoHS Compliant