Taiwan Semiconductor 31DF6 R0
Taiwan Semiconductor 31DF6 R0
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Taiwan Semiconductor 31DF6 R0

Manufacturer No:

31DF6 R0

Utmel No:

2436-31DF6 R0

Package:

DO-201AD-2

ECAD Model:

Description:

RECTIFIER DIODE SILICON AXIAL Tape and Reel DO-201AD-2

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31DF6 R0 information

Specifications
Documents & Media
Product Details
Taiwan Semiconductor 31DF6 R0 technical specifications, attributes, parameters and parts with similar specifications to Taiwan Semiconductor 31DF6 R0.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    Production (Last Updated: 2 years ago)
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    DO-201AD-2
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Through Hole
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Number of Pins
    2
  • Diode Element Material

    The parameter "Diode Element Material" refers to the specific semiconductor material used in the construction of a diode. This material determines the electrical characteristics and performance of the diode, including its forward voltage drop, reverse breakdown voltage, and switching speed. Common diode element materials include silicon, germanium, and gallium arsenide, each offering different advantages for various applications. The choice of material impacts the diode's efficiency, thermal stability, and overall suitability for specific electronic circuits.

    SILICON
  • Number of Terminals
    2
  • ECCN (US)
    EAR99
  • Peak Reverse Repetitive Voltage (V)
    600
  • Maximum Continuous Forward Current (A)
    3
  • Peak Non-Repetitive Surge Current (A)
    45
  • Peak Forward Voltage (V)
    1.7
  • Peak Reverse Current (uA)
    20
  • Peak Reverse Recovery Time (ns)
    35
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    150
  • Standard Package Name
    DO-201-AD
  • Supplier Package
    DO-201AD
  • Military
    No
  • Mounting
    Through Hole
  • Package Length
    9.5(Max)
  • PCB changed
    2
  • Lead Shape
    Through Hole
  • Vr - Reverse Voltage
    600 V
  • Ir - Reverse Current
    100 uA
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 150 C
  • Unit Weight
    0.045151 oz
  • Minimum Operating Temperature
    - 40 C
  • Factory Pack QuantityFactory Pack Quantity
    1250
  • Mounting Styles
    Through Hole
  • Manufacturer
    Taiwan Semiconductor
  • Brand
    Taiwan Semiconductor
  • If - Forward Current
    3 A
  • RoHS
    Details
  • Manufacturer Lifecycle Status
    ACTIVE (Last Updated: 2 years ago)
  • Package Style
    LONG FORM
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Min
    -40 °C
  • Operating Temperature-Max
    150 °C
  • Rohs Code
    Yes
  • Manufacturer Part Number
    31DF6R0
  • Package Shape
    ROUND
  • Number of Elements
    1
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    TAIWAN SEMICONDUCTOR CO LTD
  • Forward Voltage-Max (VF)
    1.7 V
  • Risk Rank
    5.23
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    31DFx
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Type
    Switching Diode
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin (Sn)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    150 °C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    -40 °C
  • Applications

    The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

    EFFICIENCY
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    HIGH RELIABILITY, LOW POWER LOSS
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8541.10.00.80
  • Subcategory
    Diodes & Rectifiers
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    AXIAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    WIRE
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    not_compliant
  • Pin Count

    a count of all of the component leads (or pins)

    2
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    O-PALF-W2
  • Configuration

    The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

    Single
  • Element Configuration

    The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

    Single
  • Diode Type

    In electronic components, the parameter "Diode Type" refers to the specific type or configuration of a diode, which is a semiconductor device that allows current to flow in one direction only. There are various types of diodes, each designed for specific applications and functions. Common diode types include rectifier diodes, zener diodes, light-emitting diodes (LEDs), and Schottky diodes, among others. The diode type determines the diode's characteristics, such as forward voltage drop, reverse breakdown voltage, and maximum current rating, making it crucial for selecting the right diode for a particular circuit or application. Understanding the diode type is essential for ensuring proper functionality and performance in electronic circuits.

    RECTIFIER DIODE
  • Case Connection

    Case Connection refers to the method by which an electronic component's case or housing is connected to the electrical circuit. This connection is important for grounding purposes, mechanical stability, and heat dissipation. The case connection can vary depending on the type of component and its intended application. It is crucial to ensure a secure and reliable case connection to maintain the overall performance and safety of the electronic device.

    ISOLATED
  • Forward Current

    Current which flows upon application of forward voltage.

    3 A
  • Max Surge Current

    Surge current is a peak non repetitive current. Maximum (peak or surge) forward current = IFSM or if(surge), the maximum peak amount of current the diode is able to conduct in forward bias mode.

    45 A
  • Output Current-Max

    Output Current-Max is a parameter in electronic components that specifies the maximum amount of current that can be safely drawn from the output of the component without causing damage. It is an important specification to consider when designing circuits to ensure that the component can handle the required current without overheating or failing. Exceeding the maximum output current can lead to performance issues, component damage, or even complete failure of the circuit. It is crucial to adhere to the specified maximum output current to ensure the reliable operation of the electronic component and the overall circuit.

    3 A
  • Forward Voltage

    the amount of voltage needed to get current to flow across a diode.

    1.7 V
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Rectifiers
  • Number of Phases
    1
  • Rep Pk Reverse Voltage-Max

    Rep Pk Reverse Voltage-Max refers to the maximum reverse voltage that an electronic component, such as a diode, can withstand during a specified period of time without failing. This parameter is crucial in determining the safe operating limits of components in circuits where reverse voltage conditions may occur. Exceeding this value can lead to breakdown or permanent damage to the component. It is typically expressed in volts and is a key specification in signal and power applications.

    600 V
  • JEDEC-95 Code

    JEDEC-95 Code is a standardized identification system used by the Joint Electron Device Engineering Council to categorize and describe semiconductor devices. This code provides a unique alphanumeric identifier for various memory components, ensuring consistency in documentation and communication across the electronics industry. The format includes information about the type, capacity, and technology of the device, facilitating easier specification and understanding for manufacturers and engineers.

    DO-201AD
  • Peak Non-Repetitive Surge Current

    Peak Non-Repetitive Surge Current is a specification in electronic components that refers to the maximum current that the component can withstand for a short duration without sustaining damage. This surge current typically occurs as a result of sudden voltage spikes or transient events in the circuit. It is important to consider this parameter when designing or selecting components to ensure they can handle occasional high-current surges without failing. The value of Peak Non-Repetitive Surge Current is usually specified in amperes and is crucial for protecting the component and maintaining the overall reliability of the circuit.

    45 A
  • Non-rep Pk Forward Current-Max

    Non-rep Pk Forward Current-Max refers to the maximum forward current that a semiconductor device, such as a diode or LED, can handle in a pulsed or non-repetitive manner without being damaged. This parameter is essential for designers to ensure that the component operates reliably under specific conditions, particularly during transient events like switching or fault conditions. Exceeding this limit can lead to overheating or failure of the device.

    45 A
  • Reverse Current-Max

    Reverse Current-Max is a parameter used to specify the maximum amount of current that can flow in the reverse direction through an electronic component, such as a diode or a transistor. This parameter is important because it indicates the maximum reverse current that the component can handle without being damaged. It is typically measured in amperes (A) and is crucial for ensuring the reliability and longevity of the component in a circuit. Designers need to consider this parameter when selecting components to prevent reverse current from exceeding the specified limit and causing potential failure.

    20 µA
  • Recovery Time

    Recovery time in electronic components refers to the time it takes for a device to return to its normal operating state after being subjected to a specific stimulus or disturbance. This parameter is particularly important in devices such as diodes, transistors, and capacitors, where the recovery time can impact the overall performance and reliability of the component. A shorter recovery time indicates that the component can quickly recover from a transient event, ensuring proper functionality and minimizing any potential disruptions in the circuit. Manufacturers typically provide recovery time specifications to help engineers and designers select components that meet the requirements of their specific applications.

    35 ns
  • Reverse Recovery Time-Max

    The "Reverse Recovery Time-Max" parameter in electronic components, such as diodes and transistors, refers to the maximum time it takes for the component to switch from the conducting state to the non-conducting state when the polarity of the applied voltage is reversed. This parameter is crucial in applications where fast switching speeds are required, as a longer reverse recovery time can lead to inefficiencies and potential performance issues. Manufacturers provide this specification to help designers and engineers select components that meet the required performance criteria for their specific applications. It is typically measured in nanoseconds or microseconds, with lower values indicating faster switching speeds and better overall performance.

    0.035 µs
  • Product

    In the context of electronic components, the parameter "Product" typically refers to the specific item or device being discussed or analyzed. It can refer to a physical electronic component such as a resistor, capacitor, transistor, or integrated circuit. The product parameter may also encompass more complex electronic devices like sensors, displays, microcontrollers, or communication modules.Understanding the product parameter is crucial in electronics as it helps identify the characteristics, specifications, and functionality of the component or device in question. This information is essential for selecting the right components for a circuit design, troubleshooting issues, or comparing different products for a particular application. Manufacturers often provide detailed product datasheets that outline key specifications, performance characteristics, and application guidelines to assist engineers and designers in utilizing the component effectively.

    Rectifiers
  • Vf - Forward Voltage

    In electronic components, "Vf - Forward Voltage" refers to the voltage required for current to flow through a diode or LED in the forward direction. It is the minimum voltage needed to overcome the barrier potential at the junction of the diode, allowing current to pass through. The forward voltage drop is typically specified in datasheets and is an important parameter to consider when designing circuits using diodes or LEDs. Understanding the forward voltage helps in selecting the appropriate components and ensuring proper operation of the circuit.

    1.7 V
  • Product Category

    a particular group of related products.

    Rectifiers
  • Diameter

    In electronic components, the parameter "Diameter" typically refers to the measurement of the width of a circular component, such as a resistor, capacitor, or inductor. It is a crucial dimension that helps determine the physical size and fit of the component within a circuit or on a circuit board. The diameter is usually measured in millimeters (mm) or inches (in) and is important for ensuring proper placement and soldering of the component during assembly. Understanding the diameter of electronic components is essential for selecting the right size for a specific application and ensuring compatibility with other components and the overall design of the circuit.

    5.6(Max)
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Yes with exemptions
0 Similar Products Remaining
Download datasheets and manufacturer documentation for Taiwan Semiconductor 31DF6 R0.

31DF6 R0 Overview

According to the datasheets, the peak forward voltage is 1.7 volts.RF diode consumes approximately 3 in continuous forward current at any given moment.The forward voltage should be kept above 1.7 V V.This device can read a maximum voltage of 3 A.

31DF6 R0 Features

the forward peak voltage is 1.7
a maximum output current voltage of 3 A

31DF6 R0 Applications

There are a lot of Taiwan Semiconductor
31DF6 R0 applications of RF diodes.


  • RF voltage doubler
  • Wearables
  • Smart metering
  • Set top boxes
  • RF attenuators and switches
  • Low-loss, high-power limiters
  • Receiver protectors
  • UHF mixer
  • Sampling circuits
  • Modulators
31DF6 R0 Relevant information

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