Taiwan Semiconductor Corporation MBRF2060CT C0G
Taiwan Semiconductor Corporation MBRF2060CT C0G
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Taiwan Semiconductor Corporation MBRF2060CT C0G

Manufacturer No:

MBRF2060CT C0G

Utmel No:

2436-MBRF2060CT C0G

Package:

TO-220-3 Full Pack, Isolated Tab

ECAD Model:

Description:

Schottky Rectifier Diode 1 Pair Common Cathode Fast Recovery =< 500ns, > 200mA (Io) -55°C~150°C TO-220-3 Full Pack, Isolated Tab Through Hole

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  • Vacuum packagingStep2:Vacuum packaging
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MBRF2060CT C0G information

Specifications
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Product Details
Taiwan Semiconductor Corporation MBRF2060CT C0G technical specifications, attributes, parameters and parts with similar specifications to Taiwan Semiconductor Corporation MBRF2060CT C0G.
  • Type
    Parameter
  • Factory Lead Time
    10 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Through Hole
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    TO-220-3 Full Pack, Isolated Tab
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Diode Element Material

    The parameter "Diode Element Material" refers to the specific semiconductor material used in the construction of a diode. This material determines the electrical characteristics and performance of the diode, including its forward voltage drop, reverse breakdown voltage, and switching speed. Common diode element materials include silicon, germanium, and gallium arsenide, each offering different advantages for various applications. The choice of material impacts the diode's efficiency, thermal stability, and overall suitability for specific electronic circuits.

    SILICON
  • Number of Elements
    2
  • Operating Temperature (Max.)
    150°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Published
    2014
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    3
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Applications

    The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

    EFFICIENCY
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    LOW POWER LOSS, UL RECOGNIZED
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8541.10.00.80
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    SINGLE
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PSFM-T3
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    Fast Recovery =< 500ns, > 200mA (Io)
  • Diode Type

    In electronic components, the parameter "Diode Type" refers to the specific type or configuration of a diode, which is a semiconductor device that allows current to flow in one direction only. There are various types of diodes, each designed for specific applications and functions. Common diode types include rectifier diodes, zener diodes, light-emitting diodes (LEDs), and Schottky diodes, among others. The diode type determines the diode's characteristics, such as forward voltage drop, reverse breakdown voltage, and maximum current rating, making it crucial for selecting the right diode for a particular circuit or application. Understanding the diode type is essential for ensuring proper functionality and performance in electronic circuits.

    Schottky
  • Current - Reverse Leakage @ Vr

    Current - Reverse Leakage @ Vr is a parameter that describes the amount of current that flows in the reverse direction through a diode or other semiconductor component when a reverse voltage (Vr) is applied across it. This leakage current is typically very small, but it is important to consider in electronic circuits as it can affect the overall performance and reliability of the component. The reverse leakage current is influenced by factors such as the material properties of the semiconductor, temperature, and the magnitude of the reverse voltage applied. Manufacturers provide this parameter in datasheets to help engineers and designers understand the behavior of the component in reverse bias conditions.

    100μA @ 60V
  • Voltage - Forward (Vf) (Max) @ If

    The parameter "Voltage - Forward (Vf) (Max) @ If" refers to the maximum voltage drop across a diode when it is forward-biased and conducting a specified forward current (If). It indicates the maximum potential difference the diode can withstand while allowing current to flow in the forward direction without breaking down. This value is crucial for designing circuits as it helps determine how much voltage will be lost across the diode during operation. Higher Vf values can lead to reduced efficiency in power applications, making this parameter essential for optimizing circuit performance.

    950mV @ 20A
  • Operating Temperature - Junction

    Operating Temperature - Junction refers to the maximum temperature at which the junction of an electronic component can safely operate without causing damage or performance degradation. This parameter is crucial for determining the reliability and longevity of the component, as excessive heat can lead to thermal stress and failure. Manufacturers specify the operating temperature range to ensure that the component functions within safe limits under normal operating conditions. It is important for designers and engineers to consider the operating temperature - junction when selecting and using electronic components to prevent overheating and ensure optimal performance.

    -55°C~150°C
  • Output Current-Max

    Output Current-Max is a parameter in electronic components that specifies the maximum amount of current that can be safely drawn from the output of the component without causing damage. It is an important specification to consider when designing circuits to ensure that the component can handle the required current without overheating or failing. Exceeding the maximum output current can lead to performance issues, component damage, or even complete failure of the circuit. It is crucial to adhere to the specified maximum output current to ensure the reliable operation of the electronic component and the overall circuit.

    10A
  • Voltage - DC Reverse (Vr) (Max)

    Voltage - DC Reverse (Vr) (Max) is a parameter in electronic components that specifies the maximum reverse voltage that the component can withstand without breaking down. This parameter is crucial for components like diodes and transistors that are often subjected to reverse voltage during operation. Exceeding the maximum reverse voltage can lead to the component failing or getting damaged. Designers need to consider this parameter when selecting components to ensure the reliability and longevity of their circuits.

    60V
  • Current - Average Rectified (Io)

    The parameter "Current - Average Rectified (Io)" in electronic components refers to the average value of the rectified current flowing through the component. This parameter is important in determining the average power dissipation and thermal considerations of the component. It is typically specified in datasheets for diodes, rectifiers, and other components that handle alternating current (AC) and convert it to direct current (DC). Understanding the average rectified current helps in selecting the appropriate component for a given application to ensure reliable operation and prevent overheating.

    20A
  • Number of Phases
    1
  • Rep Pk Reverse Voltage-Max

    Rep Pk Reverse Voltage-Max refers to the maximum reverse voltage that an electronic component, such as a diode, can withstand during a specified period of time without failing. This parameter is crucial in determining the safe operating limits of components in circuits where reverse voltage conditions may occur. Exceeding this value can lead to breakdown or permanent damage to the component. It is typically expressed in volts and is a key specification in signal and power applications.

    60V
  • Non-rep Pk Forward Current-Max

    Non-rep Pk Forward Current-Max refers to the maximum forward current that a semiconductor device, such as a diode or LED, can handle in a pulsed or non-repetitive manner without being damaged. This parameter is essential for designers to ensure that the component operates reliably under specific conditions, particularly during transient events like switching or fault conditions. Exceeding this limit can lead to overheating or failure of the device.

    150A
  • Diode Configuration

    Diode configuration refers to the specific arrangement and connection of diodes within an electronic circuit. It can determine how the diode functions, whether as a rectifier, switch, or voltage regulator. Common configurations include series, parallel, and bridge configurations, each with distinct characteristics affecting the flow of current and voltage in the circuit. Proper diode configuration is essential for achieving desired circuit behaviors and performance.

    1 Pair Common Cathode
  • Reverse Current-Max

    Reverse Current-Max is a parameter used to specify the maximum amount of current that can flow in the reverse direction through an electronic component, such as a diode or a transistor. This parameter is important because it indicates the maximum reverse current that the component can handle without being damaged. It is typically measured in amperes (A) and is crucial for ensuring the reliability and longevity of the component in a circuit. Designers need to consider this parameter when selecting components to prevent reverse current from exceeding the specified limit and causing potential failure.

    100μA
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Taiwan Semiconductor Corporation MBRF2060CT C0G.

MBRF2060CT C0G Overview

The forward voltage should always remain within 100μA and be monitored.An output voltage of 10A is the maximum it can handle.

MBRF2060CT C0G Features

a forward voltage of 100μA
a forward voltage of 100μA
a maximum output voltage of 10A

MBRF2060CT C0G Applications

There are a lot of Taiwan Semiconductor Corporation
MBRF2060CT C0G applications of rectifier diode array.


  • Rectifier for drives applications
  • Crowbar applications
  • Rectifiers for UBS
  • Battery chargers
  • Rectifiers in switch mode power supplies (SMPS)
  • Free wheeling diode in low voltage converters
  • General Rectification