Vishay General Semiconductor - Diodes Division BU2010-M3/45
Vishay General Semiconductor - Diodes Division BU2010-M3/45
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Vishay General Semiconductor - Diodes Division BU2010-M3/45

Manufacturer No:

BU2010-M3/45

Utmel No:

2668-BU2010-M3/45

Package:

4-SIP, BU

ECAD Model:

Description:

Single Phase Bridge Rectifier Through Hole -55°C ~ 150°C (TJ) 5 µA @ 1000 V 1.05 V @ 10 A 4-SIP, BU Tube

Quantity:

Unit Price: $4.147567

Ext Price: $4.15

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 129

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $4.147567

    $4.15

  • 10

    $3.912799

    $39.13

  • 100

    $3.691320

    $369.13

  • 500

    $3.482377

    $1,741.19

  • 1000

    $3.285262

    $3,285.26

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
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BU2010-M3/45 information

Specifications
Product Details
Vishay General Semiconductor - Diodes Division BU2010-M3/45 technical specifications, attributes, parameters and parts with similar specifications to Vishay General Semiconductor - Diodes Division BU2010-M3/45.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Through Hole
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    4-SIP, BU
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    isoCINK+™ BU
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    BU2010
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C ~ 150°C (TJ)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Diode Type

    In electronic components, the parameter "Diode Type" refers to the specific type or configuration of a diode, which is a semiconductor device that allows current to flow in one direction only. There are various types of diodes, each designed for specific applications and functions. Common diode types include rectifier diodes, zener diodes, light-emitting diodes (LEDs), and Schottky diodes, among others. The diode type determines the diode's characteristics, such as forward voltage drop, reverse breakdown voltage, and maximum current rating, making it crucial for selecting the right diode for a particular circuit or application. Understanding the diode type is essential for ensuring proper functionality and performance in electronic circuits.

    Single Phase
  • Current - Reverse Leakage @ Vr

    Current - Reverse Leakage @ Vr is a parameter that describes the amount of current that flows in the reverse direction through a diode or other semiconductor component when a reverse voltage (Vr) is applied across it. This leakage current is typically very small, but it is important to consider in electronic circuits as it can affect the overall performance and reliability of the component. The reverse leakage current is influenced by factors such as the material properties of the semiconductor, temperature, and the magnitude of the reverse voltage applied. Manufacturers provide this parameter in datasheets to help engineers and designers understand the behavior of the component in reverse bias conditions.

    5 µA @ 1000 V
  • Voltage - Forward (Vf) (Max) @ If

    The parameter "Voltage - Forward (Vf) (Max) @ If" refers to the maximum voltage drop across a diode when it is forward-biased and conducting a specified forward current (If). It indicates the maximum potential difference the diode can withstand while allowing current to flow in the forward direction without breaking down. This value is crucial for designing circuits as it helps determine how much voltage will be lost across the diode during operation. Higher Vf values can lead to reduced efficiency in power applications, making this parameter essential for optimizing circuit performance.

    1.05 V @ 10 A
  • Current - Average Rectified (Io)

    The parameter "Current - Average Rectified (Io)" in electronic components refers to the average value of the rectified current flowing through the component. This parameter is important in determining the average power dissipation and thermal considerations of the component. It is typically specified in datasheets for diodes, rectifiers, and other components that handle alternating current (AC) and convert it to direct current (DC). Understanding the average rectified current helps in selecting the appropriate component for a given application to ensure reliable operation and prevent overheating.

    20 A
  • Voltage - Peak Reverse (Max)

    Voltage - Peak Reverse (Max) refers to the maximum voltage that a semiconductor device, typically a diode, can withstand in the reverse-bias direction without undergoing breakdown. It is crucial for ensuring reliable operation in circuits where the direction of the voltage may change. Exceeding this parameter can result in permanent damage to the component, leading to failure in its intended function. This specification is particularly important in applications involving rectification or signal modulation.

    1 kV
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BU2010-M3/45 Overview

A 4-SIP, BU package electronic component is basically a type of electronic component.Keeping the temperature at -55°C ~ 150°C (TJ) ensures normal operation.

BU2010-M3/45 Features

4-SIP, BU package
operating at a temperature of -55°C ~ 150°C (TJ)

BU2010-M3/45 Applications

There are a lot of Vishay General Semiconductor - Diodes Division
BU2010-M3/45 applications of bridge rectifiers.


  • High forward surge current capability
  • Low thermal resistance
  • Extremely robust construction
  • Fuse-in-glass diodes design
  • Electrically isolated aluminum case
  • Motor controls – Low Voltage and Medium Voltage converters
  • SCR power bridges for solid state starters
  • SCR and diode based input rectifiers
  • Crowbar systems for motor drives
  • Wind power (alternative energy) – Converters available as diodes, SCRs or IGBTs