Zetex GBPC35-04

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

In electronic components, the parameter "Shape" refers to the physical form or outline of the component. It describes the external appearance of the component, including its dimensions, size, and overall structure. The shape of an electronic component can vary widely depending on its function and design requirements. Common shapes include rectangular, cylindrical, square, and circular, among others. The shape of a component is an important consideration in the design and layout of electronic circuits, as it can impact factors such as space utilization, heat dissipation, and ease of assembly.

Package Cooled refers to a type of thermal management in electronic components where the device packaging is designed to dissipate heat efficiently. This involves integrating cooling features such as heat sinks or specialized materials that enhance heat transfer away from the component. The goal is to maintain optimal operating temperatures and improve reliability and performance of the electronic device. It is commonly used in high-power applications where excessive heat generation can affect functionality.

Material Finish in electronic components refers to the surface treatment applied to the component to enhance its performance, durability, and reliability. The finish can protect the component from environmental factors such as moisture, corrosion, and mechanical stress. Common material finishes include gold plating, tin plating, silver plating, and organic coatings. The choice of material finish depends on the specific requirements of the application, such as conductivity, solderability, and cost-effectiveness. Proper material finish selection is crucial to ensure the long-term functionality and quality of electronic components.

The parameter "Diode Element Material" refers to the specific semiconductor material used in the construction of a diode. This material determines the electrical characteristics and performance of the diode, including its forward voltage drop, reverse breakdown voltage, and switching speed. Common diode element materials include silicon, germanium, and gallium arsenide, each offering different advantages for various applications. The choice of material impacts the diode's efficiency, thermal stability, and overall suitability for specific electronic circuits.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

The attachment method in electronic components refers to the technique used to connect a component to a circuit board or assembly. This can include methods such as soldering, bonding, or using connectors. The choice of attachment method can affect the reliability, performance, and manufacturability of the electronic device. Different methods may be suited for specific applications based on factors like mechanical stress, thermal conductivity, and ease of assembly.

The parameter "Height Off Base (Height of Fin)" in electronic components refers to the distance between the base of the component and the top of any fins or protrusions on the component. This measurement is important for determining the overall dimensions and clearance requirements of the component within a circuit or system. It helps in ensuring proper fit and alignment of the component during installation and assembly. Manufacturers provide this specification to assist designers and engineers in selecting the appropriate components for their applications based on the available space and mechanical constraints.

Thermal Resistance @ Forced Air Flow is a measure of how effectively an electronic component can dissipate heat when subjected to airflow. It quantifies the resistance to heat transfer from the component to the surrounding air in scenarios where forced ventilation is employed, such as with fans. This parameter is crucial for evaluating thermal performance, as it impacts the component's operating temperature and reliability under conditions of active cooling. Lower thermal resistance values indicate better heat dissipation capabilities, essential for maintaining optimal performance in high-power applications.

In electronic components, the parameter "Diode Type" refers to the specific type or configuration of a diode, which is a semiconductor device that allows current to flow in one direction only. There are various types of diodes, each designed for specific applications and functions. Common diode types include rectifier diodes, zener diodes, light-emitting diodes (LEDs), and Schottky diodes, among others. The diode type determines the diode's characteristics, such as forward voltage drop, reverse breakdown voltage, and maximum current rating, making it crucial for selecting the right diode for a particular circuit or application. Understanding the diode type is essential for ensuring proper functionality and performance in electronic circuits.

Case Connection refers to the method by which an electronic component's case or housing is connected to the electrical circuit. This connection is important for grounding purposes, mechanical stability, and heat dissipation. The case connection can vary depending on the type of component and its intended application. It is crucial to ensure a secure and reliable case connection to maintain the overall performance and safety of the electronic device.

Output Current-Max is a parameter in electronic components that specifies the maximum amount of current that can be safely drawn from the output of the component without causing damage. It is an important specification to consider when designing circuits to ensure that the component can handle the required current without overheating or failing. Exceeding the maximum output current can lead to performance issues, component damage, or even complete failure of the circuit. It is crucial to adhere to the specified maximum output current to ensure the reliable operation of the electronic component and the overall circuit.

Rep Pk Reverse Voltage-Max refers to the maximum reverse voltage that an electronic component, such as a diode, can withstand during a specified period of time without failing. This parameter is crucial in determining the safe operating limits of components in circuits where reverse voltage conditions may occur. Exceeding this value can lead to breakdown or permanent damage to the component. It is typically expressed in volts and is a key specification in signal and power applications.

Non-rep Pk Forward Current-Max refers to the maximum forward current that a semiconductor device, such as a diode or LED, can handle in a pulsed or non-repetitive manner without being damaged. This parameter is essential for designers to ensure that the component operates reliably under specific conditions, particularly during transient events like switching or fault conditions. Exceeding this limit can lead to overheating or failure of the device.

Breakdown Voltage-Min, also known as minimum breakdown voltage, is a crucial parameter in electronic components, especially in devices like diodes, transistors, and capacitors. It refers to the minimum voltage at which the component experiences a breakdown and allows a significant current to flow through it. This breakdown voltage is a critical threshold beyond which the component may get damaged or exhibit unexpected behavior. Manufacturers specify this parameter to ensure that the component operates within safe limits and to help designers select the appropriate components for their circuit requirements. It is essential to consider the Breakdown Voltage-Min when designing circuits to prevent overloading or damaging the components.

Thermal Resistance @ Natural refers to the ability of an electronic component to dissipate heat under natural convection conditions without forced airflow. It is measured in degrees Celsius per watt and represents the temperature rise of the component above the ambient temperature for each watt of power dissipated. This parameter is crucial for understanding how effectively a component can manage heat during operation, ensuring reliability and performance. Manufacturers provide this value to help designers assess thermal management strategies in circuit designs.

Power Dissipation at Temperature Rise refers to the maximum amount of power an electronic component, such as a semiconductor or resistor, can dissipate while maintaining a specified increase in temperature above its ambient environment. This parameter is crucial for ensuring the reliability and longevity of components, as excessive heat can lead to failure. It is typically expressed in watts and is determined by the thermal characteristics of the component and its cooling mechanisms. Proper management of power dissipation is essential for optimal performance in electronic circuits.

In electronic components, the parameter "Diameter" typically refers to the measurement of the width of a circular component, such as a resistor, capacitor, or inductor. It is a crucial dimension that helps determine the physical size and fit of the component within a circuit or on a circuit board. The diameter is usually measured in millimeters (mm) or inches (in) and is important for ensuring proper placement and soldering of the component during assembly. Understanding the diameter of electronic components is essential for selecting the right size for a specific application and ensuring compatibility with other components and the overall design of the circuit.