LDC1614RGHT LDC: Pinout, Specification, and Datasheet
Tape & Reel (TR) Active 28 b b 1k k Special Purpose ADCs/DACs I2C 2.7V~3.6V V 16-WFQFN Exposed Pad Surface Mount









Tape & Reel (TR) Active 28 b b 1k k Special Purpose ADCs/DACs I2C 2.7V~3.6V V 16-WFQFN Exposed Pad Surface Mount
The LDC1614 is a 2- and 4-channel, 28-bit inductance to digital converter (LDC) for inductive sensing solutions.

LDC1614 used to detect position of two rings
LDC1614RGHT Pinout


LDC1614RGHT CAD Model
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LDC1614RGHT Description
With multiple channels and support for remote sensing, the LDC1614RGHT enables the performance and reliability benefits of inductive sensing to be realized at minimal cost and power. The products are easy to use, only requiring that the sensor frequency is within 1 kHz and 10 MHz to begin sensing. The wide 1 kHz to 10 MHz sensor frequency range also enables the use of very small PCB coils, further reducing sensing solution cost and size.
The high-resolution channels allow for a much larger sensing range, maintaining good performance beyond two coil diameters. Well-matched channels allow for differential and ratiometric measurements, which enable designers to use one channel to compensate their sensing for environmental and aging conditions such as temperature, humidity, and aging conditions such as temperature, humidity, and mechanical drift.
Given their ease of use, low power, and low system cost these products enable designers to greatly improve performance, reliability, and flexibility over existing sensing solutions and to introduce brand new sensing capabilities to products in all markets, especially consumer and industrial applications.
These devices are easily configured via an I2C interface. The four-channel LDC1614RGHT is available in a WQFN-16 package.
LDC1614RGHT Features
• Easy-to-use – minimal configuration required
• Measure up to 4 sensors with one IC
• Multiple channels support environmental and aging compensation
• Multi-channel remote sensing provides lowest system cost
• Pin-compatible medium and high-resolution options
– LDC1312/4: 2/4-ch 12-bit LDC
– LDC1612/4: 2/4-ch 28-bit LDC
• Sensing range beyond two coil diameters
• Supports wide sensor frequency range of 1kHz to 10MHz
• Power consumption:
– 35 µA Low Power Sleep Mode
– 200 nA Shutdown Mode
• 3.3V operation
• Support internal or external reference clock
• Immune to DC magnetic fields and magnets
LDC1614RGHT Applications
• Knobs in consumer, appliances, and automotive
• Linear and rotational encoders
• Buttons in home electronics, wearables, manufacturing, and automotive
• Keypads in manufacturing and appliances
• Slider buttons in consumer products
• Metal detection in industrial and automotive
• POS and EPOS
• Flow meters in consumer and appliances
Specifications
- TypeParameter
- Lifecycle Status
Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.
ACTIVE (Last Updated: 2 days ago) - Factory Lead Time6 Weeks
- Mount
In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.
Surface Mount - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
16-WFQFN Exposed Pad - Number of Pins16
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~125°C - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR) - JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e3 - Pbfree Code
The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.
yes - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
1 (Unlimited) - Number of Terminations16
- ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - TypeInductance-to-Digital Converter
- Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Matte Tin (Sn) - Voltage - Supply
Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.
2.7V~3.6V - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
QUAD - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
NO LEAD - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Number of Functions1
- Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
3.3V - Terminal Pitch
The center distance from one pole to the next.
0.5mm - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
NOT SPECIFIED - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
LDC1614 - Supply Voltage-Max (Vsup)
The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.
3.6V - Supply Voltage-Min (Vsup)
The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.
2.7V - Number of Channels4
- Supply Type
Supply Type in electronic components refers to the classification of power sources used to operate the component. It indicates whether the component requires DC or AC power, and if DC, specifies the voltage levels such as low, medium, or high. Different supply types can affect the performance, compatibility, and application of the component in electronic circuits. Understanding the supply type is crucial for proper component selection and integration into electronic designs.
Single - Data Interface
A Data Interface in EDQ is a template of a set of attributes representing a given entity, used to create processes that read from, or write to, interfaces rather than directly from or to sources or targets of data.
I2C - Sampling Rate
often described in the context of signal processing as the number of samples per time.
1 ksps - Sampling Rate (Per Second)
The sampling rate (per second) in electronic components refers to the frequency at which an analog signal is measured or sampled to convert it into a digital signal. It is typically expressed in Hertz (Hz) and indicates how many times per second the analog signal is sampled. A higher sampling rate allows for better representation of the original signal, capturing more detail and reducing distortion during the conversion process. In audio applications, for example, common sampling rates include 44.1 kHz for CD-quality audio and 48 kHz for video production.
1k - Voltage Supply Source
A voltage source is a two-terminal device which can maintain a fixed voltage. An ideal voltage source can maintain the fixed voltage independent of the load resistance or the output current. However, a real-world voltage source cannot supply unlimited current. A voltage source is the dual of a current source.
Single Supply - Resolution (Bits)
Resolution (Bits) in electronic components refers to the number of bits used to represent the analog signal in digital form. It indicates the level of detail or precision with which the analog signal can be converted into digital data. A higher resolution means more bits are used, allowing for finer distinctions to be made between different signal levels. For example, an 8-bit resolution can represent 256 different levels, while a 16-bit resolution can represent 65,536 levels. In general, a higher resolution leads to better accuracy and fidelity in the digital representation of the original analog signal.
28 b - Height800μm
- Length4mm
- Width4mm
- Thickness
Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.
750μm - REACH SVHC
The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.
No SVHC - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant - Lead Free
Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.
Lead Free
LDC1614RGHT Functional Block Diagram

LDC1614RGHT Simplified Schematic

Trend Analysis
Datasheet PDF
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
1.What are the ldc1312 and ldc1614 evaluation modules?
The LDC1312, LDC1314, LDC1612, and LDC1614 Evaluation Modules demonstrate the use of inductive sensing technology to sense and measure the presence, position, or composition of a conductive target object.
2.What are the channels of the ldc1612 and ldc1614?
The LDC1612 and LDC1614 are 2- and 4-channel, 28-bit inductance to digital converters (LDCs) for inductive sensing solutions. With multiple channels and support for remote sensing, the LDC1612 and LDC1614 enable the performance and reliability benefits of inductive sensing to be realized at minimal cost and power.
3.What kind of microcontroller is used for ldc1614?
The module includes two examples of PCB sensor coils that connect to the two channels of the LDC1312 or LDC1612 and four channels of the LDC1314 or LDC1614. An MSP430 microcontroller is used to interface the LDC to a host computer.
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