Si3865BDV Load Switch with Level-Shift: Datasheet, Pinout, Application
P-Channel 0.95mm PMIC SI3865 6 Pin 2.5V SOT-23-6 Thin, TSOT-23-6
The Si3865BDV includes a p- and n-channel MOSFET in a single TSOP-6 package. This article will unlock more details about Si3865, including its datasheet, pinout, application and so on. Welcome your RFQ!
Si3865BDV Pinout

Si3865BDV Pinout
Si3865BDV CAD Model
Symbol

Si3865BDV Symbol
Footprint

Si3865BDV Footprint
3D Model

SI3865 3D Model
Si3865BDV Description
The Si3865BDV includes a p- and n-channel MOSFET in a single TSOP-6 package. The low on-resistance p-channel TrenchFET® is tailored for use as a load switch. The n-channel, with an external resistor, can be used as a level shift to drive the p-channel load-switch. The n-channel MOSFET has internal ESD protection and can be driven by logic signals as low as 1.5 V. The Si3865BDV operates on supply lines from 1.8 V to 8 V and can drive loads up to 2.9 A.
The Si3865BDV is ideally suited for high-side load switching in portable applications. The integrated N-Channel level-shift device saves space by reducing external components. The slew rate is set externally so that rise times can be tailored to different load types.
Si3865BDV Feature
Halogen-free According to IEC 61249-2-21 Definition
60 mW Low RDS(on) TrenchFET®: 1.8 V Rated
1.8 V to 8 V Input
1.5 V to 8 V Logic Level Control
Low Profile, Small Footprint TSOP-6 Package
3000 V ESD Protection On Input Switch, VON/OFF
Adjustable Slew-Rate
Compliant to RoHS Directive 2002/95/EC
Si3865BDV Application
Ideally suited for high-side load switching in portable applications
Si3865BDV Application Circuit
The following figures show the Si3865BDV application circuit:

Si3865BDV Application Circuit
Si3865BDV Functional Block Diagram
The Si3865BDV Functional Block Diagram is given below:

SI3865BDV Functional Block Diagram
Specifications
- TypeParameter
- Mount
In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.
Surface Mount - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
SOT-23-6 Thin, TSOT-23-6 - Number of Pins6
- Number of Elements2
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-55°C~150°C TJ - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR) - Published2008
- JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e3 - Pbfree Code
The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.
yes - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Obsolete - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
1 (Unlimited) - Number of Terminations6
- ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - Resistance
Resistance is a fundamental property of electronic components that measures their opposition to the flow of electric current. It is denoted by the symbol "R" and is measured in ohms (Ω). Resistance is caused by the collisions of electrons with atoms in a material, which generates heat and reduces the flow of current. Components with higher resistance will impede the flow of current more than those with lower resistance. Resistance plays a crucial role in determining the behavior and functionality of electronic circuits, such as limiting current flow, voltage division, and controlling power dissipation.
175mOhm - Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Matte Tin (Sn) - Max Power Dissipation
The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.
830mW - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Number of Functions1
- Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
2.5V - Terminal Pitch
The center distance from one pole to the next.
0.95mm - Current Rating
Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.
2.9A - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
40 - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
SI3865 - Pin Count
a count of all of the component leads (or pins)
6 - Number of Outputs1
- Output Type
The "Output Type" parameter in electronic components refers to the type of signal or data that is produced by the component as an output. This parameter specifies the nature of the output signal, such as analog or digital, and can also include details about the voltage levels, current levels, frequency, and other characteristics of the output signal. Understanding the output type of a component is crucial for ensuring compatibility with other components in a circuit or system, as well as for determining how the output signal can be utilized or processed further. In summary, the output type parameter provides essential information about the nature of the signal that is generated by the electronic component as its output.
P-Channel - Supply Voltage-Max (Vsup)
The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.
8V - Interface
In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.
On/Off - Element Configuration
The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.
Dual - Output Configuration
Output Configuration in electronic components refers to the arrangement or setup of the output pins or terminals of a device. It defines how the output signals are structured and how they interact with external circuits or devices. The output configuration can determine the functionality and compatibility of the component in a circuit design. Common types of output configurations include single-ended, differential, open-drain, and push-pull configurations, each serving different purposes and applications in electronic systems. Understanding the output configuration of a component is crucial for proper integration and operation within a circuit.
High Side - Power Dissipation
the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.
830mW - Output Current
The rated output current is the maximum load current that a power supply can provide at a specified ambient temperature. A power supply can never provide more current that it's rated output current unless there is a fault, such as short circuit at the load.
2.9A - Switch Type
Based on their characteristics, there are basically three types of switches: Linear switches, tactile switches and clicky switches.
General Purpose - Drain to Source Voltage (Vdss)
The Drain to Source Voltage (Vdss) is a key parameter in electronic components, particularly in field-effect transistors (FETs) such as MOSFETs. It refers to the maximum voltage that can be applied between the drain and source terminals of the FET without causing damage to the component. Exceeding this voltage limit can lead to breakdown and potentially permanent damage to the device.Vdss is an important specification to consider when designing or selecting components for a circuit, as it determines the operating range and reliability of the FET. It is crucial to ensure that the Vdss rating of the component is higher than the maximum voltage expected in the circuit to prevent failures and ensure proper functionality.In summary, the Drain to Source Voltage (Vdss) is a critical parameter that defines the maximum voltage tolerance of a FET component and plays a significant role in determining the overall performance and reliability of electronic circuits.
8V - Continuous Drain Current (ID)
Continuous Drain Current (ID) is a key parameter in electronic components, particularly in field-effect transistors (FETs) such as MOSFETs. It refers to the maximum current that can flow continuously through the drain terminal of the FET without causing damage to the component. This parameter is crucial for determining the power handling capability of the FET and is specified by the manufacturer in the component's datasheet. Designers must ensure that the actual operating current does not exceed the specified Continuous Drain Current to prevent overheating and potential failure of the component.
2.9A - Ratio - Input:Output
The parameter "Ratio - Input:Output" in electronic components refers to the relationship between the input and output quantities of a device or system. It is a measure of how the input signal or energy is transformed or converted into the output signal or energy. This ratio is often expressed as a numerical value or percentage, indicating the efficiency or effectiveness of the component in converting the input to the desired output. A higher ratio typically signifies better performance or higher efficiency, while a lower ratio may indicate losses or inefficiencies in the conversion process. Understanding and optimizing the input-output ratio is crucial in designing and evaluating electronic components for various applications.
1:1 - Voltage - Load
Voltage - Load refers to the voltage across a load component in an electronic circuit when it is connected and operational. It represents the electrical potential difference that drives current through the load, which can be a resistor, motor, or other devices that consume electrical power. The voltage - load relationship is crucial for determining how much power the load will utilize and how it will affect the overall circuit performance. Properly managing voltage - load is essential for ensuring devices operate efficiently and safely within their specified limits.
1.8V~8V - Driver Number of Bits1
- Drain to Source Breakdown Voltage
Drain to Source Breakdown Voltage, often denoted as V(BR) D-S, is a critical parameter in electronic components, particularly in field-effect transistors (FETs) and metal-oxide-semiconductor FETs (MOSFETs). It represents the maximum voltage that can be applied between the drain and source terminals of the device without causing breakdown or permanent damage. Exceeding this voltage can lead to excessive current flow, resulting in thermal failure or destruction of the component. It is essential for ensuring reliable operation in circuit designs where high voltages may be encountered.
8V - Output Peak Current Limit-Nom
Output Peak Current Limit-Nom is a parameter in electronic components that specifies the maximum current that can be delivered by the output under normal operating conditions. This limit is typically set to protect the component from damage due to excessive current flow. It ensures that the component operates within its safe operating limits and prevents overheating or other potential issues. Designers and engineers use this parameter to ensure proper functioning and reliability of the electronic system in which the component is used.
1A - Rds On (Typ)
The parameter "Rds On (Typ)" in electronic components refers to the typical on-state resistance of a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) when it is fully conducting. This parameter indicates the resistance encountered by the current flowing through the MOSFET when it is in the on-state, which affects the power dissipation and efficiency of the component. A lower Rds On value indicates better conduction and lower power loss in the MOSFET. Designers often consider this parameter when selecting components for applications where minimizing power loss and maximizing efficiency are critical factors.
45m Ω - Drain to Source Resistance
The Drain to Source Resistance, often denoted as RDS(on), is a crucial parameter in electronic components, particularly in field-effect transistors (FETs) such as MOSFETs. It represents the resistance between the drain and source terminals when the FET is in its on-state, conducting current. A lower RDS(on) value indicates better conductivity and efficiency, as it results in less power dissipation and heat generation in the component. Designers often aim to minimize RDS(on) to improve the performance and overall efficiency of electronic circuits, especially in power applications where minimizing losses is critical.
60mOhm - Built-in Protections
Built-in protections in electronic components refer to the safety features and mechanisms that are integrated into the component to prevent damage or malfunction in various situations. These protections are designed to safeguard the component from overvoltage, overcurrent, overheating, short circuits, and other potential hazards that could occur during operation. By having built-in protections, electronic components can operate more reliably and safely, extending their lifespan and reducing the risk of failure. These protections are essential for ensuring the overall performance and longevity of electronic devices and systems.
TRANSIENT - Features
In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.
Slew Rate Controlled - Height990.6μm
- Length3.0988mm
- Width1.7018mm
- REACH SVHC
The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.
Unknown - Radiation Hardening
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
No - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant - Lead Free
Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.
Lead Free
Si3865BDV Manufacturer
Vishay's product portfolio is an unmatched collection of discrete semiconductors (diodes, MOSFETs, and optoelectronics) and passive components (resistors, inductors, and capacitors). These components are used in virtually all types of electronic devices and equipment in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, and medical markets. Vishay is proud to be a major partner with Digi-Key.
Datasheet PDF
- Datasheets :
- RohsStatement :
- PCN Obsolescence/ EOL :
Trend Analysis
What package does the Si3865BDV include a p- and n-channel MOSFET?
A single TSOP-6 package.
What is the low on-resistance p-channel designed for use as a load switch?
TrenchFET®.
What can be used as a level shift to drive the p-channel load-switch?
N-channel.
What is the Si3865BDV ideally suited for in portable applications?
High-side load switching.
What saves space by reducing external components?
N-Channel level-shift device.
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