LSM303DLHC Sensor: Pinout, Datasheet, Application

Sophie

Published: 13 August 2021 | Last Updated: 13 August 2021

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LSM303DLHC

LSM303DLHC

STMicroelectronics

STMICROELECTRONICS - LSM303DLHC - SENSOR, 3 CH, ACCEL, MAG, MOD, 14LGA

Purchase Guide

STMICROELECTRONICS - LSM303DLHC - SENSOR, 3 CH, ACCEL, MAG, MOD, 14LGA

LSM303DLHC, Pinout, Datasheet, Application

In this video I demonstrate the process of designing a pcb for the LSM303DLHC. This is not a super detailed video but just to give a general idea of the design process.

PCB Creator - Designing a board for the LSM303DLHC

LSM303DLHC Pinout

lsm303dlhc pinout.jpg

lsm303dlhc Pin Desription.jpg

LSM303DLHC CAD Model

Symbol

lsm303dlhc Symbol.jpg

Footprint

lsm303dlhc Footprint.jpg

LSM303DLHC Description

The LSM303DLHC is a system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor. It has The LSM303DLHC has linear acceleration full scales of ±2g / ±4g / ±8g / ±16g and a magnetic field full scale of ±1.3 / ±1.9 / ±2.5 / ±4.0 / ±4.7 / ±5.6 / ±8.1 gauss.


LSM303DLHC Features

· 3 magnetic field channels and 3 acceleration channels

· From ±1.3 to ±8.1 gauss magnetic field full scale

· ±2g/±4g/±8g/±16g linear acceleration full scale

· 16-bit data output

· I 2C serial interface

· Analog supply voltage 2.16 V to 3.6 V

· Power-down mode / low-power mode

· 2 independent programmable interrupt generators for free-fall and motion detection

· Embedded temperature sensor

· Embedded FIFO

· 6D/4D-orientation detection

· ECOPACK® RoHS and "Green" compliant


LSM303DLHC Block Diagram

lsm303dlhc Block Diagram.jpg

Specifications

STMicroelectronics LSM303DLHC technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics LSM303DLHC.
  • Type
    Parameter
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    14-VFLGA Module
  • Number of Pins
    14
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e4
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    14
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Nickel/Gold (Ni/Au)
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BUTT
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    225
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    2.5V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8mm
  • Depth

    In electronic components, "Depth" typically refers to the measurement of the distance from the front to the back of the component. It is an important parameter to consider when designing or selecting components for a project, as it determines how much space the component will occupy within a circuit or device. The depth of a component can impact the overall size and layout of the circuit board or enclosure in which it will be installed. It is usually specified in millimeters or inches and is crucial for ensuring proper fit and functionality within the intended application.

    3mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    30
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    LSM303
  • Pin Count

    a count of all of the component leads (or pins)

    14
  • Output Type

    The "Output Type" parameter in electronic components refers to the type of signal or data that is produced by the component as an output. This parameter specifies the nature of the output signal, such as analog or digital, and can also include details about the voltage levels, current levels, frequency, and other characteristics of the output signal. Understanding the output type of a component is crucial for ensuring compatibility with other components in a circuit or system, as well as for determining how the output signal can be utilized or processed further. In summary, the output type parameter provides essential information about the nature of the signal that is generated by the electronic component as its output.

    I2C
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    3.6V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    2.16V
  • Analog IC - Other Type

    Analog IC - Other Type is a parameter used to categorize electronic components that are integrated circuits (ICs) designed for analog signal processing but do not fall into more specific subcategories such as amplifiers, comparators, or voltage regulators. These ICs may include specialized analog functions such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), voltage references, or signal conditioning circuits. They are typically used in various applications where precise analog signal processing is required, such as in audio equipment, instrumentation, communication systems, and industrial control systems. Manufacturers provide detailed specifications for these components to help engineers select the most suitable IC for their specific design requirements.

    ANALOG CIRCUIT
  • Nominal Supply Current

    Nominal current is the same as the rated current. It is the current drawn by the motor while delivering rated mechanical output at its shaft.

    110μA
  • Resolution

    Resolution in electronic components refers to the smallest increment of measurement or change that can be detected or represented by the component. It is a crucial specification in devices such as sensors, displays, and converters, as it determines the level of detail or accuracy that can be achieved. For example, in a digital camera, resolution refers to the number of pixels that make up an image, with higher resolution indicating a greater level of detail. In analog-to-digital converters, resolution is the number of discrete values that can be represented in the digital output, determining the precision of the conversion process. Overall, resolution plays a significant role in determining the performance and capabilities of electronic components in various applications.

    2 B
  • Sensor Type

    In electronic components, the parameter "Sensor Type" refers to the specific type of sensor technology used in a particular component to detect and measure physical phenomena such as light, temperature, pressure, motion, or proximity. Different sensor types utilize various principles and mechanisms to convert the detected input into an electrical signal that can be processed by the electronic component. Common sensor types include photodiodes, thermistors, accelerometers, and proximity sensors, each designed for specific applications and environments. Understanding the sensor type is crucial for selecting the right component for a given task and ensuring accurate and reliable sensing capabilities in electronic systems.

    Accelerometer, Magnetometer, 6 Axis
  • Max Supply Voltage (DC)

    The parameter "Max Supply Voltage (DC)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. This specification is crucial for ensuring the reliable operation and longevity of the component within a given circuit. Exceeding the maximum supply voltage can lead to overheating, breakdown of internal components, or even permanent damage. It is important to carefully adhere to this specification when designing or using electronic circuits to prevent potential failures and ensure the safety of the components.

    3.3V
  • Min Supply Voltage (DC)

    The parameter "Min Supply Voltage (DC)" in electronic components refers to the minimum voltage level required for the component to operate properly. It indicates the lowest voltage that can be safely applied to the component without causing damage or malfunction. This parameter is crucial for ensuring the reliable and stable operation of the component within its specified operating range. It is important for designers and engineers to adhere to the specified minimum supply voltage to prevent potential issues such as erratic behavior, reduced performance, or permanent damage to the component.

    2.5V
  • Length
    5mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    1mm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
0 Similar Products Remaining

LSM303DLHC Application

· Tilt-compensated compasses

· Map rotation

· Position detection

· Motion-activated functions

· Free-fall detection

· Click/double-click recognition

· Pedometers

· Intelligent power-saving for handheld devices

· Display orientation

· Gaming and virtual reality input devices

· Impact recognition and logging

· Vibration monitoring and compensation


LSM303DLHC Functionality

  1. The LSM303DLHC is a system-in-package featuring a 3D digital linear acceleration and 3D digital magnetic field detection sensor.

  2. The LSM303DLHC features two data-ready signals (RDY) which indicate when a new set of measured acceleration data and magnetic data are available, therefore simplifying data synchronization in the digital system that uses the device.

  3. The LSM303DLHC may also be configured to generate a free-fall interrupt signal according to a programmed acceleration event along the enabled axes.


LSM303DLHC Package

 LSM303DLHC Dimensions.jpg      LSM303DLHC Package.jpg

LSM303DLHC Manufacture

STMicroelectronics is a global independent semiconductor company and is a leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence trends.

Popularity by Region

Frequently Asked Questions

What is LSM303DLHC?

The LSM303DLHC is a system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor. ... The system can be configured to generate interrupt signals by inertial wake-up/free-fall events as well as by the position of the device itself.

What acceleration operating mode does LSM303DLHC provide?

The LSM303DLHC provides two different acceleration operating modes: “normal mode” and “low-power mode”. While normal mode guarantees high resolution, low-power mode further reduces current consumption.
LSM303DLHC

STMicroelectronics

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