SST39SF020A 2 Mbit Multi-Purpose Flash: Pinout, Equivalent and Datasheet

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Published: 31 March 2022 | Last Updated: 31 March 2022

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SST39SF020A-70-4I-NHE

SST39SF020A-70-4I-NHE

Microchip Technology

5V V SST39 MPF™ 32 Pin Memory IC SST39 MPF™ Series SST39SF020A 2 Mb kb 14.05mm mm 25mA mA 8b b

Purchase Guide

5V V SST39 MPF™ 32 Pin Memory IC SST39 MPF™ Series SST39SF020A 2 Mb kb 14.05mm mm 25mA mA 8b b

The SST39SF020A is CMOS Multi-Purpose Flash (MPF) device manufactured with SST proprietary, high performance CMOS SuperFlash technology. The SST39SF020A writes (Program or Erase) with a 4.5-5.5V power supply, and conforms to JEDEC standard pinouts for x8 memories. Furthermore, Huge range of Semiconductors, Capacitors, Resistors and IcS in stock. Welcome RFQ.

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SST39SF020A Pinout

The following figure is the diagram of SST39SF020A Pinout.

Pinout.png

Pinout


SST39SF020A CAD Model

The followings are SST39SF020A Symbol, Footprint, and 3D Model.

Symbol.png

Symbol


Footprint.png

Footprint


3D Model.png

3D Model


SST39SF020A Overview

The SST39SF020A is CMOS Multi-Purpose Flash (MPF) manufactured with SST's proprietary, high performance CMOS SuperFlash technology. The split-gate cell design and thick oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The SST39SF020A device writes (Program or Erase) with a 4.5-5.5V power supply. The SST39SF020A device conforms to JEDEC standard pinouts for x8 memories. Featuring high performance Byte-Program, the SST39SF020A device provides a maximum Byte-Program time of 20 µsec. To meet high density, surface mount requirements, the SST39SF020A is offered in 32-lead PLCC package.

This article provides you with a basic overview of the SST39SF020A, including its pin descriptions, features and specifications, etc., to help you quickly understand what SST39SF020A is.


SST39SF020A Features

● Organized as 256K x8

● Single 4.5-5.5V Read and Write Operations

● Superior Reliability

   ◆ Endurance: 100,000 Cycles (typical)

   ◆ Greater than 100 years Data Retention

● Low Power Consumption (typical values at 14 MHz)

   ◆ Active Current: 10 mA (typical)

   ◆ Standby Current: 30 µA (typical)

● Sector-Erase Capability

   ◆ Uniform 4 KByte sectors

● Fast Read Access Time:

   ◆ 55 ns

   ◆ 70 ns

● Latched Address and Data

● Automatic Write Timing

   ◆ Internal VPP Generation

● Fast Erase and Byte-Program

   ◆ Sector-Erase Time: 18 ms (typical)

   ◆ Chip-Erase Time: 70 ms (typical)

   ◆ Byte-Program Time: 14 µs (typical)

   ◆ Chip Rewrite Time: 4 seconds (typical) for SST39SF020A

● End-of-Write Detection

   ◆ Toggle Bit

   ◆ Data# Polling

● TTL I/O Compatibility

● JEDEC Standard

   ◆ Flash EEPROM Pinouts and command sets

● Packages Available: 32-lead PLCC

● RoHS compliant


Specifications

Microchip Technology SST39SF020A-70-4I-NHE technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology SST39SF020A-70-4I-NHE.
  • Type
    Parameter
  • Factory Lead Time
    7 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    32-LCC (J-Lead)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    32
  • Memory Types
    Non-Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    SST39 MPF™
  • Published
    2000
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    32
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    3A991.B.1.A
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Matte Tin (Sn)
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    4.5V~5.5V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    245
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    5V
  • Terminal Pitch

    The center distance from one pole to the next.

    1.27mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    SST39SF020A
  • Pin Count

    a count of all of the component leads (or pins)

    32
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    5V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    5V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    2Mb 256K x 8
  • Nominal Supply Current

    Nominal current is the same as the rated current. It is the current drawn by the motor while delivering rated mechanical output at its shaft.

    25mA
  • Max Supply Current

    Max Supply Current refers to the maximum amount of electrical current that a component can draw from its power supply under normal operating conditions. It is a critical parameter that ensures the component operates reliably without exceeding its thermal limits or damaging internal circuitry. Exceeding this current can lead to overheating, performance degradation, or failure of the component. Understanding this parameter is essential for designing circuits that provide adequate power while avoiding overload situations.

    25mA
  • Access Time

    Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.

    70ns
  • Memory Format

    Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.

    FLASH
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    8b
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    256KX8
  • Write Cycle Time - Word, Page

    Write Cycle Time - Word, Page refers to the duration required to write data to a specific memory cell or a page of memory in electronic components, particularly in non-volatile memories like Flash or EEPROM. It indicates the time taken to complete a writing operation for a single word or an entire page of data. This parameter is crucial for determining the performance and speed of memory devices in applications where quick data storage is essential. It impacts the overall efficiency in data handling, affecting both read and write speeds in memory-related operations.

    20μs
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    18b
  • Density

    In electronic components, "Density" refers to the mass or weight of a material per unit volume. It is a physical property that indicates how tightly packed the atoms or molecules are within the material. The density of a component can affect its performance and characteristics, such as its strength, thermal conductivity, and electrical properties. Understanding the density of electronic components is important for designing and manufacturing processes to ensure optimal performance and reliability.

    2 Mb
  • Standby Current-Max

    Standby Current-Max refers to the maximum amount of current that an electronic component or device consumes while in a low-power standby mode. This parameter is critical for power management, especially in battery-operated devices, as it indicates how efficiently the device can conserve energy when not actively in use. A lower Standby Current-Max value is typically desirable, as it contributes to longer battery life and reduced energy consumption. Manufacturers specify this value to help engineers select components that meet specific power efficiency requirements in their designs.

    0.0001A
  • Sync/Async

    In the context of electronic components, the parameter "Sync/Async" refers to the synchronization mode of operation. Synchronous operation means that the component operates in coordination with an external clock signal. This ensures that data is transmitted or processed at specific intervals determined by the clock signal, allowing for precise timing and coordination between different components in a system.Asynchronous operation, on the other hand, means that the component does not rely on an external clock signal for its operation. Instead, it processes data at its own pace, which can lead to more flexibility but may also result in timing issues if not properly managed.The choice between synchronous and asynchronous operation depends on the specific requirements of the system and the desired level of coordination and timing precision.

    Asynchronous
  • Word Size

    Word "size" refers to the amount of data a CPU's internal data registers can hold and process at one time.

    8b
  • Programming Voltage

    A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

    5V
  • Data Polling

    Data Polling is a process used in electronic components to retrieve data at regular intervals from a sensor or device. It involves checking or querying the device for updated information, ensuring that the most current data is accessible for processing or analysis. This technique is commonly used in systems where continuous monitoring is necessary, allowing for timely responses based on the latest data collected. Data Polling can impact system performance, as it may introduce delays or consume resources depending on the polling frequency and the efficiency of the implemented protocol.

    YES
  • Toggle Bit

    The toggle bit is a control mechanism in electronic components that allows a circuit to switch between two states, typically representing binary values of 0 and 1. It is commonly used in digital systems to change the status of a device or memory cell each time it is activated. The toggle bit maintains its state until it receives a new signal that alters its value, making it essential for operations such as counters and flip-flops. This functionality enables efficient data storage, retrieval, and manipulation in various electronic applications.

    YES
  • Command User Interface

    The term "Command User Interface" in electronic components refers to the method by which a user interacts with a device or system through issuing commands. This interface allows users to input instructions or requests to control the operation of the electronic component. The Command User Interface can take various forms, such as physical buttons, touchscreens, voice commands, or software-based interfaces. It plays a crucial role in enabling users to interact with and utilize the functionalities of electronic components effectively. The design and implementation of a Command User Interface are essential considerations in ensuring user-friendly and intuitive operation of electronic devices.

    YES
  • Number of Sectors/Size
    64
  • Sector Size

    Sector size in electronic components refers to the minimum unit of data that can be read or written to the storage device, such as a hard drive or solid-state drive. It represents the smallest amount of data that can be accessed at a time within a storage device. The sector size is typically measured in bytes, with common sizes being 512 bytes or 4 kilobytes.Having a larger sector size can improve the efficiency of data storage and retrieval processes, as it reduces the overhead associated with accessing and managing smaller units of data. However, the choice of sector size can also impact the overall performance and compatibility of the storage device with different systems and applications. It is important to consider the sector size when configuring storage devices and optimizing data access speeds.

    4K
  • Height
    2.84mm
  • Length
    14.05mm
  • Width
    11.51mm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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SST39SF020A Functional Block Diagram

The following is the Functional Block Diagram of SST39SF020A.

Functional Block Diagram.png

Functional Block Diagram


SST39SF020A Equivalent

               Model number                    Manufacturer                                     Description
AM28F020-70JEBRochester Electronics LLCFlash, 256KX8, 70ns, PQCC32, PLASTIC, LCC-32
SST27SF020-70-3C-NHEGreenliant Systems LtdFlash Memory
SST39SF020A-70-4I-NHSilicon Storage TechnologyFlash, 256KX8, 70ns, PQCC32, PLASTIC, MS-016AE, LCC-32
MX28F2000PQC-70C4Macronix International Co LtdFlash, 256KX8, 70ns, PQCC32, PLASTIC, MO-052, LCC-32
M28F201-70K6STMicroelectronics256KX8 FLASH 12V PROM, 70ns, PQCC32, PLASTIC, LCC-32
AM28F020A-70JEAMDFlash, 256KX8, 70ns, PQCC32, PLASTIC, LCC-32
SST27SF020-70-3C-NHSilicon Storage TechnologyFlash, 256KX8, 70ns, PQCC32, PLASTIC, MO-016AE, LCC-32
AM28F020-70JIRochester Electronics LLCFlash, 256KX8, 70ns, PQCC32, PLASTIC, LCC-32


Parts with Similar Specs

The three parts on the right have similar specifications to Microchip Technology & SST39SF020A-70-4I-NHE.

SST39SF020A Applications

The SST39SF020A device is suited for applications that require convenient and economical updating of program, configuration, or data memory. For all system applications, they significantly improve performance and reliability, while lowering power consumption.


SST39SF020A Package

The following diagrams show the SST39SF020A Package.

Top View.png

Top View


Bottom View.png

Bottom View


Side View.png

Side View


SST39SF020A Manufacturer

Microchip Technology Inc. is a leading provider of microcontroller and analog semiconductors, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality.


Frequently Asked Questions

How many pins of SST39SF020A-70-4I-NHE?

32 Pins.

What’s the operating temperature of SST39SF020A-70-4I-NHE?

-40°C~85°C TA.

What is the essential property of the SST39SF020A?

The SST39SF020A is CMOS Multi-Purpose Flash (MPF) manufactured with SST's proprietary, high performance CMOS SuperFlash technology.
SST39SF020A-70-4I-NHE

Microchip Technology

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