What is MMBT3904?

Sophie

Published: 24 January 2022 | Last Updated: 24 January 2022

2135

MMBT3904VL

MMBT3904VL

Nexperia USA Inc.

MMBT3904/SOT23/TO-236AB

Purchase Guide

MMBT3904/SOT23/TO-236AB

MMBT3904 is an NPN switching transistor in a SOT23 plastic package. This article will unlock more details about MMBT3904, including its datasheet, pinout, feature, equivalents and so on... Welcome your RFQ!

This article is about consideration when switching from 2N3904 to MMBT3904

Consideration when switching from 2N3904 to MMBT3904 (2 Solutions!!)

MMBT3904 Pinout

MMBT3904VL Pinout.jpg

MMBT3904  Pinout

MMBT3904 CAD Model

Symbol

MMBT3904 Symbol.jpg

MMBT3904 Symbol

Footprint

MMBT3904 Footprint.jpg

MMBT3904 Footprint

3D Model

MMBT3904 3D Model.jpg

MMBT3904 3D Model

MMBT3904 Description

The collector and emitter of the MMBT3904 are open (reverse biased) when the base pin is at the ground and closed (forward-biased) when the base pin is provided with a signal. The amplification capability of the MMBT3904 is determined by its maximum gain of 300. Because the collector pin can only handle 200mA of current, this transistor cannot be used to connect loads that draw more than that. We must give current (Ib) to the base pin to bias the transistor, which should be limited to 5mA. A maximum of 200mA can flow through the collector and emitter when this transistor is fully biased. Its PNP complement: MMBT3906.

MMBT3904 Feature

  • Collector-Base Voltage (Vcb) is 60V

  • Collector-Emitter Voltage (Vce) is 40V

  • Emitter-Base Voltage (Veb) is 6 V

  • Collector Current is 200 mA

  • Collector Power Dissipation is 200mW

  • Junction Temperature is 150 ℃

  • Storage Temperature -55~+150 ℃


MMBT3904 Application

  • Drive modules, such as LED drive, relay drive, etc.

  • Amplifier modules, such as signal amplifiers, audio amplifiers, etc.

  • Vcb and Vce are very high, so they can be used to control voltage loads up to 40V


MMBT3904 Equivalent

The equivalent for MMBT3904:

BC636

BC639

BC549

2N3904

2N2222

2N3055

2N3906

2N2369

2SC5200

MMBT3904 Test Circuit

MMBT3904 Test Circuit.jpg

MMBT3904 Test Circuit

Specifications

Nexperia USA Inc. MMBT3904VL technical specifications, attributes, parameters and parts with similar specifications to Nexperia USA Inc. MMBT3904VL.
  • Type
    Parameter
  • Factory Lead Time
    4 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    TO-236-3, SC-59, SOT-23-3
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Transistor Element Material

    The "Transistor Element Material" parameter in electronic components refers to the material used to construct the transistor within the component. Transistors are semiconductor devices that amplify or switch electronic signals and are a fundamental building block in electronic circuits. The material used for the transistor element can significantly impact the performance and characteristics of the component. Common materials used for transistor elements include silicon, germanium, and gallium arsenide, each with its own unique properties and suitability for different applications. The choice of transistor element material is crucial in designing electronic components to meet specific performance requirements such as speed, power efficiency, and temperature tolerance.

    SILICON
  • Current-Collector (Ic) (Max)
    200mA
  • Number of Elements
    1
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    150°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Number of Terminations
    3
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Pin Count

    a count of all of the component leads (or pins)

    3
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PDSO-G3
  • Configuration

    The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

    SINGLE
  • Transistor Application

    In the context of electronic components, the parameter "Transistor Application" refers to the specific purpose or function for which a transistor is designed and used. Transistors are semiconductor devices that can amplify or switch electronic signals and are commonly used in various electronic circuits. The application of a transistor can vary widely depending on its design and characteristics, such as whether it is intended for audio amplification, digital logic, power control, or radio frequency applications. Understanding the transistor application is important for selecting the right type of transistor for a particular circuit or system to ensure optimal performance and functionality.

    SWITCHING
  • Polarity/Channel Type

    In electronic components, the parameter "Polarity/Channel Type" refers to the characteristic that determines the direction of current flow or the type of signal that can be accommodated by the component. For components like diodes and transistors, polarity indicates the direction in which current can flow through the component, such as forward bias or reverse bias for diodes. For components like MOSFETs or JFETs, the channel type refers to whether the component is an N-channel or P-channel device, which determines the type of charge carriers that carry current through the component. Understanding the polarity or channel type of a component is crucial for proper circuit design and ensuring that the component is connected correctly to achieve the desired functionality.

    NPN
  • Transistor Type

    Transistor type refers to the classification of transistors based on their operation and construction. The two primary types are bipolar junction transistors (BJTs) and field-effect transistors (FETs). BJTs use current to control the flow of current, while FETs utilize voltage to control current flow. Each type has its own subtypes, such as NPN and PNP for BJTs, and MOSFETs and JFETs for FETs, impacting their applications and characteristics in electronic circuits.

    NPN
  • DC Current Gain (hFE) (Min) @ Ic, Vce

    The parameter "DC Current Gain (hFE) (Min) @ Ic, Vce" in electronic components refers to the minimum value of the DC current gain, denoted as hFE, under specific operating conditions of collector current (Ic) and collector-emitter voltage (Vce). The DC current gain hFE represents the ratio of the collector current to the base current in a bipolar junction transistor (BJT), indicating the amplification capability of the transistor. The minimum hFE value at a given Ic and Vce helps determine the transistor's performance and efficiency in amplifying signals within a circuit. Designers use this parameter to ensure proper transistor selection and performance in various electronic applications.

    100 @ 10mA 1V
  • Current - Collector Cutoff (Max)

    The parameter "Current - Collector Cutoff (Max)" refers to the maximum current at which a transistor or other electronic component will cease to conduct current between the collector and emitter terminals. This parameter is important in determining the maximum current that can flow through the component when it is in the cutoff state. Exceeding this maximum cutoff current can lead to malfunction or damage of the component. It is typically specified in the component's datasheet and is crucial for proper circuit design and operation.

    50nA ICBO
  • JEDEC-95 Code

    JEDEC-95 Code is a standardized identification system used by the Joint Electron Device Engineering Council to categorize and describe semiconductor devices. This code provides a unique alphanumeric identifier for various memory components, ensuring consistency in documentation and communication across the electronics industry. The format includes information about the type, capacity, and technology of the device, facilitating easier specification and understanding for manufacturers and engineers.

    TO-236AB
  • Vce Saturation (Max) @ Ib, Ic

    The parameter "Vce Saturation (Max) @ Ib, Ic" in electronic components refers to the maximum voltage drop across the collector-emitter junction when the transistor is in saturation mode. This parameter is specified at a certain base current (Ib) and collector current (Ic) levels. It indicates the minimum voltage required to keep the transistor fully conducting in saturation mode, ensuring that the transistor operates efficiently and does not enter the cutoff region. Designers use this parameter to ensure proper transistor operation and to prevent overheating or damage to the component.

    300mV @ 5mA, 50mA
  • Voltage - Collector Emitter Breakdown (Max)

    Voltage - Collector Emitter Breakdown (Max) is a parameter that specifies the maximum voltage that can be applied between the collector and emitter terminals of a transistor or other semiconductor device before it breaks down and allows excessive current to flow. This parameter is crucial for ensuring the safe and reliable operation of the component within its specified limits. Exceeding the maximum breakdown voltage can lead to permanent damage or failure of the device. Designers and engineers must carefully consider this parameter when selecting components for their circuits to prevent potential issues and ensure proper functionality.

    40V
  • Transition Frequency

    Transition Frequency in electronic components refers to the frequency at which a device can transition from one state to another, typically defining the upper limit of its operating frequency. It is a critical parameter in determining the speed and performance of active components like transistors and integrated circuits. This frequency is influenced by factors such as capacitance, resistance, and the inherent characteristics of the materials used in the component's construction. Understanding transition frequency is essential for optimizing circuit designs and ensuring reliable signal processing in various applications.

    300MHz
  • Frequency - Transition

    The parameter "Frequency - Transition" in electronic components refers to the maximum frequency at which a signal transition can occur within the component. It is a crucial specification for digital circuits as it determines the speed at which data can be processed and transmitted. A higher frequency transition allows for faster operation and better performance of the electronic component. It is typically measured in hertz (Hz) or megahertz (MHz) and is specified by the manufacturer to ensure proper functioning of the component within a given frequency range.

    300MHz
  • Turn Off Time-Max (toff)

    The parameter "Turn Off Time-Max (toff)" in electronic components refers to the maximum time taken for a device to switch from an ON state to an OFF state. It is a crucial specification in devices such as transistors, diodes, and other semiconductor components that control the flow of current. The turn-off time is important for determining the switching speed and efficiency of a component, as a shorter turn-off time generally indicates faster operation and reduced power losses. Designers and engineers use this parameter to ensure proper functioning and performance of electronic circuits and systems.

    250ns
  • Turn On Time-Max (ton)

    Turn On Time-Max (ton) is a parameter in electronic components that refers to the maximum time it takes for a device to transition from an off state to an on state when a specific input signal is applied. This parameter is crucial in determining the speed and efficiency of the component in switching operations. A shorter turn-on time indicates faster response and better performance in applications where quick switching is required. It is typically specified in the component's datasheet and is important for designers to consider when selecting components for their circuits to ensure proper functionality and timing requirements are met.

    70ns
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
0 Similar Products Remaining

Parts with Similar Specs

MMBT3904 Package

MMBT3904 Package.jpg

MMBT3904 Package

MMBT3904 Manufacturer

Nexperia is a dedicated global leader in Discretes, Logic and MOSFETs devices. This new company became independent at the beginning of 2017. Focused on efficiency,  Nexperia produces consistently reliable semiconductor components at a high volume: 85 billion annually. The company’s extensive portfolio meets the stringent standards set by the Automotive industry. And industry-leading small packages, produced in their own manufacturing facilities, combine power and thermal efficiency with best-in-class quality levels. Built on over half a century of expertise,  Nexperia has 11,000 employees across Asia, Europe and the U.S. supporting customers globally.

 


Datasheet PDF

Download datasheets and manufacturer documentation for Nexperia USA Inc. MMBT3904VL.

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Frequently Asked Questions

What is a small signal surface mounted NPN transistor?

MMBT3904.

What is the maximum gain of MMBT3904?

300.

What is the typical voltage allowed to pass through the collector-emitter?

40V and 60V.

What is the stage called when the transistor is completely disconnected?

Cut-off region.
MMBT3904VL

Nexperia USA Inc.

In Stock: 3234000

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