Central Semiconductor Corp 2N4393 PBFREE

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

Power - Max is a parameter that specifies the maximum amount of power that an electronic component can handle without being damaged. It is typically measured in watts and indicates the upper limit of power that can be safely supplied to the component. Exceeding the maximum power rating can lead to overheating, malfunction, or permanent damage to the component. It is important to consider the power-max rating when designing circuits or systems to ensure proper operation and longevity of the electronic components.

"FET Type" refers to the type of Field-Effect Transistor (FET) being used in an electronic component. FETs are three-terminal semiconductor devices that can be classified into different types based on their construction and operation. The main types of FETs include Metal-Oxide-Semiconductor FETs (MOSFETs), Junction FETs (JFETs), and Insulated-Gate Bipolar Transistors (IGBTs).Each type of FET has its own unique characteristics and applications. MOSFETs are commonly used in digital circuits due to their high input impedance and low power consumption. JFETs are often used in low-noise amplifiers and switching circuits. IGBTs combine the high input impedance of MOSFETs with the high current-carrying capability of bipolar transistors, making them suitable for high-power applications like motor control and power inverters.When selecting an electronic component, understanding the FET type is crucial as it determines the device's performance and suitability for a specific application. It is important to consider factors such as voltage ratings, current handling capabilities, switching speeds, and power dissipation when choosing the right FET type for a particular circuit design.

The parameter "Input Capacitance (Ciss) (Max) @ Vds" in electronic components refers to the maximum input capacitance measured at a specific drain-source voltage (Vds). Input capacitance is a crucial parameter in field-effect transistors (FETs) and power MOSFETs, as it represents the total capacitance at the input terminal of the device. This capacitance affects the device's switching speed and overall performance, as it influences the time required for charging and discharging during operation. Manufacturers provide this parameter to help designers understand the device's input characteristics and make informed decisions when integrating it into a circuit.

The parameter "Current - Drain (Idss) @ Vds (Vgs=0)" in electronic components refers to the maximum drain current that flows through the device when the gate-source voltage (Vgs) is zero. This parameter is typically specified for field-effect transistors (FETs) and is an important characteristic that indicates the device's maximum current-carrying capacity in the off state. It helps in determining the saturation current of the FET and is crucial for designing circuits where high current handling capability is required. Manufacturers provide this parameter in the datasheet of the component to assist engineers and designers in selecting the appropriate component for their applications.

Voltage - Cutoff (VGS off) @ Id refers to the gate-source voltage at which a field-effect transistor (FET) or similar device ceases to conduct, effectively turning it off. This parameter indicates the threshold voltage that separates the conducting state from the cutoff state for a specified drain current (Id). It is crucial for determining the operating characteristics of the device in various applications, ensuring efficient switching and control in electronic circuits.

Voltage - Breakdown (V(BR)GSS) is a parameter used to describe the maximum gate-source voltage that can be applied to a field-effect transistor (FET) without causing a breakdown in the gate-source junction. This parameter is crucial in determining the safe operating limits of the FET and helps prevent damage to the component. When the gate-source voltage exceeds the breakdown voltage, it can lead to a sudden increase in current flow and potentially damage the FET. Therefore, understanding and adhering to the specified V(BR)GSS value is essential for proper functioning and reliability of electronic circuits utilizing FETs.

Resistance - RDS(On) refers to the on-state resistance of a MOSFET when it is fully turned on. It is a critical parameter that indicates the resistance between the drain and source terminals of the device in the conducting state. Lower RDS(On) values result in reduced power loss and heat generation during operation, making it an important specification for efficiency in electronic circuits. It is typically measured in ohms and is a key consideration in the selection of transistors for power applications.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.