

Central Semiconductor Corp 2N489A
Manufacturer No:
2N489A
Tiny WHSLManufacturer:
Utmel No:
420-2N489A
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-
Description:
Description: Unijunction Transistor
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- TypeParameter
- Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
NO - Number of Terminals3
- Transistor Element Material
The "Transistor Element Material" parameter in electronic components refers to the material used to construct the transistor within the component. Transistors are semiconductor devices that amplify or switch electronic signals and are a fundamental building block in electronic circuits. The material used for the transistor element can significantly impact the performance and characteristics of the component. Common materials used for transistor elements include silicon, germanium, and gallium arsenide, each with its own unique properties and suitability for different applications. The choice of transistor element material is crucial in designing electronic components to meet specific performance requirements such as speed, power efficiency, and temperature tolerance.
SILICON - Rohs CodeNo
- Part Life Cycle CodeObsolete
- Ihs ManufacturerCENTRAL SEMICONDUCTOR CORP
- Package DescriptionCYLINDRICAL, O-MBCY-W3
- Number of Elements1
- Operating Temperature-Max140 °C
- Operating Temperature-Min-65 °C
- Package Body MaterialMETAL
- Package ShapeROUND
- Package StyleCYLINDRICAL
- JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e0 - ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Tin/Lead (Sn/Pb) - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
BOTTOM - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
WIRE - Reach Compliance Code
Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.
unknown - JESD-30 Code
JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.
O-MBCY-W3 - Configuration
The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.
SINGLE - Transistor Application
In the context of electronic components, the parameter "Transistor Application" refers to the specific purpose or function for which a transistor is designed and used. Transistors are semiconductor devices that can amplify or switch electronic signals and are commonly used in various electronic circuits. The application of a transistor can vary widely depending on its design and characteristics, such as whether it is intended for audio amplification, digital logic, power control, or radio frequency applications. Understanding the transistor application is important for selecting the right type of transistor for a particular circuit or system to ensure optimal performance and functionality.
SWITCHING - JEDEC-95 Code
JEDEC-95 Code is a standardized identification system used by the Joint Electron Device Engineering Council to categorize and describe semiconductor devices. This code provides a unique alphanumeric identifier for various memory components, ensuring consistency in documentation and communication across the electronics industry. The format includes information about the type, capacity, and technology of the device, facilitating easier specification and understanding for manufacturers and engineers.
TO-5 - Power Dissipation-Max (Abs)
Power Dissipation-Max (Abs) refers to the maximum amount of power that an electronic component can dissipate without undergoing thermal damage or degradation. This value is crucial for ensuring reliable operation, as exceeding it can result in overheating and failure. It is typically specified in watts and serves as a critical parameter for designers to determine proper heat management strategies in circuits. Properly managing the power dissipation is essential for the longevity and performance of electronic devices.
0.45 W - Inter-base Voltage-Max
Inter-base Voltage-Max is a parameter that refers to the maximum voltage that can be applied between the base terminals of a bipolar junction transistor (BJT) without causing damage to the component. In a BJT, the base terminal is crucial for controlling the flow of current between the emitter and collector terminals. Exceeding the specified Inter-base Voltage-Max can lead to breakdown of the base-emitter junction, potentially causing the transistor to malfunction or fail. It is important to adhere to this parameter to ensure the reliable operation and longevity of the electronic component.
65 V - Intrinsic Stand-off Ratio-Max
Intrinsic Stand-off Ratio-Max is a parameter in electronic components that indicates the maximum allowable distance between the component and a substrate or another surface while maintaining effective electrical performance. It is crucial for ensuring proper signal integrity and functionality in applications where components are mounted at varying heights. This ratio is typically defined as the ratio of the component height to the lateral distance from the edge of the component to the nearest conductive surface, influencing design decisions in circuit board layout and packaging.
0.62 - Intrinsic Stand-off Ratio-Min
The parameter "Intrinsic Stand-off Ratio-Min" in electronic components refers to the minimum ratio of the breakdown voltage to the working voltage of a device. It is a crucial specification that indicates the ability of the component to withstand voltage spikes or surges without failing. A higher intrinsic stand-off ratio-min value means that the component can handle higher voltage levels safely. Designers use this parameter to ensure the reliability and durability of electronic circuits in various applications. It is important to consider this specification when selecting components for systems that may be exposed to voltage fluctuations or transient events.
0.51 - Static Inter-base Res-Max
Static Inter-base Res-Max refers to the maximum allowable resistance between the inter-base connections of a transistor or other electronic component. It is a critical parameter that affects the transistor's performance, particularly in terms of gain and input impedance. High values of this resistance can lead to increased noise and reduced stability in circuit operation. This specification ensures that the component operates reliably within designed electrical conditions.
6.8 kΩ - Static Inter-base Res-Min
Static Inter-base Res-Min is a parameter in electronic components that refers to the minimum resistance between two base terminals in a device, such as a transistor or integrated circuit. This parameter is important for ensuring proper functionality and performance of the component, as it determines the level of isolation between the base terminals. A lower Static Inter-base Res-Min value indicates better isolation and less interference between the base terminals, which is crucial for maintaining signal integrity and preventing cross-talk in electronic circuits. Designers and engineers use this parameter to select components that meet the required specifications for their specific application.
4.7 kΩ - Valley Point Current-Min
"Valley Point Current-Min" is a parameter used in electronic components, particularly in semiconductor devices like diodes and transistors. It refers to the minimum current level at which the device transitions from the valley point to the peak point in its current-voltage characteristic curve. The valley point is the point at which the device starts conducting current, and the peak point is the maximum current level it can handle before breakdown.Understanding the Valley Point Current-Min is important for determining the operating conditions and limitations of the component. It helps in ensuring that the device is not operated beyond its specified current rating to prevent damage or failure. Manufacturers provide this parameter in the component datasheet to guide engineers and designers in selecting the appropriate component for their circuit design.
8 mA - Emitter Current-Max
Emitter Current-Max, also known as maximum emitter current, is a key parameter in electronic components, particularly in transistors. It refers to the maximum amount of current that can flow through the emitter terminal of the transistor without causing damage to the component. Exceeding this specified current limit can lead to overheating and potential failure of the transistor. It is important to consider the Emitter Current-Max value when designing circuits to ensure proper operation and reliability of the electronic components.
70 mA - Peak Point Current-Max
Peak Point Current-Max is a parameter used to specify the maximum current that an electronic component can handle at its peak point without causing damage. This parameter is crucial for ensuring the reliability and longevity of the component in high-current applications. It helps designers and engineers determine the safe operating limits of the component to prevent overheating and potential failure. Understanding the Peak Point Current-Max value is essential for selecting the right component for a specific application to ensure optimal performance and safety.
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