Littelfuse Inc. TCR22-6AP
Littelfuse Inc. TCR22-6AP
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Littelfuse Inc. TCR22-6AP

Manufacturer No:

TCR22-6AP

Manufacturer:

Littelfuse Inc.

Utmel No:

1475-TCR22-6AP

Package:

TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

ECAD Model:

Description:

SCR Sensitive Gate -40°C~110°C 1.5V-On State (Vtm) (Max) 1μA-Current - Off State (Max) 3-Termination Tape & Box (TB) TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Through Hole

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Unit Price: $0.595157

Ext Price: $0.60

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In Stock : 37

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TCR22-6AP information

Specifications
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Product Details
Littelfuse Inc. TCR22-6AP technical specifications, attributes, parameters and parts with similar specifications to Littelfuse Inc. TCR22-6AP.
  • Type
    Parameter
  • Factory Lead Time
    19 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Through Hole
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Through Hole
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
  • Number of Elements
    1
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~110°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Box (TB)
  • Published
    2004
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    no
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    3
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    MATTE TIN
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8541.30.00.80
  • Voltage - Rated DC

    Voltage - Rated DC is a parameter that specifies the maximum direct current (DC) voltage that an electronic component can safely handle without being damaged. This rating is crucial for ensuring the proper functioning and longevity of the component in a circuit. Exceeding the rated DC voltage can lead to overheating, breakdown, or even permanent damage to the component. It is important to carefully consider this parameter when designing or selecting components for a circuit to prevent any potential issues related to voltage overload.

    400V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    WIRE
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    unknown
  • Current Rating

    Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

    1.5A
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    10
  • Pin Count

    a count of all of the component leads (or pins)

    3
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    O-PBCY-W3
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Configuration

    The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

    SINGLE
  • RMS Current (Irms)

    RMS Current (Irms) refers to the Root Mean Square value of the alternating current flowing through an electronic component or circuit. It is a measure of the effective current that produces the same heating effect as the equivalent DC current. In AC circuits, the current continuously changes direction, so using the RMS value helps in calculating power dissipation and determining the component's capability to handle the current without overheating. RMS Current is crucial in selecting components like resistors, capacitors, and inductors to ensure they can safely operate within their specified current ratings.

    1.5A
  • Hold Current

    the minimum current which must pass through a circuit in order for it to remain in the 'ON' state.

    5mA
  • Trigger Device Type

    Trigger Device Type is a parameter in electronic components that refers to the type of device or mechanism used to initiate a specific action or function within the component. This parameter specifies the specific trigger device, such as a sensor, switch, or signal input, that is required to activate or control the operation of the component. Understanding the trigger device type is crucial for proper integration and operation of the electronic component within a larger system or circuit. By specifying the appropriate trigger device type, engineers and designers can ensure that the component functions correctly and responds to the intended input signals or conditions.

    SCR
  • Voltage - Gate Trigger (Vgt) (Max)

    Voltage - Gate Trigger (Vgt) (Max) refers to the maximum voltage level required to trigger the gate of a semiconductor device, such as a thyristor or triac, into the conductive state. When the gate receives this voltage, it initiates the device's conduction, allowing current to flow between its anode and cathode. Exceeding this voltage can lead to unwanted behavior or damage to the component, making it a critical parameter in designing circuits that utilize these devices. Understanding Vgt is essential for ensuring proper operation and reliability in electronic applications.

    800mV
  • Current - Non Rep. Surge 50, 60Hz (Itsm)

    The parameter "Current - Non Rep. Surge 50, 60Hz (Itsm)" in electronic components refers to the maximum non-repetitive surge current that a component can withstand without damage during a single surge event at frequencies of 50Hz or 60Hz. This parameter is important for assessing the robustness and reliability of the component in handling sudden spikes or surges in current that may occur in the electrical system. It helps in determining the level of protection needed for the component to ensure its longevity and proper functioning in various operating conditions. Manufacturers provide this specification to guide engineers and designers in selecting the appropriate components for their applications based on the expected surge current levels.

    16A 20A
  • Current - Gate Trigger (Igt) (Max)

    Current - Gate Trigger (Igt) (Max) refers to the maximum gate trigger current required to activate a semiconductor device, such as a thyristor or triac. It is the minimum current that must flow into the gate terminal to ensure that the device turns on and conducts current between its anode and cathode. Exceeding this value can lead to unnecessary power consumption, while insufficient current may prevent the device from turning on effectively. This parameter is crucial for circuit design, as it influences the selection of gate driving circuits.

    200μA
  • Current - Hold (Ih) (Max)

    The parameter "Current - Hold (Ih) (Max)" in electronic components refers to the maximum current required to maintain the component in a latched or on-state after it has been triggered. This parameter is commonly associated with relays, switches, and other devices that have a latching function. It is important because it determines the minimum current that must be supplied to keep the component in its activated state, ensuring reliable operation. Exceeding the maximum Ih value can lead to the component failing to hold its state, potentially causing malfunctions or disruptions in the circuit.

    5mA
  • Leakage Current (Max)

    Leakage Current (Max) is a parameter that specifies the maximum amount of current that can flow through an electronic component when it is in an off state. It represents the amount of current that leaks through the component due to imperfections in its insulation or semiconductor materials. Excessive leakage current can lead to power loss, reduced efficiency, and potential reliability issues in electronic circuits. Manufacturers provide this specification to help designers ensure that the leakage current does not exceed acceptable limits for the intended application. It is typically measured in microamps (μA) or nanoamps (nA) and is an important consideration in low-power and high-precision electronic designs.

    0.1mA
  • Current - On State (It (AV)) (Max)

    The parameter "Current - On State (It (AV)) (Max)" in electronic components refers to the maximum average current that a component, typically a switch or semiconductor device, can handle while in the 'on' state without overheating or failing. This rating is crucial for ensuring reliable operation in circuits where the component is subjected to continuous current flow. Exceeding this maximum value can lead to damage or malfunction, so it is important for designers to consider it when selecting components for their applications.

    950mA
  • Non-Repetitive Pk On-state Cur

    Non-Repetitive Pk On-state Current, often abbreviated as Non-Repetitive Pk On-state Cur, is a parameter that defines the maximum current that a semiconductor device, such as a thyristor or triac, can withstand for a short duration without sustaining damage. This current level is typically specified under particular conditions and is meant to represent transient events rather than continuous operation. It indicates the device's ability to handle sudden surges in current, which may occur due to load changes or fault conditions, while ensuring that the component does not suffer thermal or electrical breakdown during this brief period.

    20 A
  • SCR Type

    SCR Type refers to a category of semiconductor devices specifically designed to control and manage electrical energy in electronic circuits. It stands for Silicon Controlled Rectifier, which is a type of thyristor that can switch and control voltage and current flow. SCRs are commonly used in applications such as motor control, power regulation, and lighting control due to their ability to handle high power loads. The SCR Type includes variations like standard SCRs, gate turn-off thyristors, and triacs, each serving specific purposes in power electronics.

    Sensitive Gate
  • Voltage - On State (Vtm) (Max)

    The parameter "Voltage - On State (Vtm) (Max)" refers to the maximum voltage drop across a semiconductor device when it is in the on state and conducting current. It is a critical specification for devices such as transistors, diodes, and thyristors, as it affects the overall power loss and efficiency of the component during operation. A lower Vtm value indicates better efficiency, as it leads to reduced power dissipation in the form of heat. This parameter is essential for engineers to consider when designing circuits that require low voltage drops for optimal performance.

    1.5V
  • Critical Rate of Rise of Off-State Voltage-Min

    The parameter "Critical Rate of Rise of Off-State Voltage-Min" in electronic components refers to the minimum rate at which the off-state voltage of a device must rise in order to trigger a critical event, such as a breakdown or failure. This parameter is crucial for ensuring the reliable operation of the component under various conditions. It helps determine the maximum allowable rate of voltage increase that the component can withstand without experiencing detrimental effects. Manufacturers specify this parameter to guide engineers and designers in selecting and using the component within its safe operating limits to prevent damage or malfunction. Understanding and adhering to this parameter is essential for maintaining the performance and longevity of electronic devices.

    40V/us
  • Current - Off State (Max)

    The parameter "Current - Off State (Max)" refers to the maximum current that can flow through an electronic component when it is in the off state, typically when the component is not conducting electricity. This specification is important for components such as transistors, diodes, and switches, as it indicates the maximum leakage current that can occur when the component is supposed to be non-conductive. Exceeding this maximum off-state current can lead to unintended power consumption, overheating, or malfunction of the component. Designers need to consider this parameter to ensure proper functioning and reliability of the electronic circuit.

    1μA
  • Circuit Commutated Turn-off Time-Nom

    The parameter "Circuit Commutated Turn-off Time-Nom" in electronic components refers to the nominal time it takes for a circuit to turn off after being commutated. Commutation is the process of transferring current from one circuit to another. This parameter is crucial in power electronics, especially in devices like thyristors and other semiconductor switches, as it affects the efficiency and performance of the circuit. A shorter turn-off time typically indicates faster switching speeds and better overall performance of the electronic component. Manufacturers provide this specification to help engineers and designers select the appropriate components for their specific applications.

    50 μs
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Download datasheets and manufacturer documentation for Littelfuse Inc. TCR22-6AP.

TCR22-6AP Overview

Despite its direction, the RMS current (Irms) describes the average strength of the current.Holding current (hypostatic) for electrical, electromagnetic, and electronic devices is the minimum current passing through a circuit in order for it to remain in an "ON" state.Insulation effectiveness can be measured by leakage current, with a maximal leakage current of 0.1mA.

TCR22-6AP Features

its RMS current (Irms) is 1.5A
its current can be 5mA
its maximal leakage current can be 0.1mA

TCR22-6AP Applications

There are a lot of Littelfuse Inc.
TCR22-6AP applications of SCRs thyristors.


  • DC motor control and drives
  • Battery charges
  • Welders
  • Power converters
  • Lighting control
  • Heat and temperature control
  • Motor starters
  • DC motor controls - AC motor controls
  • Uninterruptable power supplies
  • Wind mill
TCR22-6AP Relevant information

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