Microchip JANTX1N4959US

Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

"Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the parameter "Size / Dimension" refers to the physical dimensions of the component, such as its length, width, and height. These dimensions are crucial for determining how the component will fit into a circuit or system, as well as for ensuring compatibility with other components and the overall design requirements. The size of a component can also impact its performance characteristics, thermal properties, and overall functionality within a given application. Engineers and designers must carefully consider the size and dimensions of electronic components to ensure proper integration and functionality within their designs.

In electronic components, "tolerance" refers to the acceptable deviation or variation from the specified or ideal value of a particular parameter, such as resistance, capacitance, or voltage. It indicates the range within which the actual value of the component can fluctuate while still being considered acceptable for use in a circuit. Tolerance is typically expressed as a percentage or a specific value and is important for ensuring the accuracy and reliability of electronic devices. Components with tighter tolerances are more precise but may also be more expensive. It is crucial to consider tolerance when selecting components to ensure proper functionality and performance of the circuit.

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

Resistance is a fundamental property of electronic components that measures their opposition to the flow of electric current. It is denoted by the symbol "R" and is measured in ohms (Ω). Resistance is caused by the collisions of electrons with atoms in a material, which generates heat and reduces the flow of current. Components with higher resistance will impede the flow of current more than those with lower resistance. Resistance plays a crucial role in determining the behavior and functionality of electronic circuits, such as limiting current flow, voltage division, and controlling power dissipation.

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

Parameter "Composition" in electronic components refers to the specific materials and substances used in the construction of the component. It encompasses the chemical and physical elements that make up the component, influencing its electrical, thermal, and mechanical properties. The composition can affect the performance, reliability, and durability of the component in various applications. Understanding the composition is essential for optimizing the design and functionality of electronic devices.

The parameter "Power (Watts)" in electronic components refers to the amount of electrical energy consumed or dissipated by the component. It is a measure of how much energy the component can handle or generate. Power is typically measured in watts, which is a unit of power that indicates the rate at which energy is transferred. Understanding the power rating of electronic components is crucial for ensuring they operate within their specified limits to prevent overheating and potential damage. It is important to consider power requirements when designing circuits or selecting components to ensure proper functionality and reliability.

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

"Termination style" in electronic components refers to the method used to connect the component to a circuit board or other electronic devices. It determines how the component's leads or terminals are designed for soldering or mounting onto the circuit board. Common termination styles include through-hole, surface mount, and wire lead terminations.Through-hole components have leads that are inserted through holes in the circuit board and soldered on the other side. Surface mount components have flat terminals that are soldered directly onto the surface of the circuit board. Wire lead terminations involve attaching wires to the component for connection.The choice of termination style depends on factors such as the type of component, the manufacturing process, and the space available on the circuit board. Different termination styles offer various advantages in terms of ease of assembly, reliability, and space efficiency in electronic designs.

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Current - Reverse Leakage @ Vr is a parameter that describes the amount of current that flows in the reverse direction through a diode or other semiconductor component when a reverse voltage (Vr) is applied across it. This leakage current is typically very small, but it is important to consider in electronic circuits as it can affect the overall performance and reliability of the component. The reverse leakage current is influenced by factors such as the material properties of the semiconductor, temperature, and the magnitude of the reverse voltage applied. Manufacturers provide this parameter in datasheets to help engineers and designers understand the behavior of the component in reverse bias conditions.

The parameter "Voltage - Forward (Vf) (Max) @ If" refers to the maximum voltage drop across a diode when it is forward-biased and conducting a specified forward current (If). It indicates the maximum potential difference the diode can withstand while allowing current to flow in the forward direction without breaking down. This value is crucial for designing circuits as it helps determine how much voltage will be lost across the diode during operation. Higher Vf values can lead to reduced efficiency in power applications, making this parameter essential for optimizing circuit performance.

Power - Max is a parameter that specifies the maximum amount of power that an electronic component can handle without being damaged. It is typically measured in watts and indicates the upper limit of power that can be safely supplied to the component. Exceeding the maximum power rating can lead to overheating, malfunction, or permanent damage to the component. It is important to consider the power-max rating when designing circuits or systems to ensure proper operation and longevity of the electronic components.

Max Reverse Leakage Current refers to the maximum amount of current that can flow through a semiconductor device, such as a diode or transistor, when it is reverse biased. This current is an important parameter as it indicates the level of unintended current that can flow when the device is not conducting in the forward direction. High values of reverse leakage current can lead to power loss, reduced efficiency, and may affect the performance and reliability of electronic circuits. It is particularly critical in applications where precise current control and low power consumption are necessary.

Test Current refers to a specified amount of electrical current applied to an electronic component during testing to evaluate its performance and characteristics. This current is typically defined by manufacturers to ensure that the component operates within its designed parameters. By measuring how the component reacts to this test current, engineers can determine its reliability, efficiency, and suitability for specific applications.

The parameter "Voltage - Zener (Nom) (Vz)" refers to the nominal voltage of a Zener diode, which is a type of semiconductor device that allows current to flow in the reverse direction when a certain voltage threshold is reached. The Zener voltage, denoted as Vz, is the voltage at which the Zener diode begins to conduct in the reverse direction. This parameter is crucial in determining the specific voltage regulation characteristics of the Zener diode in a circuit. It is important to select a Zener diode with a Vz value that matches the desired voltage regulation requirements of the circuit to ensure proper functionality.

The Zener voltage is a crucial parameter in Zener diodes, which are specialized semiconductor devices designed to maintain a constant voltage across their terminals when operated in the reverse-biased mode. The Zener voltage, also known as the breakdown voltage, is the voltage at which the Zener diode starts conducting in the reverse direction. This voltage is carefully controlled during the manufacturing process and is a key characteristic that determines the diode's functionality in voltage regulation and protection circuits. Zener diodes are commonly used in various electronic applications to stabilize voltage levels and protect sensitive components from voltage spikes.

a group of products which fulfill a similar need for a market segment or market as a whole.

The voltage tolerance level for the electrical auxiliaries is defined by the standard. The maximum and minimum nominal voltages are defined by the tolerance level.

Zener/Breakdown Voltage – The Zener or the reverse breakdown voltage?ranges from 2.4 V to 2 V, sometimes it can go up to 1 kV while the maximum for the surface-mounted device is 47 V. ... It is given by the product of the voltage of the diode and the current flowing through it.

In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

a particular group of related products.

Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.