Microchip JANTX1N5519BUR-1
Microchip JANTX1N5519BUR-1
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Microchip JANTX1N5519BUR-1

Manufacturer No:

JANTX1N5519BUR-1

Manufacturer:

Microchip

Utmel No:

1610-JANTX1N5519BUR-1

Package:

DO-213AA-2

ECAD Model:

Description:

±5% 3.6 V 3 µA @ 1 V -65°C ~ 175°C 500 mW DO-213AA-2

Quantity:

Unit Price: $12.744716

Ext Price: $12.74

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In Stock : 24

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $12.744716

    $12.74

  • 10

    $12.023317

    $120.23

  • 100

    $11.342752

    $1,134.28

  • 500

    $10.700709

    $5,350.35

  • 1000

    $10.095009

    $10,095.01

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JANTX1N5519BUR-1 information

Specifications
Product Details
Microchip JANTX1N5519BUR-1 technical specifications, attributes, parameters and parts with similar specifications to Microchip JANTX1N5519BUR-1.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    Production (Last Updated: 2 months ago)
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    DO-213AA-2
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Number of Pins
    2
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    DO-213AA
  • Manufacturer
    Miscellaneous
  • Zz - Zener Impedance
    24 Ohms
  • Pd - Power Dissipation
    500 mW
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 175 C
  • Unit Weight
    0.001411 oz
  • Minimum Operating Temperature
    - 65 C
  • Factory Pack QuantityFactory Pack Quantity
    1
  • Mounting Styles
    SMD/SMT
  • Brand
    Microchip / Microsemi
  • Vz - Zener Voltage
    3.6 V
  • RoHS
    N
  • Voltage Temperature Coefficient
    -
  • Package
    Bulk
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    1N5519
  • Impedance (Max) (Zzt)
    24 Ohms
  • Mfr
    Microchip Technology
  • Product Status
    Active
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -65°C ~ 175°C
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Military, MIL-PRF-19500/437
  • Tolerance

    In electronic components, "tolerance" refers to the acceptable deviation or variation from the specified or ideal value of a particular parameter, such as resistance, capacitance, or voltage. It indicates the range within which the actual value of the component can fluctuate while still being considered acceptable for use in a circuit. Tolerance is typically expressed as a percentage or a specific value and is important for ensuring the accuracy and reliability of electronic devices. Components with tighter tolerances are more precise but may also be more expensive. It is crucial to consider tolerance when selecting components to ensure proper functionality and performance of the circuit.

    ±5%
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    175 °C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    -65 °C
  • Subcategory
    Diodes & Rectifiers
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    500 mW
  • Configuration

    The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

    Single
  • Element Configuration

    The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

    Single
  • Current - Reverse Leakage @ Vr

    Current - Reverse Leakage @ Vr is a parameter that describes the amount of current that flows in the reverse direction through a diode or other semiconductor component when a reverse voltage (Vr) is applied across it. This leakage current is typically very small, but it is important to consider in electronic circuits as it can affect the overall performance and reliability of the component. The reverse leakage current is influenced by factors such as the material properties of the semiconductor, temperature, and the magnitude of the reverse voltage applied. Manufacturers provide this parameter in datasheets to help engineers and designers understand the behavior of the component in reverse bias conditions.

    3 µA @ 1 V
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    500 mW
  • Voltage - Forward (Vf) (Max) @ If

    The parameter "Voltage - Forward (Vf) (Max) @ If" refers to the maximum voltage drop across a diode when it is forward-biased and conducting a specified forward current (If). It indicates the maximum potential difference the diode can withstand while allowing current to flow in the forward direction without breaking down. This value is crucial for designing circuits as it helps determine how much voltage will be lost across the diode during operation. Higher Vf values can lead to reduced efficiency in power applications, making this parameter essential for optimizing circuit performance.

    1.1 V @ 200 mA
  • Power - Max

    Power - Max is a parameter that specifies the maximum amount of power that an electronic component can handle without being damaged. It is typically measured in watts and indicates the upper limit of power that can be safely supplied to the component. Exceeding the maximum power rating can lead to overheating, malfunction, or permanent damage to the component. It is important to consider the power-max rating when designing circuits or systems to ensure proper operation and longevity of the electronic components.

    500 mW
  • Max Reverse Leakage Current

    Max Reverse Leakage Current refers to the maximum amount of current that can flow through a semiconductor device, such as a diode or transistor, when it is reverse biased. This current is an important parameter as it indicates the level of unintended current that can flow when the device is not conducting in the forward direction. High values of reverse leakage current can lead to power loss, reduced efficiency, and may affect the performance and reliability of electronic circuits. It is particularly critical in applications where precise current control and low power consumption are necessary.

    3 µA
  • Test Current

    Test Current refers to a specified amount of electrical current applied to an electronic component during testing to evaluate its performance and characteristics. This current is typically defined by manufacturers to ensure that the component operates within its designed parameters. By measuring how the component reacts to this test current, engineers can determine its reliability, efficiency, and suitability for specific applications.

    20 mA
  • Voltage - Zener (Nom) (Vz)

    The parameter "Voltage - Zener (Nom) (Vz)" refers to the nominal voltage of a Zener diode, which is a type of semiconductor device that allows current to flow in the reverse direction when a certain voltage threshold is reached. The Zener voltage, denoted as Vz, is the voltage at which the Zener diode begins to conduct in the reverse direction. This parameter is crucial in determining the specific voltage regulation characteristics of the Zener diode in a circuit. It is important to select a Zener diode with a Vz value that matches the desired voltage regulation requirements of the circuit to ensure proper functionality.

    3.6 V
  • Zener Voltage

    The Zener voltage is a crucial parameter in Zener diodes, which are specialized semiconductor devices designed to maintain a constant voltage across their terminals when operated in the reverse-biased mode. The Zener voltage, also known as the breakdown voltage, is the voltage at which the Zener diode starts conducting in the reverse direction. This voltage is carefully controlled during the manufacturing process and is a key characteristic that determines the diode's functionality in voltage regulation and protection circuits. Zener diodes are commonly used in various electronic applications to stabilize voltage levels and protect sensitive components from voltage spikes.

    3.6 V
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Zener Diodes
  • Voltage Tolerance

    The voltage tolerance level for the electrical auxiliaries is defined by the standard. The maximum and minimum nominal voltages are defined by the tolerance level.

    5 %
  • Zener Current

    Zener/Breakdown Voltage – The Zener or the reverse breakdown voltage?ranges from 2.4 V to 2 V, sometimes it can go up to 1 kV while the maximum for the surface-mounted device is 47 V. ... It is given by the product of the voltage of the diode and the current flowing through it.

    105 mA
  • Product Category

    a particular group of related products.

    Zener Diodes
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
0 Similar Products Remaining

JANTX1N5519BUR-1 Overview

It is necessary to supply this electrical device with a reverse leakage current of 3 µA @ 1 V.Reverse leakage current reaches a maximum of 3 µA.In operation, the maximum voltage - Zener (Nom) is set to 3.6 V.The design flexibility of this device is extremely high since its zener current is 105 mA.For the device to operate, the maximum forward voltage (Vf) 1.1 V @ 200 mA must be supplied.

JANTX1N5519BUR-1 Features

reverse leakage current of 3 µA @ 1 V
3 µA @ 1 V is the maximum voltage (Tol)
Reverse leakage current reaches 3 µA
the zener current of 105 mA

JANTX1N5519BUR-1 Applications

There are a lot of Microchip
JANTX1N5519BUR-1 applications of zener single diodes.