Microchip Technology BZV55C30/TR
Microchip Technology BZV55C30/TR
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Microchip Technology BZV55C30/TR

Manufacturer No:

BZV55C30/TR

Utmel No:

1610-BZV55C30/TR

Package:

DO-213AA (Glass)

ECAD Model:

Description:

ZENER DIODE ±7% 50 nA @ 21 V -65°C ~ 175°C ZENER DO-213AA (Glass)

Quantity:

Unit Price: $3.084618

Ext Price: $3.08

Delivery:

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Payment:

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In Stock : 50

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $3.084618

    $3.08

  • 10

    $2.910017

    $29.10

  • 100

    $2.745299

    $274.53

  • 500

    $2.589905

    $1,294.95

  • 1000

    $2.443307

    $2,443.31

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  • Vacuum packagingStep2:Vacuum packaging
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BZV55C30/TR information

Specifications
Product Details
Microchip Technology BZV55C30/TR technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology BZV55C30/TR.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    DO-213AA (Glass)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    DO-213AA
  • Diode Element Material

    The parameter "Diode Element Material" refers to the specific semiconductor material used in the construction of a diode. This material determines the electrical characteristics and performance of the diode, including its forward voltage drop, reverse breakdown voltage, and switching speed. Common diode element materials include silicon, germanium, and gallium arsenide, each offering different advantages for various applications. The choice of material impacts the diode's efficiency, thermal stability, and overall suitability for specific electronic circuits.

    SILICON
  • Number of Terminals
    2
  • Mfr
    Microchip Technology
  • Package
    Tape & Reel (TR)
  • Product Status
    Active
  • Ir - Reverse Current
    0.05 uA
  • Zz - Zener Impedance
    80 Ohms
  • Ir - Maximum Reverse Leakage Current
    0.05 uA
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 175 C
  • Unit Weight
    0.001411 oz
  • Minimum Operating Temperature
    - 65 C
  • Factory Pack QuantityFactory Pack Quantity
    1
  • Mounting Styles
    SMD/SMT
  • Manufacturer
    Microchip
  • Brand
    Microchip Technology
  • If - Forward Current
    200 mA
  • Vz - Zener Voltage
    30 V
  • RoHS
    N
  • Package Style
    LONG FORM
  • Package Body Material
    GLASS
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Reference Voltage-Nom
    30 V
  • Operating Temperature-Max
    200 °C
  • Rohs Code
    No
  • Manufacturer Part Number
    BZV55C30TR
  • Power Dissipation (Max)
    0.5 W
  • Package Shape
    ROUND
  • Number of Elements
    1
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    CENTRAL SEMICONDUCTOR CORP
  • Risk Rank
    5.16
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    -
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -65°C ~ 175°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Reel
  • Tolerance

    In electronic components, "tolerance" refers to the acceptable deviation or variation from the specified or ideal value of a particular parameter, such as resistance, capacitance, or voltage. It indicates the range within which the actual value of the component can fluctuate while still being considered acceptable for use in a circuit. Tolerance is typically expressed as a percentage or a specific value and is important for ensuring the accuracy and reliability of electronic devices. Components with tighter tolerances are more precise but may also be more expensive. It is crucial to consider tolerance when selecting components to ensure proper functionality and performance of the circuit.

    ±7%
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e0
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    No
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    TIN LEAD
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    GENERAL PURPOSE
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8541.10.00.50
  • Subcategory
    Diodes & Rectifiers
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    ZENER
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    END
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    WRAP AROUND
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    unknown
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    O-LELF-R2
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Polarity

    In electronic components, polarity refers to the orientation or direction in which the component must be connected in a circuit to function properly. Components such as diodes, capacitors, and LEDs have polarity markings to indicate which terminal should be connected to the positive or negative side of the circuit. Connecting a component with incorrect polarity can lead to malfunction or damage. It is important to pay attention to polarity markings and follow the manufacturer's instructions to ensure proper operation of electronic components.

    UNIDIRECTIONAL
  • Configuration

    The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

    Single
  • Diode Type

    In electronic components, the parameter "Diode Type" refers to the specific type or configuration of a diode, which is a semiconductor device that allows current to flow in one direction only. There are various types of diodes, each designed for specific applications and functions. Common diode types include rectifier diodes, zener diodes, light-emitting diodes (LEDs), and Schottky diodes, among others. The diode type determines the diode's characteristics, such as forward voltage drop, reverse breakdown voltage, and maximum current rating, making it crucial for selecting the right diode for a particular circuit or application. Understanding the diode type is essential for ensuring proper functionality and performance in electronic circuits.

    ZENER DIODE
  • Current - Reverse Leakage @ Vr

    Current - Reverse Leakage @ Vr is a parameter that describes the amount of current that flows in the reverse direction through a diode or other semiconductor component when a reverse voltage (Vr) is applied across it. This leakage current is typically very small, but it is important to consider in electronic circuits as it can affect the overall performance and reliability of the component. The reverse leakage current is influenced by factors such as the material properties of the semiconductor, temperature, and the magnitude of the reverse voltage applied. Manufacturers provide this parameter in datasheets to help engineers and designers understand the behavior of the component in reverse bias conditions.

    50 nA @ 21 V
  • Voltage - Forward (Vf) (Max) @ If

    The parameter "Voltage - Forward (Vf) (Max) @ If" refers to the maximum voltage drop across a diode when it is forward-biased and conducting a specified forward current (If). It indicates the maximum potential difference the diode can withstand while allowing current to flow in the forward direction without breaking down. This value is crucial for designing circuits as it helps determine how much voltage will be lost across the diode during operation. Higher Vf values can lead to reduced efficiency in power applications, making this parameter essential for optimizing circuit performance.

    1.1 V @ 200 mA
  • Case Connection

    Case Connection refers to the method by which an electronic component's case or housing is connected to the electrical circuit. This connection is important for grounding purposes, mechanical stability, and heat dissipation. The case connection can vary depending on the type of component and its intended application. It is crucial to ensure a secure and reliable case connection to maintain the overall performance and safety of the electronic device.

    ISOLATED
  • Test Current

    Test Current refers to a specified amount of electrical current applied to an electronic component during testing to evaluate its performance and characteristics. This current is typically defined by manufacturers to ensure that the component operates within its designed parameters. By measuring how the component reacts to this test current, engineers can determine its reliability, efficiency, and suitability for specific applications.

    2 mA
  • Voltage - Zener (Nom) (Vz)

    The parameter "Voltage - Zener (Nom) (Vz)" refers to the nominal voltage of a Zener diode, which is a type of semiconductor device that allows current to flow in the reverse direction when a certain voltage threshold is reached. The Zener voltage, denoted as Vz, is the voltage at which the Zener diode begins to conduct in the reverse direction. This parameter is crucial in determining the specific voltage regulation characteristics of the Zener diode in a circuit. It is important to select a Zener diode with a Vz value that matches the desired voltage regulation requirements of the circuit to ensure proper functionality.

    30 V
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Zener Diodes
  • Voltage Tol-Max

    Voltage Tol-Max refers to the maximum allowable deviation or tolerance in voltage that an electronic component can withstand without causing damage or malfunction. It indicates the range within which the component can operate safely and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component in various electrical circuits. Designers and engineers need to consider the Voltage Tol-Max specification when selecting components to ensure compatibility and prevent potential issues related to voltage fluctuations.

    5%
  • Working Test Current

    Working Test Current is a parameter used in electronic components to specify the maximum current that the component can handle during normal operation or testing without being damaged. This parameter is crucial for ensuring the reliability and longevity of the component in a circuit. It helps designers and engineers determine the appropriate operating conditions and limits for the component to prevent overheating or failure. Understanding the Working Test Current of a component is essential for proper selection and integration into electronic systems to ensure optimal performance and safety.

    2 mA
  • Voltage Tolerance

    The voltage tolerance level for the electrical auxiliaries is defined by the standard. The maximum and minimum nominal voltages are defined by the tolerance level.

    5 %
  • Zener Current

    Zener/Breakdown Voltage – The Zener or the reverse breakdown voltage?ranges from 2.4 V to 2 V, sometimes it can go up to 1 kV while the maximum for the surface-mounted device is 47 V. ... It is given by the product of the voltage of the diode and the current flowing through it.

    0.05 uA
  • Dynamic Impedance-Max

    Dynamic Impedance-Max refers to the maximum impedance value exhibited by an electronic component when subjected to dynamic operating conditions, such as changing voltage or current levels. It is a critical parameter in evaluating how a component behaves under real-world signal variations, particularly in applications involving RF circuits, semiconductor devices, and filters. This parameter helps in assessing the performance and stability of the component in response to dynamic loads or signals, providing insights into its efficiency and linearity during operation.

    80 Ω
  • Vf - Forward Voltage

    In electronic components, "Vf - Forward Voltage" refers to the voltage required for current to flow through a diode or LED in the forward direction. It is the minimum voltage needed to overcome the barrier potential at the junction of the diode, allowing current to pass through. The forward voltage drop is typically specified in datasheets and is an important parameter to consider when designing circuits using diodes or LEDs. Understanding the forward voltage helps in selecting the appropriate components and ensuring proper operation of the circuit.

    1.1 V
  • Product Category

    a particular group of related products.

    Zener Diodes
  • Length
    3.7 mm
  • Diameter

    In electronic components, the parameter "Diameter" typically refers to the measurement of the width of a circular component, such as a resistor, capacitor, or inductor. It is a crucial dimension that helps determine the physical size and fit of the component within a circuit or on a circuit board. The diameter is usually measured in millimeters (mm) or inches (in) and is important for ensuring proper placement and soldering of the component during assembly. Understanding the diameter of electronic components is essential for selecting the right size for a specific application and ensuring compatibility with other components and the overall design of the circuit.

    1.7 mm
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BZV55C30/TR Overview

It is necessary to supply this electrical device with a reverse leakage current of 50 nA @ 21 V.A voltage of 5% indicates the maximum voltage (Tol) that can be supplied.In operation, the maximum voltage - Zener (Nom) is set to 30 V.The design flexibility of this device is extremely high since its zener current is 0.05 uA.This device can only be operated when the working test voltage is set to 2 mA.For the device to operate, the maximum forward voltage (Vf) 1.1 V @ 200 mA must be supplied.

BZV55C30/TR Features

reverse leakage current of 50 nA @ 21 V
50 nA @ 21 V is the maximum voltage (Tol)
the zener current of 0.05 uA
the working test voltage to 2 mA
minimal dynamic impedance is 2 mA

BZV55C30/TR Applications

There are a lot of Microchip Technology
BZV55C30/TR applications of zener single diodes.