Micro Commercial Components MD70A08D1-BP
Micro Commercial Components MD70A08D1-BP
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Micro Commercial Components MD70A08D1-BP

Manufacturer No:

MD70A08D1-BP

Utmel No:

1603-MD70A08D1-BP

Package:

Module

ECAD Model:

Description:

1 Pair Series Connection Standard Recovery >500ns, > 200mA (Io) -40°C ~ 150°C Module Chassis Mount

Quantity:

Unit Price: $14.885608

Ext Price: $14.89

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 31

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $14.885608

    $14.89

  • 10

    $14.043026

    $140.43

  • 100

    $13.248138

    $1,324.81

  • 500

    $12.498243

    $6,249.12

  • 1000

    $11.790795

    $11,790.80

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User Guide

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Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
MD70A08D1-BP information

Specifications
Product Details
Micro Commercial Components MD70A08D1-BP technical specifications, attributes, parameters and parts with similar specifications to Micro Commercial Components MD70A08D1-BP.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Chassis Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    Module
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    D1
  • Package
    Bulk
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    MD70
  • Mfr
    Micro Commercial Co
  • Product Status
    Active
  • Current - Average Rectified (Io) (per Diode)
    70A
  • Factory Pack QuantityFactory Pack Quantity
    10
  • Manufacturer
    Micro Commercial Components (MCC)
  • Brand
    Micro Commercial Components (MCC)
  • RoHS
    Details
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    -
  • Subcategory
    Discrete Semiconductor Modules
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    Standard
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    Standard Recovery >500ns, > 200mA (Io)
  • Current - Reverse Leakage @ Vr

    Current - Reverse Leakage @ Vr is a parameter that describes the amount of current that flows in the reverse direction through a diode or other semiconductor component when a reverse voltage (Vr) is applied across it. This leakage current is typically very small, but it is important to consider in electronic circuits as it can affect the overall performance and reliability of the component. The reverse leakage current is influenced by factors such as the material properties of the semiconductor, temperature, and the magnitude of the reverse voltage applied. Manufacturers provide this parameter in datasheets to help engineers and designers understand the behavior of the component in reverse bias conditions.

    5 mA @ 800 V
  • Voltage - Forward (Vf) (Max) @ If

    The parameter "Voltage - Forward (Vf) (Max) @ If" refers to the maximum voltage drop across a diode when it is forward-biased and conducting a specified forward current (If). It indicates the maximum potential difference the diode can withstand while allowing current to flow in the forward direction without breaking down. This value is crucial for designing circuits as it helps determine how much voltage will be lost across the diode during operation. Higher Vf values can lead to reduced efficiency in power applications, making this parameter essential for optimizing circuit performance.

    1.3 V @ 200 A
  • Operating Temperature - Junction

    Operating Temperature - Junction refers to the maximum temperature at which the junction of an electronic component can safely operate without causing damage or performance degradation. This parameter is crucial for determining the reliability and longevity of the component, as excessive heat can lead to thermal stress and failure. Manufacturers specify the operating temperature range to ensure that the component functions within safe limits under normal operating conditions. It is important for designers and engineers to consider the operating temperature - junction when selecting and using electronic components to prevent overheating and ensure optimal performance.

    -40°C ~ 150°C
  • Voltage - DC Reverse (Vr) (Max)

    Voltage - DC Reverse (Vr) (Max) is a parameter in electronic components that specifies the maximum reverse voltage that the component can withstand without breaking down. This parameter is crucial for components like diodes and transistors that are often subjected to reverse voltage during operation. Exceeding the maximum reverse voltage can lead to the component failing or getting damaged. Designers need to consider this parameter when selecting components to ensure the reliability and longevity of their circuits.

    800 V
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Discrete Semiconductor Modules
  • Diode Configuration

    Diode configuration refers to the specific arrangement and connection of diodes within an electronic circuit. It can determine how the diode functions, whether as a rectifier, switch, or voltage regulator. Common configurations include series, parallel, and bridge configurations, each with distinct characteristics affecting the flow of current and voltage in the circuit. Proper diode configuration is essential for achieving desired circuit behaviors and performance.

    1 Pair Series Connection
  • Product Category

    a particular group of related products.

    Discrete Semiconductor Modules
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MD70A08D1-BP Overview


MD70A08D1-BP Features


MD70A08D1-BP Applications

There are a lot of Micro Commercial Components
MD70A08D1-BP applications of rectifier diode array.


  • Rectifier for drives applications
  • Crowbar applications
  • Rectifiers for UBS
  • Battery chargers
  • Rectifiers in switch mode power supplies (SMPS)
  • Free wheeling diode in low voltage converters
  • General Rectification
MD70A08D1-BP Relevant information

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