Microsemi Corporation 2N2323A

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

a count of all of the component leads (or pins)

The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

The Max Repetitive Reverse Voltage (Vrrm) is a crucial parameter in electronic components, particularly in diodes and transistors. It refers to the maximum voltage that can be applied across the component in the reverse direction without causing damage. This parameter is important for ensuring the proper functioning and longevity of the component in circuits where reverse voltage may be present. Exceeding the Vrrm rating can lead to breakdown and failure of the component, so it is essential to carefully consider this specification when designing or selecting components for a circuit.

JEDEC-95 Code is a standardized identification system used by the Joint Electron Device Engineering Council to categorize and describe semiconductor devices. This code provides a unique alphanumeric identifier for various memory components, ensuring consistency in documentation and communication across the electronics industry. The format includes information about the type, capacity, and technology of the device, facilitating easier specification and understanding for manufacturers and engineers.

the minimum current which must pass through a circuit in order for it to remain in the 'ON' state.

Trigger Device Type is a parameter in electronic components that refers to the type of device or mechanism used to initiate a specific action or function within the component. This parameter specifies the specific trigger device, such as a sensor, switch, or signal input, that is required to activate or control the operation of the component. Understanding the trigger device type is crucial for proper integration and operation of the electronic component within a larger system or circuit. By specifying the appropriate trigger device type, engineers and designers can ensure that the component functions correctly and responds to the intended input signals or conditions.

The parameter "On-State Current-Max" in electronic components refers to the maximum current that can flow through the component when it is in the fully conducting state, also known as the "on-state." This parameter is crucial for determining the maximum load that the component can handle without getting damaged. It is typically specified in the component's datasheet and is important for ensuring the safe and reliable operation of the component within its specified limits. Designers and engineers use this parameter to select components that can handle the required current levels in their circuits without exceeding the maximum ratings.

Leakage Current (Max) is a parameter that specifies the maximum amount of current that can flow through an electronic component when it is in an off state. It represents the amount of current that leaks through the component due to imperfections in its insulation or semiconductor materials. Excessive leakage current can lead to power loss, reduced efficiency, and potential reliability issues in electronic circuits. Manufacturers provide this specification to help designers ensure that the leakage current does not exceed acceptable limits for the intended application. It is typically measured in microamps (μA) or nanoamps (nA) and is an important consideration in low-power and high-precision electronic designs.

SCR Type refers to a category of semiconductor devices specifically designed to control and manage electrical energy in electronic circuits. It stands for Silicon Controlled Rectifier, which is a type of thyristor that can switch and control voltage and current flow. SCRs are commonly used in applications such as motor control, power regulation, and lighting control due to their ability to handle high power loads. The SCR Type includes variations like standard SCRs, gate turn-off thyristors, and triacs, each serving specific purposes in power electronics.

The parameter "RMS On-state Current-Max" in electronic components refers to the maximum root mean square (RMS) current that the component can handle when it is in the on-state or conducting state. This specification is important for devices such as thyristors, triacs, and other semiconductor switches that are used to control power in various applications. Exceeding the maximum RMS on-state current rating can lead to overheating and potentially damaging the component. Designers must carefully consider this parameter to ensure the component operates within its specified limits for safe and reliable performance.

The parameter "DC Gate Trigger Voltage-Max" refers to the maximum voltage required to trigger the gate of a semiconductor device, such as a thyristor or a triac. This voltage level is crucial for initiating the conduction state of the device, allowing current to flow through it. Exceeding this maximum voltage can lead to unintended triggering or damage to the component. Manufacturers specify this parameter to ensure proper operation and reliability of the device in various applications. Designers and engineers need to consider this specification when selecting and using these components in their circuits to prevent malfunctions and ensure optimal performance.

The parameter "Circuit Commutated Turn-off Time-Nom" in electronic components refers to the nominal time it takes for a circuit to turn off after being commutated. Commutation is the process of transferring current from one circuit to another. This parameter is crucial in power electronics, especially in devices like thyristors and other semiconductor switches, as it affects the efficiency and performance of the circuit. A shorter turn-off time typically indicates faster switching speeds and better overall performance of the electronic component. Manufacturers provide this specification to help engineers and designers select the appropriate components for their specific applications.

The parameter "Repetitive Peak Off-state Leakage Current-Max" in electronic components refers to the maximum amount of current that flows through the device when it is in the off-state and subjected to repetitive peak voltage stress. This parameter is important for determining the leakage current characteristics of the component, which can impact the overall performance and reliability of the circuit. A lower value for this parameter indicates better isolation and reduced power consumption in the off-state. Designers need to consider this parameter when selecting components for applications where minimizing leakage current is critical.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.