

NXP Semiconductors BT258S-800R,118
Manufacturer No:
BT258S-800R,118
Tiny WHSLManufacturer:
Utmel No:
1786-BT258S-800R,118
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Description:
SCR
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- TypeParameter
- Factory Lead Time6 Weeks
- Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES - Number of Terminals2
- ECCN (US)EAR99
- Repetitive Peak Reverse Voltage (V)800
- Maximum Holding Current (mA)6
- Surge Current Rating (A)82
- Maximum Gate Trigger Current (mA)0.2
- Maximum Gate Trigger Voltage (V)1
- Maximum Rate of Rise of On-State Current (A/us)50
- Maximum Rate of Rise of Off-State Voltage (V/us)100(Typ)
- HTS8541.30.00.80
- Package Length6.73(Max)
- Package Height2.38(Max)
- MountingSurface Mount
- MilitaryNo
- Supplier PackageDPAK
- AEC QualifiedUnknown
- Maximum Operating Temperature (°C)125
- Minimum Operating Temperature (°C)-40
- Phase ControlNo
- Repetitive Peak Off-State Current (mA)0.5
- RMS On-State Current (A)8
- Rated Average On-State Current (A)5
- Repetitive Peak Forward Blocking Voltage (V)800
- Peak On-State Voltage (V)1.6@16A
- Maximum Gate Peak Inverse Voltage (V)5
- TabTab
- PCB changed2
- Package Width6.22(Max)
- Package DescriptionPLASTIC, SC-63, TO-252, DPAK-3/2
- Package StyleSMALL OUTLINE
- Moisture Sensitivity Levels1
- Package Body MaterialPLASTIC/EPOXY
- Reflow Temperature-Max (s)40
- Operating Temperature-Max125 °C
- Rohs CodeYes
- Manufacturer Part NumberBT258S-800R,118
- Package ShapeRECTANGULAR
- ManufacturerWeEn Semiconductor Co Ltd
- Number of Elements1
- Part Life Cycle CodeActive
- Ihs ManufacturerWEEN SEMICONDUCTORS CO LTD
- Risk Rank0.63
- JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e3 - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
TIN - Additional Feature
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
SENSITIVE GATE - HTS Code
HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.
8541.30.00.80 - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
SINGLE - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Reach Compliance Code
Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.
not_compliant - Pin Count
a count of all of the component leads (or pins)
3 - Reference Standard
In the context of electronic components, the term "Reference Standard" typically refers to a specific set of guidelines, specifications, or requirements that serve as a benchmark for evaluating the quality, performance, and characteristics of the component. These standards are established by organizations such as the International Electrotechnical Commission (IEC), the Institute of Electrical and Electronics Engineers (IEEE), or specific industry bodies.Reference standards help ensure consistency and interoperability among different components, as they provide a common framework for manufacturers, designers, and users to adhere to. They outline parameters such as electrical properties, mechanical dimensions, environmental conditions, and safety considerations that the component must meet to be considered compliant.By referencing these standards, manufacturers can design and produce components that meet industry-recognized criteria, which in turn helps users select the right components for their applications with confidence. Adhering to reference standards also facilitates regulatory compliance and promotes overall quality and reliability in electronic systems.
IEC-60134 - JESD-30 Code
JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.
R-PSSO-G2 - Configuration
The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.
SINGLE - Case Connection
Case Connection refers to the method by which an electronic component's case or housing is connected to the electrical circuit. This connection is important for grounding purposes, mechanical stability, and heat dissipation. The case connection can vary depending on the type of component and its intended application. It is crucial to ensure a secure and reliable case connection to maintain the overall performance and safety of the electronic device.
ANODE - JEDEC-95 Code
JEDEC-95 Code is a standardized identification system used by the Joint Electron Device Engineering Council to categorize and describe semiconductor devices. This code provides a unique alphanumeric identifier for various memory components, ensuring consistency in documentation and communication across the electronics industry. The format includes information about the type, capacity, and technology of the device, facilitating easier specification and understanding for manufacturers and engineers.
TO-252AA - Trigger Device Type
Trigger Device Type is a parameter in electronic components that refers to the type of device or mechanism used to initiate a specific action or function within the component. This parameter specifies the specific trigger device, such as a sensor, switch, or signal input, that is required to activate or control the operation of the component. Understanding the trigger device type is crucial for proper integration and operation of the electronic component within a larger system or circuit. By specifying the appropriate trigger device type, engineers and designers can ensure that the component functions correctly and responds to the intended input signals or conditions.
SCR - Repetitive Peak Off-state Voltage
The Repetitive Peak Off-state Voltage (Vdrm) is a key parameter in electronic components, particularly in devices like thyristors and triacs. It refers to the maximum voltage that can be applied across the component when it is in the off-state without triggering it to turn on. This parameter is crucial for ensuring the proper functioning and reliability of the component in various circuit applications. It helps determine the voltage level at which the component can safely operate without experiencing unintended conduction. Designers need to consider the Vdrm rating to prevent damage to the component and maintain the overall performance of the circuit.
800 V - Repetitive Peak Reverse Voltage
The Repetitive Peak Reverse Voltage (VRRM) is a key parameter in electronic components, particularly in diodes and rectifiers. It refers to the maximum reverse voltage that a component can withstand in repetitive peak reverse polarity conditions without breaking down. This parameter is crucial for ensuring the reliable operation and longevity of the component in circuits where reverse voltage may be present intermittently or periodically. It is important to select a component with a VRRM rating higher than the maximum reverse voltage expected in the circuit to prevent damage or failure.
800 V - RMS On-state Current-Max
The parameter "RMS On-state Current-Max" in electronic components refers to the maximum root mean square (RMS) current that the component can handle when it is in the on-state or conducting state. This specification is important for devices such as thyristors, triacs, and other semiconductor switches that are used to control power in various applications. Exceeding the maximum RMS on-state current rating can lead to overheating and potentially damaging the component. Designers must carefully consider this parameter to ensure the component operates within its specified limits for safe and reliable performance.
8 A - DC Gate Trigger Current-Max
The parameter "DC Gate Trigger Current-Max" refers to the maximum current required to trigger the gate of a semiconductor device, such as a thyristor or a triac. This parameter specifies the maximum current that must be applied to the gate terminal to turn on the device reliably. Exceeding this maximum current may result in improper operation or damage to the component. It is an important parameter to consider when designing circuits that involve triggering these semiconductor devices, as it ensures proper functionality and reliability of the component.
0.2 mA - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
Yes with exemptions