

ON Semiconductor MKP1V160
Manufacturer No:
MKP1V160
Tiny WHSLManufacturer:
Utmel No:
1807-MKP1V160
Package:
DO-204AL, DO-41, Axial
Datasheet:
Description:
SIDAC 150-170V 900MA AXIAL
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- TypeParameter
- Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
DO-204AL, DO-41, Axial - Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
NO - Number of Elements1
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~125°C TJ - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Bulk - Published2006
- JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e3 - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Obsolete - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
1 (Unlimited) - Number of Terminations2
- ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Tin (Sn) - Additional Feature
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
UL RECOGNIZED - HTS Code
HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.
8541.30.00.80 - Voltage - Rated DC
Voltage - Rated DC is a parameter that specifies the maximum direct current (DC) voltage that an electronic component can safely handle without being damaged. This rating is crucial for ensuring the proper functioning and longevity of the component in a circuit. Exceeding the rated DC voltage can lead to overheating, breakdown, or even permanent damage to the component. It is important to carefully consider this parameter when designing or selecting components for a circuit to prevent any potential issues related to voltage overload.
160V - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
WIRE - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Reach Compliance Code
Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.
not_compliant - Current Rating
Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.
900mA - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
40 - Pin Count
a count of all of the component leads (or pins)
2 - JESD-30 Code
JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.
O-PALF-W2 - Qualification Status
An indicator of formal certification of qualifications.
Not Qualified - Max Output Current
The maximum current that can be supplied to the load.
900mA - Configuration
The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.
SINGLE - Case Connection
Case Connection refers to the method by which an electronic component's case or housing is connected to the electrical circuit. This connection is important for grounding purposes, mechanical stability, and heat dissipation. The case connection can vary depending on the type of component and its intended application. It is crucial to ensure a secure and reliable case connection to maintain the overall performance and safety of the electronic device.
ISOLATED - Hold Current
the minimum current which must pass through a circuit in order for it to remain in the 'ON' state.
100mA - Trigger Device Type
Trigger Device Type is a parameter in electronic components that refers to the type of device or mechanism used to initiate a specific action or function within the component. This parameter specifies the specific trigger device, such as a sensor, switch, or signal input, that is required to activate or control the operation of the component. Understanding the trigger device type is crucial for proper integration and operation of the electronic component within a larger system or circuit. By specifying the appropriate trigger device type, engineers and designers can ensure that the component functions correctly and responds to the intended input signals or conditions.
SIDAC - Current - Hold (Ih) (Max)
The parameter "Current - Hold (Ih) (Max)" in electronic components refers to the maximum current required to maintain the component in a latched or on-state after it has been triggered. This parameter is commonly associated with relays, switches, and other devices that have a latching function. It is important because it determines the minimum current that must be supplied to keep the component in its activated state, ensuring reliable operation. Exceeding the maximum Ih value can lead to the component failing to hold its state, potentially causing malfunctions or disruptions in the circuit.
100mA - Non-Repetitive Pk On-state Cur
Non-Repetitive Pk On-state Current, often abbreviated as Non-Repetitive Pk On-state Cur, is a parameter that defines the maximum current that a semiconductor device, such as a thyristor or triac, can withstand for a short duration without sustaining damage. This current level is typically specified under particular conditions and is meant to represent transient events rather than continuous operation. It indicates the device's ability to handle sudden surges in current, which may occur due to load changes or fault conditions, while ensuring that the component does not suffer thermal or electrical breakdown during this brief period.
4 A - Voltage - Breakover
Voltage - Breakover is a parameter that refers to the voltage level at which a specific electronic component, such as a thyristor or a gas discharge tube, transitions from a high-resistance state to a low-resistance state. This transition is known as the breakover voltage, and it is a critical characteristic in determining the operating conditions and performance of the component. When the breakover voltage is reached, the component essentially "breaks over" and allows a significant current to flow through it. Understanding the breakover voltage is essential for designing and using electronic circuits effectively, as it helps ensure proper functionality and protection against voltage surges or overloads.
150V~170V - Current - Breakover
The parameter "Current - Breakover" is typically associated with thyristors, which are semiconductor devices used for switching and controlling electrical power in various applications. Breakover current refers to the minimum current required to trigger the thyristor into the conducting state, allowing it to switch from its non-conducting state to a conducting state. This parameter is crucial for determining the reliability and performance of the thyristor in a circuit.In simpler terms, the breakover current is the threshold current level that must be exceeded to turn on the thyristor and allow current to flow through it. It is an important specification to consider when designing circuits that involve thyristors, as it ensures proper operation and prevents accidental triggering. Manufacturers provide this parameter in the datasheet of the thyristor to help engineers select the appropriate component for their specific application requirements.
200μA - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
Non-RoHS Compliant - Lead Free
Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.
Contains Lead