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In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

a count of all of the component leads (or pins)

JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

An indicator of formal certification of qualifications.

The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

Case Connection refers to the method by which an electronic component's case or housing is connected to the electrical circuit. This connection is important for grounding purposes, mechanical stability, and heat dissipation. The case connection can vary depending on the type of component and its intended application. It is crucial to ensure a secure and reliable case connection to maintain the overall performance and safety of the electronic device.

JEDEC-95 Code is a standardized identification system used by the Joint Electron Device Engineering Council to categorize and describe semiconductor devices. This code provides a unique alphanumeric identifier for various memory components, ensuring consistency in documentation and communication across the electronics industry. The format includes information about the type, capacity, and technology of the device, facilitating easier specification and understanding for manufacturers and engineers.

RMS Current (Irms) refers to the Root Mean Square value of the alternating current flowing through an electronic component or circuit. It is a measure of the effective current that produces the same heating effect as the equivalent DC current. In AC circuits, the current continuously changes direction, so using the RMS value helps in calculating power dissipation and determining the component's capability to handle the current without overheating. RMS Current is crucial in selecting components like resistors, capacitors, and inductors to ensure they can safely operate within their specified current ratings.

Trigger Device Type is a parameter in electronic components that refers to the type of device or mechanism used to initiate a specific action or function within the component. This parameter specifies the specific trigger device, such as a sensor, switch, or signal input, that is required to activate or control the operation of the component. Understanding the trigger device type is crucial for proper integration and operation of the electronic component within a larger system or circuit. By specifying the appropriate trigger device type, engineers and designers can ensure that the component functions correctly and responds to the intended input signals or conditions.

Voltage - Gate Trigger (Vgt) (Max) refers to the maximum voltage level required to trigger the gate of a semiconductor device, such as a thyristor or triac, into the conductive state. When the gate receives this voltage, it initiates the device's conduction, allowing current to flow between its anode and cathode. Exceeding this voltage can lead to unwanted behavior or damage to the component, making it a critical parameter in designing circuits that utilize these devices. Understanding Vgt is essential for ensuring proper operation and reliability in electronic applications.

The parameter "Current - Non Rep. Surge 50, 60Hz (Itsm)" in electronic components refers to the maximum non-repetitive surge current that a component can withstand without damage during a single surge event at frequencies of 50Hz or 60Hz. This parameter is important for assessing the robustness and reliability of the component in handling sudden spikes or surges in current that may occur in the electrical system. It helps in determining the level of protection needed for the component to ensure its longevity and proper functioning in various operating conditions. Manufacturers provide this specification to guide engineers and designers in selecting the appropriate components for their applications based on the expected surge current levels.

Current - Gate Trigger (Igt) (Max) refers to the maximum gate trigger current required to activate a semiconductor device, such as a thyristor or triac. It is the minimum current that must flow into the gate terminal to ensure that the device turns on and conducts current between its anode and cathode. Exceeding this value can lead to unnecessary power consumption, while insufficient current may prevent the device from turning on effectively. This parameter is crucial for circuit design, as it influences the selection of gate driving circuits.

The Repetitive Peak Off-state Voltage (Vdrm) is a key parameter in electronic components, particularly in devices like thyristors and triacs. It refers to the maximum voltage that can be applied across the component when it is in the off-state without triggering it to turn on. This parameter is crucial for ensuring the proper functioning and reliability of the component in various circuit applications. It helps determine the voltage level at which the component can safely operate without experiencing unintended conduction. Designers need to consider the Vdrm rating to prevent damage to the component and maintain the overall performance of the circuit.

Triac Type refers to the classification of triacs based on their electrical characteristics and applications. Triacs are semiconductor devices that can control current flow in both directions and are commonly used in AC power control. Different types of triacs may have variations in parameters such as voltage rating, current rating, triggering method, and switching speed, making them suitable for specific applications like light dimmers, motor speed controls, and heating regulation. Understanding the triac type is crucial for selecting the appropriate component for a given circuit design.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.