ESP32: a successor to the ESP8266 microcontroller
2.4GHz~2.5GHz Bluetooth, WiFi -40°C~85°C 2.7V~3.6V ADC, GPIO, I2C, I2S, PWM, SDIO, SPI, UART 150Mbps 20.5dBm 802.11b/g/n, Bluetooth v4.2 + EDR, Class 1, 2 and 3 -97dBm Module









2.4GHz~2.5GHz Bluetooth, WiFi -40°C~85°C 2.7V~3.6V ADC, GPIO, I2C, I2S, PWM, SDIO, SPI, UART 150Mbps 20.5dBm 802.11b/g/n, Bluetooth v4.2 + EDR, Class 1, 2 and 3 -97dBm Module
ESP32 is a series of low-cost, low-power systems on a chip microcontroller with integrated Wi-Fi and dual-mode Bluetooth. ESP8266 is a low-cost Wi-Fi microchip, with built-in TCP/IP networking software, and microcontroller capability, produced by Espressif Systems in Shanghai, China. This article is going to cover the differences between ESP8266 and ESP32 from the perspective of description, GPIOs, CAD Model, features, and more details.

ESP8266 vs ESP32 with WLED
ESP32 Description
ESP32 is a series of low-cost, low-power systems on a chip microcontroller with integrated Wi-Fi and dual-mode Bluetooth. The ESP32 series employs either a Tensilica Xtensa LX6 microprocessor in both dual-core and single-core variations, Xtensa LX7 dual-core microprocessor, or a single-core RISC-V microprocessor and includes built-in antenna switches, RF balun, power amplifier, low-noise receive amplifier, filters, and power management modules. ESP32 is created and developed by Espressif Systems, a Shanghai-based Chinese company, and is manufactured by TSMC using its 40 nm process. It is a successor to the ESP8266 microcontroller,
ESP8266 Description
ESP8266 is a low-cost Wi-Fi microchip, with built-in TCP/IP networking software, and microcontroller capability, produced by Espressif Systems in Shanghai, China.
The chip first came to the attention of Western makers in August 2014 with the ESP-01 module, made by a third-party manufacturer Ai-Thinker. This small module allows microcontrollers to connect to a Wi-Fi network and make simple TCP/IP connections using Hayes-style commands. However, at first, there was almost no English-language documentation on the chip and the commands it accepted. The very low price and the fact that there were very few external components on the module, which suggested that it could eventually be very inexpensive in volume, attracted many hackers to explore the module, the chip, and the software on it, as well as to translate the Chinese documentation.
These microcontroller chips have been succeeded by the ESP32 family of devices.
Comparison of GPIOs of the ESP8266 vs. ESP32
Comparison of CAD Model of the ESP8266 vs. ESP32
ESP8266 CAD Model
ESP32 CAD Model
Comparison of features of the ESP8266 vs. ESP32
Features of the ESP32 include the following:
Processors:
CPU: Xtensa dual-core (or single-core) 32-bit LX6 microprocessor, operating at 160 or 240 MHz and performing at up to 600 DMIPS
Ultra-low-power (ULP) co-processor
Memory: 320 KiB RAM, 448 KiB ROM
Wireless connectivity:
Wi-Fi: 802.11 b/g/n
Bluetooth: v4.2 BR/EDR and BLE (shares the radio with Wi-Fi )
Peripheral interfaces:
34 × programmable GPIOs
12-bit SAR ADC up to 18 channels
2 × 8-bit DACs
10 × touch sensors (capacitive sensing GPIOs )
4 × SPI
2 × I²S interfaces
2 × I²C interfaces
3 × UART
SD/SDIO/CE-ATA/MMC/eMMC host controller
SDIO/SPI slave controller
Ethernet MAC interface with dedicated DMA and planned IEEE 1588 Precision Time Protocol support
CAN bus 2.0
Infrared remote controller (TX/RX, up to 8 channels)
Motor PWM
LED PWM (up to 16 channels)
Hall effect sensor
Ultra-low-power analog pre-amplifier
Features of the ESP8266 include the following:
Processor: L106 32-bit RISC microprocessor core based on the Tensilica Xtensa Diamond Standard 106Micro running at 80 MHz
Memory:[citation needed]
32 KiB instruction RAM
32 KiB instruction cache RAM
80 KiB user-data RAM
16 KiB ETS system-data RAM
External QSPI flash: up to 16 MiB is supported (512 KiB to 4 MiB typically included)
IEEE 802.11 b/g/n Wi-Fi
Integrated TR switch, balun, LNA, power amplifier, and matching network
WEP or WPA/WPA2 authentication, or open networks
17 GPIO pins
Serial Peripheral Interface Bus (SPI)
I²C (software implementation)
I²S interfaces with DMA (sharing pins with GPIO)
UART on dedicated pins, plus a transmit-only UART can be enabled on GPIO2
10-bit ADC (successive approximation ADC)
Specifications
- TypeParameter
- Factory Lead Time4 Weeks
- Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
Module - Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~85°C - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
Not Applicable - Voltage - Supply
Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.
2.7V~3.6V - Frequency
In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.
2.4GHz~2.5GHz - Data Rate
Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).
150Mbps - Protocol
In electronic components, the parameter "Protocol" refers to a set of rules and standards that govern the communication between devices. It defines the format, timing, sequencing, and error checking methods for data exchange between different components or systems. Protocols ensure that devices can understand and interpret data correctly, enabling them to communicate effectively with each other. Common examples of protocols in electronics include USB, Ethernet, SPI, I2C, and Bluetooth, each with its own specifications for data transmission. Understanding and adhering to protocols is essential for ensuring compatibility and reliable communication between electronic devices.
802.11b/g/n, Bluetooth v4.2 + EDR, Class 1, 2 and 3 - Power - Output
Power Output in electronic components refers to the amount of electrical power that a device can deliver to a load. It is typically measured in watts and indicates the effectiveness of the component in converting electrical energy into usable work or signal. Power Output can vary based on the component's design, operating conditions, and intended application, making it a critical factor in the performance of amplifiers, power supplies, and other electronic devices. Understanding the Power Output helps in selecting appropriate components for specific applications to ensure efficiency and reliability.
20.5dBm - RF Family/Standard
The parameter "RF Family/Standard" in electronic components refers to the specific radio frequency (RF) technology or standard that the component complies with or is designed for. RF technology encompasses a wide range of frequencies used for wireless communication, such as Wi-Fi, Bluetooth, cellular networks, and more. Different RF standards dictate the frequency bands, modulation techniques, data rates, and other specifications for communication systems. Understanding the RF family/standard of a component is crucial for ensuring compatibility and optimal performance in RF applications.
Bluetooth, WiFi - Sensitivity
Sensitivity in electronic components refers to the degree to which the output of a device responds to changes in input. It indicates how effectively a component translates a specific input signal into an observable output. High sensitivity means that even small variations in input can produce significant changes in output, making the device more responsive to signals. Sensitivity is crucial in applications where precise measurements or signal detection are required.
-97dBm - Serial Interfaces
A serial interface is a communication interface between two digital systems that transmits data as a series of voltage pulses down a wire. Essentially, the serial interface encodes the bits of a binary number by their "temporal" location on a wire rather than their "spatial" location within a set of wires.
ADC, GPIO, I2C, I2S, PWM, SDIO, SPI, UART - Modulation
In electronic components, modulation refers to the process of varying one or more properties of a periodic waveform, known as the carrier signal, in order to encode information. This modulation technique is commonly used in communication systems to transmit data efficiently over long distances. By modulating the carrier signal, information such as audio, video, or data can be embedded onto the signal for transmission and then demodulated at the receiving end to retrieve the original information. There are various types of modulation techniques, including amplitude modulation (AM), frequency modulation (FM), and phase modulation (PM), each with its own advantages and applications in different communication systems.
CCK, DSSS, OFDM - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
RoHS Compliant
Parts with Similar Specs
Trend Analysis
Datasheet PDF
- Datasheets :
Conclusion
The ESP32 is faster than the ESP8266 ;
The ESP32 comes with more GPIOs with multiple functions;
The ESP32 supports analog measurements on 18 channels (analog-enabled pins) versus just one 10-bit ADC pin on the ESP8266 ;
The ESP32 supports Bluetooth while the ESP8266 doesn't;
The ESP32 is dual-core, and the ESP8266 is single core;
The ESP8266 is cheaper than the ESP32 ;
The ESP8266 has a wider community (although we don’t think that at this point, the difference is that big);
For many IoT and Wi-Fi projects, the ESP8266 can do the job for a lower price;
Both boards can be programmed with the Arduino core using Arduino IDE or other supported IDEs.
Both boards support MicroPython firmware.
- LT1013 Dual Precision Op Amp: Pinout, Equivalent and Datasheet
19 November 20213250
- STM32H750VBT6: Features, Applications, and Datasheet
31 October 20232900
- LT1083CK Voltage Regulator: Feature, Specification, and Datasheet
02 July 20211096
- NE555 Precision Timer: Features, Specifications and Applications
11 May 20211067
- INA226AIDGSR Amplifier: Pinout, INA226, INA226 vs INA260
10 March 20223161
- ICL7107 ADC Display Driver: Price, Application and Datasheet
25 August 20212756
- DS1693 RTC: Datasheet, Pinout, Features
31 August 2021384
- 2SD2499 NPN Transistor: 1500V, TO-3PF, 2SD2499 Equivalents and Pinout
08 January 20221315
- Shunt Resistors in Automotive and Power Electronics: A Comprehensive Guide to Selection and Applications
04 August 20251342
- What is Network Topology?
23 December 20213376
- Understanding RFID Antennas and Their Role in Modern Technology
30 June 2025481
- Analog-to-Digital Converters (ADCs): Decrypting Resolutions and Sampling Rates
24 February 20223855
- STM32U5: The Most Complex Low-power MCU
19 January 20227254
- NPN Transistors and PNP Transistors
29 October 20206880
- What is a 18650 Lithium Battery?
15 December 20217702
- HIKSEMI Authorized Distributor | UTMEL Electronics
15 November 20232288
RF Solutions
In Stock: 116
United States
China
Canada
Japan
Russia
Germany
United Kingdom
Singapore
Italy
Hong Kong(China)
Taiwan(China)
France
Korea
Mexico
Netherlands
Malaysia
Austria
Spain
Switzerland
Poland
Thailand
Vietnam
India
United Arab Emirates
Afghanistan
Åland Islands
Albania
Algeria
American Samoa
Andorra
Angola
Anguilla
Antigua & Barbuda
Argentina
Armenia
Aruba
Australia
Azerbaijan
Bahamas
Bahrain
Bangladesh
Barbados
Belarus
Belgium
Belize
Benin
Bermuda
Bhutan
Bolivia
Bonaire, Sint Eustatius and Saba
Bosnia & Herzegovina
Botswana
Brazil
British Indian Ocean Territory
British Virgin Islands
Brunei
Bulgaria
Burkina Faso
Burundi
Cabo Verde
Cambodia
Cameroon
Cayman Islands
Central African Republic
Chad
Chile
Christmas Island
Cocos (Keeling) Islands
Colombia
Comoros
Congo
Congo (DRC)
Cook Islands
Costa Rica
Côte d’Ivoire
Croatia
Cuba
Curaçao
Cyprus
Czechia
Denmark
Djibouti
Dominica
Dominican Republic
Ecuador
Egypt
El Salvador
Equatorial Guinea
Eritrea
Estonia
Eswatini
Ethiopia
Falkland Islands
Faroe Islands
Fiji
Finland
French Guiana
French Polynesia
Gabon
Gambia
Georgia
Ghana
Gibraltar
Greece
Greenland
Grenada
Guadeloupe
Guam
Guatemala
Guernsey
Guinea
Guinea-Bissau
Guyana
Haiti
Honduras
Hungary
Iceland
Indonesia
Iran
Iraq
Ireland
Isle of Man
Israel
Jamaica
Jersey
Jordan
Kazakhstan
Kenya
Kiribati
Kosovo
Kuwait
Kyrgyzstan
Laos
Latvia
Lebanon
Lesotho
Liberia
Libya
Liechtenstein
Lithuania
Luxembourg
Macao(China)
Madagascar
Malawi
Maldives
Mali
Malta
Marshall Islands
Martinique
Mauritania
Mauritius
Mayotte
Micronesia
Moldova
Monaco
Mongolia
Montenegro
Montserrat
Morocco
Mozambique
Myanmar
Namibia
Nauru
Nepal
New Caledonia
New Zealand
Nicaragua
Niger
Nigeria
Niue
Norfolk Island
North Korea
North Macedonia
Northern Mariana Islands
Norway
Oman
Pakistan
Palau
Palestinian Authority
Panama
Papua New Guinea
Paraguay
Peru
Philippines
Pitcairn Islands
Portugal
Puerto Rico
Qatar
Réunion
Romania
Rwanda
Samoa
San Marino
São Tomé & Príncipe
Saudi Arabia
Senegal
Serbia
Seychelles
Sierra Leone
Sint Maarten
Slovakia
Slovenia
Solomon Islands
Somalia
South Africa
South Sudan
Sri Lanka
St Helena, Ascension, Tristan da Cunha
St. Barthélemy
St. Kitts & Nevis
St. Lucia
St. Martin
St. Pierre & Miquelon
St. Vincent & Grenadines
Sudan
Suriname
Svalbard & Jan Mayen
Sweden
Syria
Tajikistan
Tanzania
Timor-Leste
Togo
Tokelau
Tonga
Trinidad & Tobago
Tunisia
Turkey
Turkmenistan
Turks & Caicos Islands
Tuvalu
U.S. Outlying Islands
U.S. Virgin Islands
Uganda
Ukraine
Uruguay
Uzbekistan
Vanuatu
Vatican City
Venezuela
Wallis & Futuna
Yemen
Zambia
Zimbabwe