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Infineon IRHSNA57Z60SCSD

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IRHSNA57Z60SCSD

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IRHSNA57Z60SCSD information

Specifications
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Product Details
Infineon IRHSNA57Z60SCSD technical specifications, attributes, parameters and parts with similar specifications to Infineon IRHSNA57Z60SCSD.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    Production (Last Updated: 2 years ago)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    3
  • Transistor Element Material

    The "Transistor Element Material" parameter in electronic components refers to the material used to construct the transistor within the component. Transistors are semiconductor devices that amplify or switch electronic signals and are a fundamental building block in electronic circuits. The material used for the transistor element can significantly impact the performance and characteristics of the component. Common materials used for transistor elements include silicon, germanium, and gallium arsenide, each with its own unique properties and suitability for different applications. The choice of transistor element material is crucial in designing electronic components to meet specific performance requirements such as speed, power efficiency, and temperature tolerance.

    SILICON
  • RoHS
    Non-Compliant
  • Package Description
    CHIP CARRIER, R-CBCC-N3
  • Package Style
    CHIP CARRIER
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Manufacturer Part Number
    IRHSNA57Z60SCSD
  • Package Shape
    RECTANGULAR
  • Manufacturer
    Infineon Technologies AG
  • Number of Elements
    1
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    INFINEON TECHNOLOGIES AG
  • Risk Rank
    5.67
  • Drain Current-Max (ID)
    75 A
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    NO LEAD
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    compliant
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-CBCC-N3
  • Configuration

    The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

    SINGLE WITH BUILT-IN DIODE
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ENHANCEMENT MODE
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    250 W
  • Case Connection

    Case Connection refers to the method by which an electronic component's case or housing is connected to the electrical circuit. This connection is important for grounding purposes, mechanical stability, and heat dissipation. The case connection can vary depending on the type of component and its intended application. It is crucial to ensure a secure and reliable case connection to maintain the overall performance and safety of the electronic device.

    DRAIN
  • Transistor Application

    In the context of electronic components, the parameter "Transistor Application" refers to the specific purpose or function for which a transistor is designed and used. Transistors are semiconductor devices that can amplify or switch electronic signals and are commonly used in various electronic circuits. The application of a transistor can vary widely depending on its design and characteristics, such as whether it is intended for audio amplification, digital logic, power control, or radio frequency applications. Understanding the transistor application is important for selecting the right type of transistor for a particular circuit or system to ensure optimal performance and functionality.

    SWITCHING
  • Polarity/Channel Type

    In electronic components, the parameter "Polarity/Channel Type" refers to the characteristic that determines the direction of current flow or the type of signal that can be accommodated by the component. For components like diodes and transistors, polarity indicates the direction in which current can flow through the component, such as forward bias or reverse bias for diodes. For components like MOSFETs or JFETs, the channel type refers to whether the component is an N-channel or P-channel device, which determines the type of charge carriers that carry current through the component. Understanding the polarity or channel type of a component is crucial for proper circuit design and ensuring that the component is connected correctly to achieve the desired functionality.

    N-CHANNEL
  • Continuous Drain Current (ID)

    Continuous Drain Current (ID) is a key parameter in electronic components, particularly in field-effect transistors (FETs) such as MOSFETs. It refers to the maximum current that can flow continuously through the drain terminal of the FET without causing damage to the component. This parameter is crucial for determining the power handling capability of the FET and is specified by the manufacturer in the component's datasheet. Designers must ensure that the actual operating current does not exceed the specified Continuous Drain Current to prevent overheating and potential failure of the component.

    75 A
  • Drain-source On Resistance-Max

    Drain-source On Resistance-Max, commonly referred to as RDS(on) max, is a specification for MOSFETs that indicates the maximum resistance between the drain and source terminals when the device is turned on. This parameter is critical for assessing the efficiency of a MOSFET in a circuit, as lower values result in reduced power loss and heat generation during operation. It is measured in ohms and is influenced by factors such as temperature and gate-to-source voltage. Understanding RDS(on) max is essential for optimizing performance in power management and switching applications.

    0.0035 Ω
  • Drain to Source Breakdown Voltage

    Drain to Source Breakdown Voltage, often denoted as V(BR) D-S, is a critical parameter in electronic components, particularly in field-effect transistors (FETs) and metal-oxide-semiconductor FETs (MOSFETs). It represents the maximum voltage that can be applied between the drain and source terminals of the device without causing breakdown or permanent damage. Exceeding this voltage can lead to excessive current flow, resulting in thermal failure or destruction of the component. It is essential for ensuring reliable operation in circuit designs where high voltages may be encountered.

    30 V
  • Pulsed Drain Current-Max (IDM)

    The parameter "Pulsed Drain Current-Max (IDM)" in electronic components refers to the maximum current that the device can handle when operated under pulsed conditions. This specification is important for understanding the device's capability to handle short bursts of high current without causing damage. It is typically measured in amperes and is specified for a specific pulse width and duty cycle. Designers use this parameter to ensure that the component can withstand transient current spikes without failing, making it crucial for applications where pulsed operation is common, such as in power electronics and RF circuits.

    300 A
  • DS Breakdown Voltage-Min

    The parameter "DS Breakdown Voltage-Min" in electronic components refers to the minimum voltage at which the device will experience a breakdown in its Drain-Source (DS) junction. This voltage represents the point at which the component can no longer effectively regulate or control the flow of current, leading to potential damage or failure. It is an important specification to consider when designing or selecting components for a circuit, as exceeding this breakdown voltage can result in permanent damage to the device. Manufacturers provide this specification to ensure proper usage and to help engineers determine the appropriate operating conditions for the component.

    30 V
  • Avalanche Energy Rating (Eas)

    Avalanche Energy Rating (Eas) is a parameter that quantifies the energy handling capability of a semiconductor device, particularly during avalanche breakdown conditions. It indicates the maximum energy that the device can withstand without being damaged when it experiences an avalanche effect. This rating is crucial for applications where devices might be exposed to over-voltage or other conditions that could cause unintended breakdown, ensuring reliability and longevity in operation. The Eas value helps designers select appropriate components for circuits that may encounter transient events.

    500 mJ
  • FET Technology

    Field-Effect Transistor (FET) technology is a type of semiconductor device commonly used in electronic components such as transistors and integrated circuits. FETs operate by controlling the flow of current through a semiconductor channel using an electric field. There are several types of FETs, including Metal-Oxide-Semiconductor FETs (MOSFETs) and Junction FETs (JFETs), each with its own characteristics and applications. FET technology offers advantages such as high input impedance, low power consumption, and fast switching speeds, making it suitable for a wide range of electronic devices and circuits. Overall, FET technology plays a crucial role in modern electronics by enabling efficient and reliable signal processing and amplification.

    METAL-OXIDE SEMICONDUCTOR
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Download datasheets and manufacturer documentation for Infineon IRHSNA57Z60SCSD.

IRHSNA57Z60SCSD Overview

There is an avalanche breakdown in which energy is applied to the MOSFET to cause it to break down, and this energy is called avalanche energy, and the avalanche energy rating (Eas) is 500 mJ.This device conducts a continuous drain current (ID) of 75 A, which is the maximum continuous current transistor can conduct.Using VGS=30 V and a specified value of ID, the drain-source breakdown voltage is VDS at which a specified value of ID flows. This device has a drain-source breakdown voltage of 30 V (that is, no charge flow from drain to source).Pulsed drain current is maximum rated peak drain current 300 A.A normal operation of the DS requires keeping the breakdown voltage above 30 V.

IRHSNA57Z60SCSD Features

the avalanche energy rating (Eas) is 500 mJ
a continuous drain current (ID) of 75 A
a drain-to-source breakdown voltage of 30 V voltage
based on its rated peak drain current 300 A.

IRHSNA57Z60SCSD Applications

There are a lot of Infineon
IRHSNA57Z60SCSD applications of single MOSFETs transistors.


  • Motor drives and Uninterruptible Power Supplies
  • Micro Solar Inverter
  • DC/DC converters
  • Power Tools
  • Motor Drives and Uninterruptible Power Supples
  • Synchronous Rectification
  • Battery Protection Circuit
  • Telecom 1 Sever Power Supplies
  • Industrial Power Supplies
  • PFC stages, hard switching PWM stages and resonant switching
IRHSNA57Z60SCSD Relevant information

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