Littelfuse IXFN170N30P
Littelfuse IXFN170N30P
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Littelfuse IXFN170N30P

Manufacturer No:

IXFN170N30P

Manufacturer:

Littelfuse

Utmel No:

1475-IXFN170N30P

Package:

-

ECAD Model:

Description:

IXFN170N30P datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Littelfuse stock available at Utmel

Quantity:

Unit Price: $41.621912

Ext Price: $41.62

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In Stock : 51

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $41.621912

    $41.62

  • 10

    $39.265955

    $392.66

  • 100

    $37.043354

    $3,704.34

  • 500

    $34.946560

    $17,473.28

  • 1000

    $32.968453

    $32,968.45

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IXFN170N30P information

Specifications
Littelfuse IXFN170N30P technical specifications, attributes, parameters and parts with similar specifications to Littelfuse IXFN170N30P.
  • Type
    Parameter
  • EU RoHS
    Compliant with Exemption
  • ECCN (US)
    EAR99
  • HTS
    8541.29.00.95
  • Automotive
    No
  • PPAP
    No
  • Category
    Power MOSFET
  • Process Technology
    HiperFET
  • Channel Mode
    Enhancement
  • Number of Elements per Chip
    1
  • Maximum Drain Source Voltage (V)
    300
  • Maximum Gate Source Voltage (V)
    ±20
  • Maximum Continuous Drain Current (A)
    138
  • Maximum Drain Source Resistance (MOhm)
    18@10V
  • Typical Gate Charge @ Vgs (nC)
    258@10V
  • Typical Gate Charge @ 10V (nC)
    258
  • Typical Input Capacitance @ Vds (pF)
    20@25V
  • Maximum Power Dissipation (mW)
    890000
  • Typical Fall Time (ns)
    16
  • Typical Rise Time (ns)
    29
  • Typical Turn-Off Delay Time (ns)
    79
  • Typical Turn-On Delay Time (ns)
    41
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    150
  • Mounting
    Screw
  • Package Height
    9.6(Max)
  • Package Width
    25.42(Max)
  • Package Length
    38.23(Max)
  • PCB changed
    4
  • Standard Package Name
    SOT
  • Supplier Package
    SOT-227B
  • Lead Shape
    Screw
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Pin Count

    a count of all of the component leads (or pins)

    4
  • Configuration

    The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

    Single Dual Source
  • Channel Type

    In electronic components, the parameter "Channel Type" refers to the type of channel through which electrical signals or current flow within the component. This parameter is commonly associated with field-effect transistors (FETs) and other semiconductor devices. The channel type can be categorized as either N-channel or P-channel, depending on the polarity of the majority charge carriers (electrons or holes) that carry the current within the channel. N-channel devices have an electron-conducting channel, while P-channel devices have a hole-conducting channel. Understanding the channel type is crucial for proper circuit design and component selection to ensure compatibility and optimal performance.

    N
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