

MagnaChip MDD1051RH
Manufacturer No:
MDD1051RH
Tiny WHSLManufacturer:
Utmel No:
1520-MDD1051RH
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Description:
MDD1051RH datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from MagnaChip stock available at Utmel
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In Stock : 50000
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- TypeParameter
- Material
In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.
Si - EU RoHSCompliant
- ECCN (US)EAR99
- HTS8541.29.00.95
- AutomotiveUnknown
- PPAPUnknown
- CategoryPower MOSFET
- Process TechnologyTMOS
- Channel ModeEnhancement
- Number of Elements per Chip1
- Maximum Drain Source Voltage (V)150
- Maximum Gate Source Voltage (V)±20
- Maximum Gate Threshold Voltage (V)3.2
- Maximum Continuous Drain Current (A)28
- Maximum Gate Source Leakage Current (nA)100
- Maximum IDSS (uA)1
- Typical Gate Charge @ Vgs (nC)19.6@10V
- Typical Gate Charge @ 10V (nC)19.6
- Typical Input Capacitance @ Vds (pF)1270@40V
- Maximum Power Dissipation (mW)70000
- Typical Fall Time (ns)5
- Typical Rise Time (ns)10
- Typical Turn-Off Delay Time (ns)20
- Typical Turn-On Delay Time (ns)15
- Minimum Operating Temperature (°C)-55
- Maximum Operating Temperature (°C)150
- MountingSurface Mount
- Package Height2.39(Max)
- Package Width6.1
- Package Length6.73(Max)
- PCB changed2
- TabTab
- Standard Package NameTO-252
- Supplier PackageDPAK
- Lead ShapeGull-wing
- Reflow Temperature-Max (s)NOT SPECIFIED
- Rohs CodeYes
- Manufacturer Part NumberMDD1051RH
- ManufacturerMagnaChip Semiconductor Ltd
- Part Life Cycle CodeActive
- Ihs ManufacturerMAGNACHIP SEMICONDUCTOR LTD
- Risk Rank5.73
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape and Reel - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
NOT SPECIFIED - Reach Compliance Code
Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.
unknown - Pin Count
a count of all of the component leads (or pins)
3 - Configuration
The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.
Single - Channel Type
In electronic components, the parameter "Channel Type" refers to the type of channel through which electrical signals or current flow within the component. This parameter is commonly associated with field-effect transistors (FETs) and other semiconductor devices. The channel type can be categorized as either N-channel or P-channel, depending on the polarity of the majority charge carriers (electrons or holes) that carry the current within the channel. N-channel devices have an electron-conducting channel, while P-channel devices have a hole-conducting channel. Understanding the channel type is crucial for proper circuit design and component selection to ensure compatibility and optimal performance.
N