NXP USA Inc. MRFE6VS25LR5 Real Photo with Scale Bar
NXP USA Inc. MRFE6VS25LR5 Real Photo with Scale Bar
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NXP USA Inc. MRFE6VS25LR5
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NXP USA Inc. MRFE6VS25LR5

Manufacturer No:

MRFE6VS25LR5

Manufacturer:

NXP USA Inc.

Utmel No:

1786-MRFE6VS25LR5

Package:

NI-360

Usage Grade:

  • Military
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  • Industrial
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  • Industrial
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  • Industrial
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ECAD Model:

Description:

FET VHV6E 25W 50V NI360L

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MRFE6VS25LR5 information

Specifications
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Product Details
Product Comparison
NXP USA Inc. MRFE6VS25LR5 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MRFE6VS25LR5.
  • Type
    Parameter
  • Factory Lead Time
    10 Weeks
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    NI-360
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Transistor Element Material

    The "Transistor Element Material" parameter in electronic components refers to the material used to construct the transistor within the component. Transistors are semiconductor devices that amplify or switch electronic signals and are a fundamental building block in electronic circuits. The material used for the transistor element can significantly impact the performance and characteristics of the component. Common materials used for transistor elements include silicon, germanium, and gallium arsenide, each with its own unique properties and suitability for different applications. The choice of transistor element material is crucial in designing electronic components to meet specific performance requirements such as speed, power efficiency, and temperature tolerance.

    SILICON
  • Number of Elements
    1
  • Operating Temperature (Max.)
    150°C
  • Operating Temperature (Min.)
    -40°C
  • Voltage Rated

    RATED voltage is the voltage on the nameplate - the "design point" for maximum power throughput and safe thermal operation.

    133V
  • Usage Level
    Automotive grade
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2012
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    Not Applicable
  • Number of Terminations
    2
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8541.29.00.75
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    FLAT
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    512MHz
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    MRFE6VS25
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PDFM-F2
  • Configuration

    The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

    SINGLE
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ENHANCEMENT MODE
  • Current - Test

    Current - Test is a parameter in electronic components that refers to the maximum current that the component can handle during testing without being damaged. This parameter is crucial for determining the operational limits of the component and ensuring its reliability under specified conditions. It is typically specified in the component's datasheet and is important for designers and engineers to consider when designing circuits to prevent overloading the component. Testing the component at or below the specified "Current - Test" value helps ensure its proper functioning and longevity in the intended application.

    10mA
  • Polarity/Channel Type

    In electronic components, the parameter "Polarity/Channel Type" refers to the characteristic that determines the direction of current flow or the type of signal that can be accommodated by the component. For components like diodes and transistors, polarity indicates the direction in which current can flow through the component, such as forward bias or reverse bias for diodes. For components like MOSFETs or JFETs, the channel type refers to whether the component is an N-channel or P-channel device, which determines the type of charge carriers that carry current through the component. Understanding the polarity or channel type of a component is crucial for proper circuit design and ensuring that the component is connected correctly to achieve the desired functionality.

    N-CHANNEL
  • Transistor Type

    Transistor type refers to the classification of transistors based on their operation and construction. The two primary types are bipolar junction transistors (BJTs) and field-effect transistors (FETs). BJTs use current to control the flow of current, while FETs utilize voltage to control current flow. Each type has its own subtypes, such as NPN and PNP for BJTs, and MOSFETs and JFETs for FETs, impacting their applications and characteristics in electronic circuits.

    LDMOS
  • Gain

    In electronic components, "Gain" refers to the ratio of the output signal amplitude to the input signal amplitude. It is a measure of the amplification provided by the component, such as a transistor or operational amplifier. Gain is typically expressed in decibels (dB) or as a numerical value, indicating how much the signal is amplified by the component.A higher gain value indicates a greater amplification of the input signal, while a lower gain value indicates less amplification. Gain is an important parameter in designing and analyzing electronic circuits, as it determines the overall performance and functionality of the system. Different components have different gain characteristics, and understanding the gain of a component is crucial for achieving the desired signal processing or amplification in electronic systems.

    25.9dB
  • DS Breakdown Voltage-Min

    The parameter "DS Breakdown Voltage-Min" in electronic components refers to the minimum voltage at which the device will experience a breakdown in its Drain-Source (DS) junction. This voltage represents the point at which the component can no longer effectively regulate or control the flow of current, leading to potential damage or failure. It is an important specification to consider when designing or selecting components for a circuit, as exceeding this breakdown voltage can result in permanent damage to the device. Manufacturers provide this specification to ensure proper usage and to help engineers determine the appropriate operating conditions for the component.

    133V
  • Power - Output

    Power Output in electronic components refers to the amount of electrical power that a device can deliver to a load. It is typically measured in watts and indicates the effectiveness of the component in converting electrical energy into usable work or signal. Power Output can vary based on the component's design, operating conditions, and intended application, making it a critical factor in the performance of amplifiers, power supplies, and other electronic devices. Understanding the Power Output helps in selecting appropriate components for specific applications to ensure efficiency and reliability.

    25W
  • FET Technology

    Field-Effect Transistor (FET) technology is a type of semiconductor device commonly used in electronic components such as transistors and integrated circuits. FETs operate by controlling the flow of current through a semiconductor channel using an electric field. There are several types of FETs, including Metal-Oxide-Semiconductor FETs (MOSFETs) and Junction FETs (JFETs), each with its own characteristics and applications. FET technology offers advantages such as high input impedance, low power consumption, and fast switching speeds, making it suitable for a wide range of electronic devices and circuits. Overall, FET technology plays a crucial role in modern electronics by enabling efficient and reliable signal processing and amplification.

    METAL-OXIDE SEMICONDUCTOR
  • Voltage - Test

    Voltage - Test is a parameter used to specify the maximum voltage that an electronic component can withstand during testing without experiencing damage or failure. This parameter is crucial for ensuring the reliability and safety of the component in various operating conditions. It is typically measured in volts and is important for determining the suitability of the component for specific applications where voltage levels may vary. Manufacturers provide this information in datasheets to help engineers and designers select the appropriate components for their circuits based on the voltage requirements. It is essential to adhere to the specified voltage limits to prevent potential damage to the component and ensure proper functionality.

    50V
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
0 Similar Products Remaining
Download datasheets and manufacturer documentation for NXP USA Inc. MRFE6VS25LR5.

Product Description:

The MRFE6VS25LR5 is a high-performance N-Channel LDMOS transistor designed by NXP USA Inc. This transistor is part of the Discrete Semiconductor Products category, specifically designed for RF applications. With a voltage rating of 133V and a peak reflow temperature of 260°C, this transistor is suitable for a wide range of applications.

Features:

  • High power output of 25W
  • Operating temperature range of -40°C to 150°C
  • Enhancement mode operation
  • Dual terminal configuration with a flat terminal form
  • Surface mountable with a tape and reel packaging
  • Compliant with ROHS3 standards
  • High gain of 25.9dB at a frequency of 512MHz

Applications:

  • Primary applications: RF amplifiers, RF power amplifiers, and RF transmitters
  • Secondary applications: Wireless communication systems, satellite communication systems, and radar systems

Alternative Parts:

  • MRFE6VS25 (base part number)

Embedded Modules:

  • This transistor is used in various embedded modules, including RF transmitters, RF amplifiers, and wireless communication systems.

FAQs:

Q: What is the voltage rating of the MRFE6VS25LR5 transistor? A: The voltage rating of the MRFE6VS25LR5 transistor is 133V.

Q: What is the power output of the MRFE6VS25LR5 transistor? A: The power output of the MRFE6VS25LR5 transistor is 25W.

Q: What is the operating temperature range of the MRFE6VS25LR5 transistor? A: The operating temperature range of the MRFE6VS25LR5 transistor is -40°C to 150°C.

Q: Is the MRFE6VS25LR5 transistor ROHS3 compliant? A: Yes, the MRFE6VS25LR5 transistor is ROHS3 compliant.

Q: What is the frequency range of the MRFE6VS25LR5 transistor? A: The frequency range of the MRFE6VS25LR5 transistor is up to 512MHz.

Q: What is the gain of the MRFE6VS25LR5 transistor? A: The gain of the MRFE6VS25LR5 transistor is 25.9dB.

Q: What is the packaging of the MRFE6VS25LR5 transistor? A: The packaging of the MRFE6VS25LR5 transistor is tape and reel (TR) with a package/case of NI-360.

The three parts on the right have similar specifications to NXP USA Inc. & MRFE6VS25LR5.