

Panjit MMBT3906FN3_R1_00001
Manufacturer No:
MMBT3906FN3_R1_00001
Tiny WHSLManufacturer:
Utmel No:
1854-MMBT3906FN3_R1_00001
Package:
5 mm x 3.2 mm
Description:
MMBT3906FN3_R1_00001 datasheet pdf and Transistors - Bipolar (BJT) - Single product details from Panjit stock available at Utmel
Quantity:
Unit Price: $0.184935
Ext Price: $0.18
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In Stock : 5794
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$0.184935
$0.18
10
$0.174467
$1.74
100
$0.164591
$16.46
500
$0.155275
$77.64
1000
$0.146486
$146.49
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- TypeParameter
- Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
5 mm x 3.2 mm - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Supplier Device Package
The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.
3-DFN (0.6x1) - Duty Cycle - Max55 %
- Maximum Operating Temperature
the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
+ 70 C - Supply Voltage-Max2.625 V
- Unit Weight0.009171 oz
- Minimum Operating Temperature- 20 C
- Factory Pack QuantityFactory Pack Quantity1000
- Supply Voltage-Min2.375 V
- ManufacturerRenesas Electronics
- BrandRenesas Electronics
- RoHSDetails
- Current-Collector (Ic) (Max)200 mA
- MfrPanjit International Inc.
- Product StatusActive
- Emitter- Base Voltage VEBO5 V
- Pd - Power Dissipation250 mW
- Transistor PolarityPNP
- DC Collector/Base Gain hfe Min100
- Collector-Emitter Saturation Voltage400 mV
- Mounting StylesSMD/SMT
- Gain Bandwidth Product fT250 MHz
- Maximum DC Collector Current200 mA
- Collector- Emitter Voltage VCEO Max40 V
- Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
XL - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Reel - Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-55°C ~ 150°C (TJ) - SubcategoryOscillators
- Technology
In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.
Si - Current Rating
Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.
35 mA - Frequency
In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.
20 MHz - Frequency Stability
the variation of output frequency of a crystal oscillator due to external conditions like temperature variation, voltage variation, output load variation, and frequency aging.
25 PPM - Termination Style
"Termination style" in electronic components refers to the method used to connect the component to a circuit board or other electronic devices. It determines how the component's leads or terminals are designed for soldering or mounting onto the circuit board. Common termination styles include through-hole, surface mount, and wire lead terminations.Through-hole components have leads that are inserted through holes in the circuit board and soldered on the other side. Surface mount components have flat terminals that are soldered directly onto the surface of the circuit board. Wire lead terminations involve attaching wires to the component for connection.The choice of termination style depends on factors such as the type of component, the manufacturing process, and the space available on the circuit board. Different termination styles offer various advantages in terms of ease of assembly, reliability, and space efficiency in electronic designs.
SMD/SMT - Configuration
The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.
Single - Load Capacitance
the amount of capacitance measured or computed across the crystal terminals on the PCB. Frequency Tolerance. Frequency tolerance refers to the allowable deviation from nominal, in parts per million (PPM), at a specific temperature, usually +25°C.
15 pF - Power - Max
Power - Max is a parameter that specifies the maximum amount of power that an electronic component can handle without being damaged. It is typically measured in watts and indicates the upper limit of power that can be safely supplied to the component. Exceeding the maximum power rating can lead to overheating, malfunction, or permanent damage to the component. It is important to consider the power-max rating when designing circuits or systems to ensure proper operation and longevity of the electronic components.
250 mW - Product Type
a group of products which fulfill a similar need for a market segment or market as a whole.
Standard Oscillators - Transistor Type
Transistor type refers to the classification of transistors based on their operation and construction. The two primary types are bipolar junction transistors (BJTs) and field-effect transistors (FETs). BJTs use current to control the flow of current, while FETs utilize voltage to control current flow. Each type has its own subtypes, such as NPN and PNP for BJTs, and MOSFETs and JFETs for FETs, impacting their applications and characteristics in electronic circuits.
PNP - DC Current Gain (hFE) (Min) @ Ic, Vce
The parameter "DC Current Gain (hFE) (Min) @ Ic, Vce" in electronic components refers to the minimum value of the DC current gain, denoted as hFE, under specific operating conditions of collector current (Ic) and collector-emitter voltage (Vce). The DC current gain hFE represents the ratio of the collector current to the base current in a bipolar junction transistor (BJT), indicating the amplification capability of the transistor. The minimum hFE value at a given Ic and Vce helps determine the transistor's performance and efficiency in amplifying signals within a circuit. Designers use this parameter to ensure proper transistor selection and performance in various electronic applications.
100 @ 10mA, 1V - Current - Collector Cutoff (Max)
The parameter "Current - Collector Cutoff (Max)" refers to the maximum current at which a transistor or other electronic component will cease to conduct current between the collector and emitter terminals. This parameter is important in determining the maximum current that can flow through the component when it is in the cutoff state. Exceeding this maximum cutoff current can lead to malfunction or damage of the component. It is typically specified in the component's datasheet and is crucial for proper circuit design and operation.
50nA - Vce Saturation (Max) @ Ib, Ic
The parameter "Vce Saturation (Max) @ Ib, Ic" in electronic components refers to the maximum voltage drop across the collector-emitter junction when the transistor is in saturation mode. This parameter is specified at a certain base current (Ib) and collector current (Ic) levels. It indicates the minimum voltage required to keep the transistor fully conducting in saturation mode, ensuring that the transistor operates efficiently and does not enter the cutoff region. Designers use this parameter to ensure proper transistor operation and to prevent overheating or damage to the component.
400mV @ 5mA, 50mA - Voltage - Collector Emitter Breakdown (Max)
Voltage - Collector Emitter Breakdown (Max) is a parameter that specifies the maximum voltage that can be applied between the collector and emitter terminals of a transistor or other semiconductor device before it breaks down and allows excessive current to flow. This parameter is crucial for ensuring the safe and reliable operation of the component within its specified limits. Exceeding the maximum breakdown voltage can lead to permanent damage or failure of the device. Designers and engineers must carefully consider this parameter when selecting components for their circuits to prevent potential issues and ensure proper functionality.
40 V - Frequency - Transition
The parameter "Frequency - Transition" in electronic components refers to the maximum frequency at which a signal transition can occur within the component. It is a crucial specification for digital circuits as it determines the speed at which data can be processed and transmitted. A higher frequency transition allows for faster operation and better performance of the electronic component. It is typically measured in hertz (Hz) or megahertz (MHz) and is specified by the manufacturer to ensure proper functioning of the component within a given frequency range.
250MHz - Output Format
Output formats are used to determine which data is exported and how data is displayed in many areas of OLIB.
LVCMOS - Collector Base Voltage (VCBO)
Collector Base Voltage (VCBO) is the maximum allowable voltage that can be applied between the collector and base terminals of a bipolar junction transistor when the emitter is open. It is a critical parameter that determines the voltage rating of the transistor and helps prevent breakdown in the collector-base junction. Exceeding this voltage can lead to permanent damage or failure of the component.
40 V - Product Category
a particular group of related products.
Standard Clock Oscillators - Width3.2 mm
- Height1.1 mm
- Length5 mm