Vishay Intertechnologies SQ7415CENW-T1_GE3
Vishay Intertechnologies SQ7415CENW-T1_GE3
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Vishay Intertechnologies SQ7415CENW-T1_GE3

Manufacturer No:

SQ7415CENW-T1_GE3

Utmel No:

2668-SQ7415CENW-T1_GE3

Package:

-

ECAD Model:

Description:

Power Field-Effect Transistor

Quantity:

Unit Price: $0.485969

Ext Price: $0.49

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

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In Stock : 2904

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $0.485969

    $0.49

  • 10

    $0.458461

    $4.58

  • 100

    $0.432510

    $43.25

  • 500

    $0.408029

    $204.01

  • 1000

    $0.384933

    $384.93

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
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SQ7415CENW-T1_GE3 information

Specifications
Documents & Media
Vishay Intertechnologies SQ7415CENW-T1_GE3 technical specifications, attributes, parameters and parts with similar specifications to Vishay Intertechnologies SQ7415CENW-T1_GE3.
  • Type
    Parameter
  • Factory Lead Time
    15 Weeks
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    8
  • Transistor Element Material

    The "Transistor Element Material" parameter in electronic components refers to the material used to construct the transistor within the component. Transistors are semiconductor devices that amplify or switch electronic signals and are a fundamental building block in electronic circuits. The material used for the transistor element can significantly impact the performance and characteristics of the component. Common materials used for transistor elements include silicon, germanium, and gallium arsenide, each with its own unique properties and suitability for different applications. The choice of transistor element material is crucial in designing electronic components to meet specific performance requirements such as speed, power efficiency, and temperature tolerance.

    SILICON
  • Exterior Housing Material

    Exterior Housing Material in electronic components refers to the material used to encase and protect the internal electronic circuitry of a device. This material serves as the outer shell or casing of the component, providing physical protection from environmental factors such as moisture, dust, and impact. Common exterior housing materials for electronic components include plastics, metals, and composite materials. The choice of housing material is important as it can impact the component's durability, thermal management, and overall performance in various operating conditions. Manufacturers select the appropriate exterior housing material based on the specific requirements of the electronic component and the intended application.

    1
  • Rohs Code
    Yes
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    VISHAY INTERTECHNOLOGY INC
  • Drain Current-Max (ID)
    16 A
  • Operating Temperature-Max
    175 °C
  • Operating Temperature-Min
    -55 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Shape
    SQUARE
  • Package Style
    SMALL OUTLINE
  • Turn-off Time-Max (toff)
    72 ns
  • Turn-on Time-Max (ton)
    24 ns
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    FLAT
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    unknown
  • Reference Standard

    In the context of electronic components, the term "Reference Standard" typically refers to a specific set of guidelines, specifications, or requirements that serve as a benchmark for evaluating the quality, performance, and characteristics of the component. These standards are established by organizations such as the International Electrotechnical Commission (IEC), the Institute of Electrical and Electronics Engineers (IEEE), or specific industry bodies.Reference standards help ensure consistency and interoperability among different components, as they provide a common framework for manufacturers, designers, and users to adhere to. They outline parameters such as electrical properties, mechanical dimensions, environmental conditions, and safety considerations that the component must meet to be considered compliant.By referencing these standards, manufacturers can design and produce components that meet industry-recognized criteria, which in turn helps users select the right components for their applications with confidence. Adhering to reference standards also facilitates regulatory compliance and promotes overall quality and reliability in electronic systems.

    AEC-Q101
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PDSO-F8
  • Configuration

    The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

    SINGLE WITH BUILT-IN DIODE
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ENHANCEMENT MODE
  • Case Connection

    Case Connection refers to the method by which an electronic component's case or housing is connected to the electrical circuit. This connection is important for grounding purposes, mechanical stability, and heat dissipation. The case connection can vary depending on the type of component and its intended application. It is crucial to ensure a secure and reliable case connection to maintain the overall performance and safety of the electronic device.

    DRAIN
  • Polarity/Channel Type

    In electronic components, the parameter "Polarity/Channel Type" refers to the characteristic that determines the direction of current flow or the type of signal that can be accommodated by the component. For components like diodes and transistors, polarity indicates the direction in which current can flow through the component, such as forward bias or reverse bias for diodes. For components like MOSFETs or JFETs, the channel type refers to whether the component is an N-channel or P-channel device, which determines the type of charge carriers that carry current through the component. Understanding the polarity or channel type of a component is crucial for proper circuit design and ensuring that the component is connected correctly to achieve the desired functionality.

    P-CHANNEL
  • Drain-source On Resistance-Max

    Drain-source On Resistance-Max, commonly referred to as RDS(on) max, is a specification for MOSFETs that indicates the maximum resistance between the drain and source terminals when the device is turned on. This parameter is critical for assessing the efficiency of a MOSFET in a circuit, as lower values result in reduced power loss and heat generation during operation. It is measured in ohms and is influenced by factors such as temperature and gate-to-source voltage. Understanding RDS(on) max is essential for optimizing performance in power management and switching applications.

    0.065 Ω
  • Pulsed Drain Current-Max (IDM)

    The parameter "Pulsed Drain Current-Max (IDM)" in electronic components refers to the maximum current that the device can handle when operated under pulsed conditions. This specification is important for understanding the device's capability to handle short bursts of high current without causing damage. It is typically measured in amperes and is specified for a specific pulse width and duty cycle. Designers use this parameter to ensure that the component can withstand transient current spikes without failing, making it crucial for applications where pulsed operation is common, such as in power electronics and RF circuits.

    64 A
  • DS Breakdown Voltage-Min

    The parameter "DS Breakdown Voltage-Min" in electronic components refers to the minimum voltage at which the device will experience a breakdown in its Drain-Source (DS) junction. This voltage represents the point at which the component can no longer effectively regulate or control the flow of current, leading to potential damage or failure. It is an important specification to consider when designing or selecting components for a circuit, as exceeding this breakdown voltage can result in permanent damage to the device. Manufacturers provide this specification to ensure proper usage and to help engineers determine the appropriate operating conditions for the component.

    60 V
  • Avalanche Energy Rating (Eas)

    Avalanche Energy Rating (Eas) is a parameter that quantifies the energy handling capability of a semiconductor device, particularly during avalanche breakdown conditions. It indicates the maximum energy that the device can withstand without being damaged when it experiences an avalanche effect. This rating is crucial for applications where devices might be exposed to over-voltage or other conditions that could cause unintended breakdown, ensuring reliability and longevity in operation. The Eas value helps designers select appropriate components for circuits that may encounter transient events.

    26 mJ
  • FET Technology

    Field-Effect Transistor (FET) technology is a type of semiconductor device commonly used in electronic components such as transistors and integrated circuits. FETs operate by controlling the flow of current through a semiconductor channel using an electric field. There are several types of FETs, including Metal-Oxide-Semiconductor FETs (MOSFETs) and Junction FETs (JFETs), each with its own characteristics and applications. FET technology offers advantages such as high input impedance, low power consumption, and fast switching speeds, making it suitable for a wide range of electronic devices and circuits. Overall, FET technology plays a crucial role in modern electronics by enabling efficient and reliable signal processing and amplification.

    METAL-OXIDE SEMICONDUCTOR
  • Power Dissipation-Max (Abs)

    Power Dissipation-Max (Abs) refers to the maximum amount of power that an electronic component can dissipate without undergoing thermal damage or degradation. This value is crucial for ensuring reliable operation, as exceeding it can result in overheating and failure. It is typically specified in watts and serves as a critical parameter for designers to determine proper heat management strategies in circuits. Properly managing the power dissipation is essential for the longevity and performance of electronic devices.

    53 W
  • Feedback Cap-Max (Crss)

    Feedback Cap-Max (Crss) refers to the maximum capacitance between the output and input of an electronic component, such as a transistor or an operational amplifier. It indicates the level of feedback capacitance that can negatively affect the performance, stability, and bandwidth of the device. A higher Crss value may introduce unintended phase shifts or frequency response issues, making it crucial to consider in circuit design to ensure optimal operation.

    105 pF
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