European Chipmakers Experience Decline Following SMIC's Profit Slump
European chipmakers faced a dip in their stock prices on Friday, mirroring the fall in some Asian semiconductor companies. This decline comes after China's Semiconductor Manufacturing International Corp (SMIC) reported an 80% decrease in its quarterly income. SMIC's profit attributable to owners dropped to approximately $94 million in the three months ending September 30, a significant decline from the $470.8 million recorded in the same period last year. Additionally, the company's quarterly revenue decreased by 15% to $1.62 billion, and its gross margin nearly halved to 19.8% from 38.9% in the previous year. The chipmaker also predicted an even lower gross margin in the fourth quarter and highlighted higher capital expenditures for 2023. These projections were made due to a drop in capacity utilization caused by sluggish demand for semiconductors. Following SMIC's announcement, its Hong Kong shares experienced a 6.8% decline, while shares of rival company Hua Hong Semiconductor Ltd plummeted over 15%. The impact of these losses spread to Europe, where semiconductor equipment maker ASML, the largest tech firm on the continent, saw a slight decrease in mid-morning trading. Other European chipmakers, such as Infineon Technologies and STMicroelectronics, also experienced slumps of over 2%, while ASM International in the Netherlands lost 1.6%. SMIC's disappointing results come after TSMC, Samsung, and SK Hynix reported dismal quarterly performances, indicating a sustained weakness in global chip demand. Additionally, ASML reported lower-than-expected orders in its latest quarter and issued a rare warning regarding an uncertain recovery in customer spending. Major chipmakers have been grappling with declining demand following a significant rise in interest rates over the past year. Furthermore, doubts have been raised about the long-term impact of the development of generative artificial intelligence (AI) on chip demand. Softbank's Arm, which designs chips used by major semiconductor manufacturers, also reported weak quarterly results and projected disappointing revenue and profit figures for the current quarter. Apple, a major customer for Asian chip firms, has also experienced four consecutive quarters of declining sales. It remains to be seen how the chip market will navigate these challenges and whether demand will rebound in the near future.
The 2026 Memory Super-Cycle: Navigating the 500% Surge in DRAM and NAND Flash PricesUTMEL17 June 20268078Driven by massive AI capital expenditures, the 2026 semiconductor market is experiencing a historic memory super-cycle, sending DRAM and NAND Flash prices soaring. With manufacturers prioritizing high-margin AI memory like HBM, severe shortages have spilled over to mature nodes, impacting automotive and IoT sectors. To navigate this volatility, procurement teams must secure long-term agreements, diversify suppliers, and optimize designs to mitigate rising BOM costs.
Read More
HBM4 and the Shift to Customized AI Memory: The Advanced Packaging BottleneckUTMEL22 June 20261466The JEDEC HBM4 standard transitions high-bandwidth memory to a customized architecture featuring a 2048-bit interface and logic base dies. While delivering extreme bandwidth for AI accelerators, its resource-intensive production triggers a global DRAM supply squeeze. Procurement teams must navigate rising prices, advanced packaging bottlenecks, and extended lead times by adopting strategic supply chain planning.
Read More
AI Computing Power Gap: How Token Consumption is Reshaping Server Component SourcingUTMEL23 June 2026468As global token consumption drives the transition to high-density 100kW+ AI data centers, power delivery networks require advanced Wide-Bandgap semiconductors (SiC/GaN) and high-capacitance MLCCs. This shift has triggered a component procurement crisis with lead times exceeding 24 weeks. To bypass shortages, hardware buyers must abandon just-in-time manufacturing and leverage independent global distributor networks to secure critical power and passive components.
Read More
Power Semiconductor Procurement After the Nexperia Shake-Up—NXP for Stability, ON for Technology, or Nexperia for Value?UTMEL04 November 20254565The recent supply chain turmoil surrounding Netherlands-based Nexperia has sent shockwaves through the global semiconductor industry, forcing procurement professionals to re-evaluate their sourcing strategies.
Read More
The BSPDN Revolution: Overcoming IR Drop in Sub-2nm GAAFET Nodes with Backside Power DeliveryUTMEL25 June 2026322As semiconductor manufacturing enters the sub-2nm era, Backside Power Delivery Networks (BSPDN) are replacing traditional front-side routing to overcome critical IR drop bottlenecks. By separating power and signal delivery, chipmakers like Intel and TSMC drastically improve performance and density in GAAFET designs. However, this radical shift introduces manufacturing complexities, thermal challenges, and demands advanced packaging and power management solutions.
Read More
Subscribe to Utmel !
H200X064H1T-2-BPanduit Corp
GRM31BR73A102KW01LMurata Electronics
LQG15HH27NH02DMurata Electronics
SLB-25MG3FROHM Semiconductor
PEC11R-4220F-S0024Bourns Inc.
BLM03AX121SZ1DMurata Electronics
101020057Seeed Technology Co., Ltd
ST2-DC24V-FPanasonic Electric Works
SR732ATTD6R80FKOA Speer Electronics, Inc.
EMK107BJ225KA-TTaiyo Yuden


Product
Brand
Articles
Tools










