AD9361 RF Agile Transceiver: 70 MHz to 6.0 GHz RF Chip, AD9361 CSPBGA and Datasheet

UTMEL

Published: 08 January 2022 | Last Updated: 08 January 2022

4770

AD9361BBCZ

AD9361BBCZ

Analog Devices Inc.

TxRx Only 70MHz~6GHz SPI 175mA~445mA - Receiving 240mA~820mA - Transmitting 144-LFBGA, CSPBGA

Purchase Guide

TxRx Only 70MHz~6GHz SPI 175mA~445mA - Receiving 240mA~820mA - Transmitting 144-LFBGA, CSPBGA

The AD9361 is a high-performance, highly integrated radio frequency (RF) Agile Transceiver™ designed for use in 3G and 4G base station applications. This article is going to explain details about the AD9361 rf transceiver.

This video demonstrates details about AD9361 RF Agile Transceiver.

AD9361 RF Agile Transceiver

What is AD9361?

The AD9361 is a high-performance, high-integration radio frequency (RF) Agile Transceiver for 3G and 4G base station applications. It is suited for a wide range of transceiver applications because of its programmability and wideband capability. The device combines an RF front end with a flexible mixed-signal baseband section and built-in frequency synthesizers, making design-in easier by offering a customizable digital interface to a CPU.

The AD9361 operates in the 70MHz to 6.0GHz range, covering most licensed and unlicensed bands. Channel bandwidths from less than 200 kHz to 56MHz are supported. The AD9361 is packaged in a 10mm × 10mm, 144-ball chip-scale package ball grid array (CSP_BGA).


AD9361 Functional Block Diagram

ad9361 functional blocl diagram.jpg

AD9361 Functional Block Diagram

AD9361 CAD Model

ad9361 symbol.jpg

AD9361 Symbol

ad9361 footprint.jpg

AD9361 Footprint

ad9361 3d model.jpg

AD9361 3D Model



Specifications

Analog Devices Inc. AD9361BBCZ technical specifications, attributes, parameters and parts with similar specifications to Analog Devices Inc. AD9361BBCZ.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    PRODUCTION (Last Updated: 2 weeks ago)
  • Factory Lead Time
    8 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Copper, Silver, Tin
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    144-LFBGA, CSPBGA
  • Number of Pins
    144
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e1
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    no
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    144
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    5A991.B
  • Type
    TxRx Only
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    1.3V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8mm
  • Depth

    In electronic components, "Depth" typically refers to the measurement of the distance from the front to the back of the component. It is an important parameter to consider when designing or selecting components for a project, as it determines how much space the component will occupy within a circuit or device. The depth of a component can impact the overall size and layout of the circuit board or enclosure in which it will be installed. It is usually specified in millimeters or inches and is crucial for ensuring proper fit and functionality within the intended application.

    10mm
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    70MHz~6GHz
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    NOT SPECIFIED
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    AD9361
  • Pin Count

    a count of all of the component leads (or pins)

    144
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.3V
  • Protocol

    In electronic components, the parameter "Protocol" refers to a set of rules and standards that govern the communication between devices. It defines the format, timing, sequencing, and error checking methods for data exchange between different components or systems. Protocols ensure that devices can understand and interpret data correctly, enabling them to communicate effectively with each other. Common examples of protocols in electronics include USB, Ethernet, SPI, I2C, and Bluetooth, each with its own specifications for data transmission. Understanding and adhering to protocols is essential for ensuring compatibility and reliable communication between electronic devices.

    LTE
  • Power - Output

    Power Output in electronic components refers to the amount of electrical power that a device can deliver to a load. It is typically measured in watts and indicates the effectiveness of the component in converting electrical energy into usable work or signal. Power Output can vary based on the component's design, operating conditions, and intended application, making it a critical factor in the performance of amplifiers, power supplies, and other electronic devices. Understanding the Power Output helps in selecting appropriate components for specific applications to ensure efficiency and reliability.

    8dBm
  • RF Family/Standard

    The parameter "RF Family/Standard" in electronic components refers to the specific radio frequency (RF) technology or standard that the component complies with or is designed for. RF technology encompasses a wide range of frequencies used for wireless communication, such as Wi-Fi, Bluetooth, cellular networks, and more. Different RF standards dictate the frequency bands, modulation techniques, data rates, and other specifications for communication systems. Understanding the RF family/standard of a component is crucial for ensuring compatibility and optimal performance in RF applications.

    Cellular
  • Serial Interfaces

    A serial interface is a communication interface between two digital systems that transmits data as a series of voltage pulses down a wire. Essentially, the serial interface encodes the bits of a binary number by their "temporal" location on a wire rather than their "spatial" location within a set of wires.

    SPI
  • Current - Receiving

    Current - Receiving refers to the amount of electrical current that an electronic component or device is capable of accepting from a power source or another component in a circuit. It indicates the maximum current that can be safely received without causing damage or malfunction. This parameter is crucial for ensuring compatibility and reliability in electronic designs, as exceeding the rated receiving current can lead to overheating or failure of the component.

    175mA~445mA
  • Current - Transmitting

    Current - Transmitting is a parameter used to describe the maximum amount of electrical current that an electronic component can handle while in the transmitting mode. This parameter is crucial for components such as transistors, diodes, and integrated circuits that are involved in transmitting signals or power within a circuit. Exceeding the specified current transmitting rating can lead to overheating, component failure, or even damage to the entire circuit. Designers and engineers must carefully consider this parameter when selecting components to ensure the reliability and performance of the electronic system.

    240mA~820mA
  • Number of Receivers
    2
  • Noise Figure

    Noise figure (NF) and noise factor (F) are measures of degradation of the signal-to-noise ratio (SNR), caused by components in a signal chain.

    2.5 dB
  • Height
    1mm
  • Length
    10mm
  • Width
    10mm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Contains Lead
0 Similar Products Remaining

AD9361 Features

  • RF 2 × 2 transceiver with integrated 12-bit DACs and ADCs

  • 70MHz to 6.0GHz Band

  • Supports TDD and FDD operation

  • <200 kHz to 56MHz Tunable channel BW

  • 6 Differential or 12 single-ended inputs dual receivers

  • Superior receiver sensitivity with a noise figure <2.5dB

  • Real-time monitor and control signals for manual gain control

  • Independent automatic gain control


AD9361 Application

  • Point to point communication systems

  • Femtocell/picocell/microcell base stations

  • General-purpose radio systems


AD9361_TX Analog Devices Transmitter

AD9361_TX Analog Devices Transmitter.jpg

AD9361_TX  Analog Devices Transmitter


There are three steps to the transmitter model:


  • Filters for digital up-conversion (DUC Filters TX)

  • (Analog Filters TX) Analog filters

  • (RF TX) RF front end

 


The transmitter model can be used to imitate the following behaviors:


  • Attenuation that can be adjusted

  • Noise in the phase of the oscillator

  • Noise floor based on carrier

  • Attenuation and carrier-dependent nonlinearities such as output-referred third-order intercept are examples of attenuation and carrier-dependent nonlinearities (OIP3)

  • Gain imbalance due to attenuation

  • Carrier leak in a local oscillator (LO) that is attenuation dependent


AD9361_RX Analog Devices Receiver

AD9361_RX Analog Devices Receiver.jpg

AD9361_RX Analog Devices Receiver


There are three steps to the transmitter model:


  • Filters for digital up-conversion (DUC Filters TX)

  • (Analog Filters TX) Analog filters

  • (RF TX) RF front end

 


The transmitter model can be used to imitate the following behaviors:


  • Attenuation that can be adjusted

  • Noise in the phase of the oscillator

  • Noise floor based on carrier

  • Attenuation and carrier-dependent nonlinearities such as output-referred third-order intercept are examples of attenuation and carrier-dependent nonlinearities (OIP3)

  • Gain imbalance due to attenuation

  • Carrier leak in a local oscillator (LO) that is attenuation dependent


AD9361 Dimensions

ad9361 dimensions.jpg

 AD9361 Dimensions

AD9361 Manufacturer

Analog Devices (NASDAQ: ADI) is a world leader in the design, manufacture, and marketing of a broad portfolio of high-performance analog, mixed-signal, and digital signal processing (DSP) integrated circuits (ICs) used in virtually all types of electronic equipment. Since our inception in 1965, we have focused on solving the engineering challenges associated with signal processing in electronic equipment. Used by over 100,000 customers worldwide, our signal processing products play a fundamental role in converting, conditioning, and processing real-world phenomena such as temperature, pressure, sound, light, speed, and motion into electrical signals to be used in a wide array of electronic devices.

Trend Analysis

Datasheet PDF

Download datasheets and manufacturer documentation for Analog Devices Inc. AD9361BBCZ.
Frequently Asked Questions

What is the use of AD9361?

The AD9361 RF Agile Transceiver was designed for programmable radio applications that operate over a wide range of modulation schemes and network specifications that require best-in-class performance, high integration, wideband operation, and flexibility.

What is agile transceiver?

The device combines an RF front-end with a flexible mixed-signal baseband section and integrated frequency synthesizers, simplifying design-in by providing a configurable digital interface to a processor.

How does AD9361 work?

The device combines an RF front end with a flexible mixed-signal baseband section and integrated frequency synthesizers, simplifying design-in by providing a configurable digital interface to a processor or FPGA. The AD9361 chip operates in the 70 MHz to 6 GHz range, covering most licensed and unlicensed bands.
AD9361BBCZ

Analog Devices Inc.

In Stock

United States

China

Canada

Japan

Russia

Germany

United Kingdom

Singapore

Italy

Hong Kong(China)

Taiwan(China)

France

Korea

Mexico

Netherlands

Malaysia

Austria

Spain

Switzerland

Poland

Thailand

Vietnam

India

United Arab Emirates

Afghanistan

Åland Islands

Albania

Algeria

American Samoa

Andorra

Angola

Anguilla

Antigua & Barbuda

Argentina

Armenia

Aruba

Australia

Azerbaijan

Bahamas

Bahrain

Bangladesh

Barbados

Belarus

Belgium

Belize

Benin

Bermuda

Bhutan

Bolivia

Bonaire, Sint Eustatius and Saba

Bosnia & Herzegovina

Botswana

Brazil

British Indian Ocean Territory

British Virgin Islands

Brunei

Bulgaria

Burkina Faso

Burundi

Cabo Verde

Cambodia

Cameroon

Cayman Islands

Central African Republic

Chad

Chile

Christmas Island

Cocos (Keeling) Islands

Colombia

Comoros

Congo

Congo (DRC)

Cook Islands

Costa Rica

Côte d’Ivoire

Croatia

Cuba

Curaçao

Cyprus

Czechia

Denmark

Djibouti

Dominica

Dominican Republic

Ecuador

Egypt

El Salvador

Equatorial Guinea

Eritrea

Estonia

Eswatini

Ethiopia

Falkland Islands

Faroe Islands

Fiji

Finland

French Guiana

French Polynesia

Gabon

Gambia

Georgia

Ghana

Gibraltar

Greece

Greenland

Grenada

Guadeloupe

Guam

Guatemala

Guernsey

Guinea

Guinea-Bissau

Guyana

Haiti

Honduras

Hungary

Iceland

Indonesia

Iran

Iraq

Ireland

Isle of Man

Israel

Jamaica

Jersey

Jordan

Kazakhstan

Kenya

Kiribati

Kosovo

Kuwait

Kyrgyzstan

Laos

Latvia

Lebanon

Lesotho

Liberia

Libya

Liechtenstein

Lithuania

Luxembourg

Macao(China)

Madagascar

Malawi

Maldives

Mali

Malta

Marshall Islands

Martinique

Mauritania

Mauritius

Mayotte

Micronesia

Moldova

Monaco

Mongolia

Montenegro

Montserrat

Morocco

Mozambique

Myanmar

Namibia

Nauru

Nepal

New Caledonia

New Zealand

Nicaragua

Niger

Nigeria

Niue

Norfolk Island

North Korea

North Macedonia

Northern Mariana Islands

Norway

Oman

Pakistan

Palau

Palestinian Authority

Panama

Papua New Guinea

Paraguay

Peru

Philippines

Pitcairn Islands

Portugal

Puerto Rico

Qatar

Réunion

Romania

Rwanda

Samoa

San Marino

São Tomé & Príncipe

Saudi Arabia

Senegal

Serbia

Seychelles

Sierra Leone

Sint Maarten

Slovakia

Slovenia

Solomon Islands

Somalia

South Africa

South Sudan

Sri Lanka

St Helena, Ascension, Tristan da Cunha

St. Barthélemy

St. Kitts & Nevis

St. Lucia

St. Martin

St. Pierre & Miquelon

St. Vincent & Grenadines

Sudan

Suriname

Svalbard & Jan Mayen

Sweden

Syria

Tajikistan

Tanzania

Timor-Leste

Togo

Tokelau

Tonga

Trinidad & Tobago

Tunisia

Turkey

Turkmenistan

Turks & Caicos Islands

Tuvalu

U.S. Outlying Islands

U.S. Virgin Islands

Uganda

Ukraine

Uruguay

Uzbekistan

Vanuatu

Vatican City

Venezuela

Wallis & Futuna

Yemen

Zambia

Zimbabwe

Related Parts More