CD4071 Dual Input OR Gate IC: Datasheet, Pinout and Equivalents
90 ns ns 8.65mm mm Gates & Inverters 6.8mA mA 1.75mm mm 129.387224mg mg Surface Mount Surface Mount 3V~18V V 1μA μA









90 ns ns 8.65mm mm Gates & Inverters 6.8mA mA 1.75mm mm 129.387224mg mg Surface Mount Surface Mount 3V~18V V 1μA μA
The CD4071 is a Dual Input OR Gate with Quad package. This article mainly covers datasheet, pinout, equivalent, specifications, and other details about CD4071 gate IC. Furthermore, there is a huge range of semiconductors, capacitors, resistors, and ICs in stock. Welcome your RFQ!

How to Connect IC 4017 Pinouts
- CD4071 Pinout
- Overview of CD4071
- CD4071 CAD Model
- Specifications
- CD4071 Schematic Diagram
- CD4071 Features
- CD4071 Equivalents
- CD4071 Applications
- Where to use CD4071 OR Gate IC
- How to use CD4071 OR Gate IC
- CD4071 Working Principle
- CD4071 Dimensions Outline
- CD4071 Manufacturer
- Parts with Similar Specs
- Trend Analysis
- Datasheet PDF
CD4071 Pinout
CD4071 Pinout
Pin Number | Pin Name | Description |
1,6,10,15 | OR Gate Input pin (A) | First Input pin for the OR gate |
2,5,11,14 | OR Gate Input pin (B) | Second Input pin for the OR gate |
3,4,12,13 | OR Gate Output pin (Q) | Output pin for the OR gate |
7 | Ground | Connect to the ground of the circuit. |
14 | Vcc (Vdd) | Used to power the IC. Typically +5V is used |
Overview of CD4071
The CD4071 is a four-OR gate CMOS device. There are four OR gates built on the device, each with two inputs. It's also known as a Quad 2-Input OR Gate. An OR gate is a logic gate that outputs HIGH if any of the inputs is HIGH. Otherwise, the output is otherwise LOW.
CD4071 CAD Model
Footprint
CD4071 Footprint
3D Model
CD4071 3D Model
Specifications
- TypeParameter
- Lifecycle Status
Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.
ACTIVE (Last Updated: 6 days ago) - Factory Lead Time6 Weeks
- Contact Plating
Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.
Gold - Mount
In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.
Surface Mount - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
14-SOIC (0.154, 3.90mm Width) - Number of Pins14
- Weight129.387224mg
- Logic Level-High3.5V ~ 11V
- Logic Level-Low1.5V ~ 4V
- Number of Elements4
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-55°C~125°C - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR) - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
4000B - JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e4 - Pbfree Code
The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.
yes - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
1 (Unlimited) - Number of Terminations14
- Termination
Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.
SMD/SMT - Packing Method
The packing method in electronic components refers to the technique used to package and protect the component during shipping and handling. It encompasses various forms including tape and reel, tray, tube, or bulk packaging, each suited for different types of components and manufacturing processes. The choice of packing method can affect the ease of handling, storage, and the efficiency of assembly in automated processes. Additionally, it plays a crucial role in ensuring the reliability and integrity of the components until they are used in electronic devices.
TR - Voltage - Supply
Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.
3V~18V - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
DUAL - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Number of Functions4
- Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
5V - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
NOT SPECIFIED - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
CD4071 - Pin Count
a count of all of the component leads (or pins)
14 - Number of Outputs1
- Qualification Status
An indicator of formal certification of qualifications.
Not Qualified - Max Output Current
The maximum current that can be supplied to the load.
6.8mA - Supply Voltage-Min (Vsup)
The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.
3V - Load Capacitance
the amount of capacitance measured or computed across the crystal terminals on the PCB. Frequency Tolerance. Frequency tolerance refers to the allowable deviation from nominal, in parts per million (PPM), at a specific temperature, usually +25°C.
50pF - Output Current
The rated output current is the maximum load current that a power supply can provide at a specified ambient temperature. A power supply can never provide more current that it's rated output current unless there is a fault, such as short circuit at the load.
6.8mA - Propagation Delay
the flight time of packets over the transmission link and is limited by the speed of light.
90 ns - Quiescent Current
The quiescent current is defined as the current level in the amplifier when it is producing an output of zero.
1μA - Logic Function
In electronic components, the term "Logic Function" refers to the specific operation or behavior of a component based on its input signals. It describes how the component processes the input signals to produce the desired output. Logic functions are fundamental to digital circuits and are used to perform logical operations such as AND, OR, NOT, and XOR.Each electronic component, such as logic gates or flip-flops, is designed to perform a specific logic function based on its internal circuitry. By understanding the logic function of a component, engineers can design and analyze complex digital systems to ensure proper functionality and performance. Different logic functions can be combined to create more complex operations, allowing for the creation of sophisticated digital devices and systems.
OR - Number of Inputs2
- Logic Type
Logic Type in electronic components refers to the classification of circuits based on the logical operations they perform. It includes types such as AND, OR, NOT, NAND, NOR, XOR, and XNOR, each defining the relationship between binary inputs and outputs. The logic type determines how the inputs affect the output state based on specific rules of Boolean algebra. This classification is crucial for designing digital circuits and systems, enabling engineers to select appropriate components for desired functionalities.
OR Gate - Max I(ol)
Max I(ol) refers to the maximum output current that a specific electronic component, such as a transistor or integrated circuit, can sink or source. This parameter is crucial in determining the capability of the component to drive external loads without being damaged. It is typically specified in the component's datasheet and is important for ensuring proper operation and reliability of the circuit in which the component is used. Designers must ensure that the output current requirements of the circuit do not exceed the specified "Max I(ol)" value to prevent overloading and potential failure of the component.
0.0068 A - Max Propagation Delay @ V, Max CL
The parameter "Max Propagation Delay @ V, Max CL" in electronic components refers to the maximum amount of time it takes for a signal to propagate through the component from input to output when operating at a specific voltage (V) and driving a maximum specified load capacitance (CL). This parameter is crucial in determining the speed and performance of the component in a circuit. A shorter propagation delay indicates faster signal processing and better overall performance. Designers use this parameter to ensure that signals can be transmitted and received within the required timing constraints in their electronic systems.
90ns @ 15V, 50pF - Schmitt Trigger
A Schmitt Trigger is a type of comparator circuit commonly used in electronics to convert an analog input signal into a digital output signal. It has hysteresis, which means that the output switches at different voltage levels depending on whether the input is rising or falling. This hysteresis helps to eliminate noise and provide a more stable output signal. Schmitt Triggers are often used in applications where noise immunity and signal conditioning are important, such as in signal processing, waveform shaping, and digital logic circuits.
NO - Power Supply Current-Max (ICC)
The parameter "Power Supply Current-Max (ICC)" in electronic components refers to the maximum amount of current that the component will draw from the power supply under specified operating conditions. It is an important specification as it helps determine the power consumption of the component and ensures that the power supply can provide enough current to meet the component's requirements without being overloaded. Exceeding the maximum power supply current can lead to overheating, component damage, or system failure. Designers use this parameter to select an appropriate power supply and ensure the reliable operation of the electronic system.
0.03mA - Height1.75mm
- Length8.65mm
- Width3.91mm
- Thickness
Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.
1.58mm - REACH SVHC
The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.
No SVHC - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant - Lead Free
Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.
Lead Free
CD4071 Schematic Diagram
CD4071 Schematic Diagram
CD4071 Features
Dual Input OR Gate – Quad Package
Typical Operating Voltage: 5V
Operating Voltage Range: -0.5V to +20V
DC input current: ±10mA
Power Dissipation: 500mW
Minimum logic Low voltage @+5V: 1.5V
Minimum Logic High voltage @+5V: 3.5V
Propagation Delay @5V: 250ns (maximum)
Transition Time @5V:200ns (maximum)
Available in 14-pin PDIP, GDIP, PDSO packages
CD4071 Equivalents
CD4072, CD4075, 74LS32, 74LS00, 74LS02, 74LS08, 74LS86
CD4071 Applications
Encoders
Basic Logic Circuits
Networking and Digital Systems
Decoders
Encoders and Decoders
Multiplexers and De-multiplexers
Oscillator circuits
Where to use CD4071 OR Gate IC
This C4071 is used to develop logic-level circuits in digital electronics. There are four OR gates in this IC. You can use this IC if you need OR operation in a low-power application with a wide voltage range. Encoders and Decoders are also designed with it. This IC can also be used in applications that demand the checking of many events. If multiple events occur, some action must be taken, such as checking the temperature or pressure of an industrial plant. CD4071 can be used to detect temperature or a variable. If it surpasses the reference value, the system will receive a command to take action.
How to use CD4071 OR Gate IC
To use any of the OR logic gates on the chip, we must first connect two pins to the power supply, VDD, and GND. The voltage ranges from 3 to 15 volts.
Some chip versions can handle up to 20V. The input pins to the four OR logic gates of the IC are pins A and B. The inputs will determine the output, hence the outputs from the OR logic gates will be Q-pins.
CD4071 Circuit
CD4071 Working Principle
This sample explains how CD4071 works. The OR gate's functioning principle allows us to observe all logical inputs and outputs.
CD4071 Dimensions Outline
CD4071 Dimensions Outline
CD4071 Manufacturer
Texas Instruments (TI) emerges as a globally recognized semiconductor manufacturer expanded into 35 countries. It has seen rapid growth. In 1958, TIer firstly introduced the working integrated circuit. And today more than 30,000 TIers worldwide are committed to designing, manufacturing, and selling analog and embedded processing chips. They aspire to solve challenges as well as change the world through their technologies.
Parts with Similar Specs
- ImagePart NumberManufacturerPackage / CaseNumber of InputsNumber of PinsLogic FunctionPropagation DelaySupply VoltageQuiescent CurrentTechnologyView Compare
CD4071BMT
14-SOIC (0.154, 3.90mm Width)
2
14
OR
90 ns
5 V
1 μA
CMOS
14-SOIC (0.154, 3.90mm Width)
2
14
OR
100 ns
5 V
1 μA
CMOS
14-SOIC (0.154, 3.90mm Width)
2
14
OR, XOR
100 ns
5 V
1 μA
CMOS
14-SOIC (0.154, 3.90mm Width)
2
14
OR, XOR
100 ns
5 V
5 μA
CMOS
14-SOIC (0.154, 3.90mm Width)
2
14
OR, XOR
100 ns
5 V
5 μA
CMOS
Trend Analysis
Datasheet PDF
- Datasheets :
What is the use of CD4071?
This CD4071 OR gate IC is mainly used CMOS or complementary MOS transistors technology. It assists in achieving an extensive operating range of power supply, less power utilization & maximum noise margin.
What is the output voltage of CD4071 at room temperature?
CD4071 is a four-two-input OR gate, and the working power supply voltage VDD is 3V ~ 18V. The maximum output low-level voltage is 0.05V, and the minimum output voltage is VDD-0.05V when the output is high-level. For example, when the power supply voltage is 5V, the minimum output voltage is 4.95V when the output is high-level.
Is the logic chip cd4011 and CD4071 interchangeable?
CD4011 is a four 2-input NAND gate, and CD4071 is a four 2-input OR gate. Not interchangeable.
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