ULN2803ADW Replacement Guide: Best Alternatives & Quick Swap Solutions 2025
TEXAS INSTRUMENTS - ULN2803ADW - Bipolar Transistor Array, Darlington, NPN, 50 V, 500 mA, SOIC









TEXAS INSTRUMENTS - ULN2803ADW - Bipolar Transistor Array, Darlington, NPN, 50 V, 500 mA, SOIC
Replace Texas Instruments ULN2803ADW fast in 2025 with ULN2803CDWR or Toshiba ULN2803AG. Check pinout, specs, and trusted suppliers for safe swaps.
Product Introduction
You need a fast swap for the texas instruments uln2803adw in 2025. Top choices include the ULN2803CDWR and Toshiba ULN2803AG. Stock for the texas instruments uln2803adw runs low because of obsolescence. Check datasheets and pinout diagrams before you install anything. Matching specs keeps your circuit safe. You can replace the part quickly if you choose the right alternative.
Texas Instruments ULN2803ADW Alternatives
Alternatives
You need a reliable chip when the texas instruments uln2803adw becomes hard to find. Many engineers use this chip in industrial automation and other control systems. If you want a direct swap, you can look at other Darlington array chips with similar specs. The table below shows some direct pin-compatible chips you can use:
| Part Number | Manufacturer | Description / Key Features |
|---|---|---|
| ULN2803ADW | Texas Instruments | 8-channel, 50V, 0.5A NPN Darlington array, 18-pin SOIC package |
| ULN2803ADWR | Texas Instruments | Same 8-channel, 50V, 0.5A NPN Darlington array, 18-pin SOIC package, direct pin-compatible replacement |
| ULN2803ADWRG4 | Texas Instruments | Same specifications, tape and reel packaging, direct pin-compatible replacement |
| ULN2803ADWG4 | Texas Instruments | Same specifications, rail/tube packaging, direct pin-compatible replacement |
Tip: Always check if the chip is in stock. Both the texas instruments uln2803adw and ULN2803ADWG4 are now obsolete. You may need to act fast to secure these chips.
If you cannot find these chips, you can try the ULN2803CDWR or the Toshiba ULN2803AG. These chips offer similar performance and can fit into many of the same designs. For special needs, you might build a driver circuit using discrete transistors or MOSFETs. This approach works well if you want a high-performance chip or if no ICs are available.
Quick Pick
You want a fast solution. The ULN2803CDWR stands out as a top choice. This chip matches the electrical specs of the texas instruments uln2803adw. It handles 500 mA per channel and works up to 50V. The ULN2803CDWR comes in a 20-pin SOIC package, so you must check your board layout before you swap the chip. The Toshiba ULN2803AG is another good pick. It offers the same Darlington array function and fits many automation projects.
If you need a chip right away, check the ULN2803ADWR first. This chip is a direct pin-compatible replacement. If you cannot find it, move to the ULN2803CDWR or Toshiba ULN2803AG. Always review the datasheet for each chip to make sure it fits your needs.
Comparison
You want to know how these chips compare. The table below shows the key differences and similarities between the texas instruments uln2803adw and its top alternatives:
| Parameter | ULN2803ADW (Texas Instruments) | ULN2803CDWR (Texas Instruments) |
|---|---|---|
| Transistor Type | 8 NPN Darlington | 8 NPN Darlington |
| Max Collector Current (Ic) | 500 mA | 500 mA |
| Collector-Emitter Breakdown Voltage | 50 V | 50 V |
| Saturation Voltage (Vce(sat)) | 1.6 V @ 500µA, 350mA | 1.6 V @ 500µA, 350mA |
| Package Type | 18-pin SOIC | 20-pin SOIC (DW) |
| Product Status | Obsolete | Active (Automotive, AEC-Q100) |
| Operating Temperature Range | -40°C to 85°C (TA) | -65°C to 150°C (TJ) |
| Max Collector Cutoff Current | Not specified | 50 µA |
| Mounting Type | Surface Mount | Surface Mount |
You see that both chips handle the same voltage and current. The main difference is the package. The ULN2803CDWR uses a 20-pin SOIC, while the texas instruments uln2803adw uses an 18-pin SOIC. You must check your PCB to make sure the new chip fits. The ULN2803CDWR is still active and easy to find, which makes it a strong choice for fast replacement.
If you want to boost your system, you can use discrete transistors or MOSFETs. This method gives you more control and can help you build a high-performance chip solution. You may need more space and time to design this option, but it works well for custom automation needs.
Note: Always review the datasheet for each chip. Check the pinout and electrical specs before you swap any chip. This step keeps your circuit safe and working.
Compatibility Checks
Pinout
You must check the pinout before you swap any chip. Each chip has a unique pin layout. If you install a chip with a different pinout, your circuit may not work. The Texas Instruments ULN2803ADW uses an 18-pin SOIC package. Many replacement chips use the same pinout, but some, like the ULN2803CDWR, use a 20-pin SOIC. Always compare the datasheets for each chip. This step helps you avoid mistakes and keeps compatibility high. You want to make sure every pin matches your board. If you skip this, you risk damaging your circuit or the new chip.
Voltage & Current
Matching voltage and current ratings is key for safe operation. The Texas Instruments ULN2803ADW and its most common replacements handle up to 50 volts and 500 milliamps per channel. You need to check these ratings for every chip you consider. If you use a chip with lower ratings, it may fail in your application. The table below shows how the main chips compare:
| Part Number | Voltage Rating (V) | Current Rating (mA) | Number of Outputs | Notes |
|---|---|---|---|---|
| ULN2803ADW | 50 | 500 | 8 | Darlington transistor array, 2.7 kΩ base resistor per channel, SOIC-18 package |
| ULN2803A | 50 | 500 | 8 | Essentially same device as ULN2803ADW, often DIP-18 package |
| ULN2003A | N/A | N/A | 7 | Similar Darlington array, fewer outputs, ratings not detailed in source |
| ULN2004A | N/A | N/A | 7 | Similar Darlington array, fewer outputs, ratings not detailed in source |
You see that the ULN2803ADW and ULN2803A chips match in voltage and current. This makes compatibility easy. Always check the datasheet for each chip to confirm these numbers.
Package
You need to match the package type for full compatibility. The Texas Instruments ULN2803ADW comes in an 18-SOIC package. Some chips, like the ULN2803CDWR, use a 20-pin SOIC. The package size and pin count affect how the chip fits on your board. If you pick a chip with a different package, it may not fit your footprint. For example, the UA78L05CDG4 uses an 8-SOIC package, which is much smaller and has fewer pins. Always measure your board and check the chip’s datasheet for package details.
For the best compatibility and expandability, cross-reference datasheets from trusted sources. THAT Corporation offers up-to-date cross-reference charts and datasheets for Darlington array chips in 2025. These resources help you compare chips and ensure you pick the right one for your project.
Tip: Always double-check pinout, voltage, current, and package before you swap any chip. This careful approach keeps your project safe and reliable.
Replacement Steps
Remove Old Part
Start by powering off your device and unplugging it from any source. Use an anti-static wrist strap to protect your board from static electricity. If your board uses through-hole parts, heat each pin with a soldering iron and gently pull the chip out with tweezers. For surface-mount parts, apply solder wick or a desoldering pump to remove solder from each pin. Lift the chip slowly to avoid pulling up pads or traces.
Tip: Work in a well-lit area and keep your soldering iron tip clean. Avoid using too much force. Damaged pads or traces can make your board unusable.
Install New Part
Place the new IC in the correct orientation. Double-check the notch or dot on the chip matches the board’s marking. Solder one corner pin first to hold the chip in place. Then, solder the rest of the pins, making sure not to bridge any connections.
Use thin traces for input pins to handle low-current signals.
Make output traces thicker to carry higher currents and prevent heat buildup.
Keep input traces spaced apart and avoid running them parallel to reduce noise.
Use a wide trace for the common emitter pin to handle return currents.
Connect the power supply securely to the Vcc and COM pins.
Attach loads to the correct output pins and wire all load grounds to the COM pin.
Take advantage of the built-in flyback diodes to protect against voltage spikes from inductive loads.
Note: Always check that your solder joints are shiny and solid. Cold or cracked joints can cause intermittent problems.
Test
After installation, inspect your work for solder bridges or loose pins. Power up the board and check for correct operation. Use a multimeter to verify voltage at the Vcc and COM pins. Test each output channel with a known load. If possible, use an oscilloscope to check signal integrity and switching speed.
Confirm that all loads operate as expected.
Watch for signs of overheating or unusual smells.
If you see any issues, power down and recheck your connections.
A careful test ensures your replacement works reliably and protects your circuit from damage.
Sourcing Parts Fast
Suppliers
You want to find replacement parts quickly when your industrial control computer motherboard needs a new Darlington array. Start by checking major distributors. Mouser Electronics, DigiKey, and Newark keep up-to-date stock and show lead times. These suppliers have strong reputations for quality and fast shipping. You can also look at Informic Electronics for hard-to-find chips. Trusted suppliers help you avoid delays in automation projects.
If you cannot find the Texas Instruments ULN2803ADW, search for the ULN2803CDWR or Toshiba ULN2803AG. These chips work well in industrial automation and fit many designs. Some distributors let you set alerts for restocks. This feature helps you act fast when new stock arrives.
Tip: Avoid buying from unknown sellers on online marketplaces. These sources often have higher risks of counterfeit parts.
Procurement Tips
You need to make sure your new chip is genuine. Counterfeit parts can damage your industrial control computer motherboard and cause system failures. Use these steps to check authenticity:
Buy from authorized distributors like Mouser, DigiKey, or Newark.
Compare the chip’s markings and pin layout with the official datasheet.
Inspect the chip for odd markings, scratches, or signs of tampering.
Check batch numbers and date codes with the manufacturer if possible.
Test the chip’s function before full installation.
Some companies offer third-party verification services. You can send your chip to these labs for testing. This step costs extra but gives you peace of mind.
Ask for certificates of authenticity or datasheets if you feel unsure. Trusted suppliers often provide these documents. Always keep records of your purchases for future reference.
Note: Careful sourcing protects your automation system and keeps your projects running smoothly.
You can replace the texas instruments uln2803adw quickly by choosing the ULN2803CDWR, which Texas Instruments recommends as a supported substitute. Always check compatibility before you install any new part. Reliable suppliers help you avoid delays and keep your project running. Take action now to minimize downtime. Save or share this guide so you can find solutions fast when you need them.
FAQ
What should you check before swapping the ULN2803ADW?
You should always check the datasheet for pinout, voltage, and current ratings. Make sure the new chip matches your board layout. This step helps you avoid damage and keeps your project safe.
Can you use a different package size for replacement?
You can use a different package size if your board supports it. Always compare the footprint and pin spacing. If the package does not fit, the chip will not work in your circuit.
How do you know if a replacement chip is genuine?
You should buy from trusted suppliers like Mouser or DigiKey. Check the chip’s markings and compare them to the datasheet. Look for certificates of authenticity. This helps you avoid counterfeit parts.
What happens if you use a chip with lower current ratings?
If you use a chip with lower current ratings, it may overheat or fail. Your circuit could stop working. Always match or exceed the original chip’s current rating for safe operation.
Do you need to test the board after installing a new chip?
Yes, you need to test the board after installing a new chip. Power up the board and check each output. Use a multimeter to confirm correct operation. This step ensures your replacement works as expected.
Specifications
- TypeParameter
- Lifecycle Status
Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.
ACTIVE (Last Updated: 1 day ago) - Factory Lead Time6 Weeks
- Contact Plating
Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.
Gold - Mount
In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.
Surface Mount - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
18-SOIC (0.295, 7.50mm Width) - Number of Pins18
- Transistor Element Material
The "Transistor Element Material" parameter in electronic components refers to the material used to construct the transistor within the component. Transistors are semiconductor devices that amplify or switch electronic signals and are a fundamental building block in electronic circuits. The material used for the transistor element can significantly impact the performance and characteristics of the component. Common materials used for transistor elements include silicon, germanium, and gallium arsenide, each with its own unique properties and suitability for different applications. The choice of transistor element material is crucial in designing electronic components to meet specific performance requirements such as speed, power efficiency, and temperature tolerance.
SILICON - Collector-Emitter Breakdown Voltage50V
- Collector-Emitter Saturation Voltage1.6V
- Number of Elements8
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~85°C TA - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tube - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
Automotive, AEC-Q100 - JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e4 - Pbfree Code
The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.
yes - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
2 (1 Year) - Number of Terminations18
- ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - Additional Feature
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
LOGIC LEVEL COMPATIBLE - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
DUAL - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
ULN2803 - Pin Count
a count of all of the component leads (or pins)
18 - Output Voltage
Output voltage is a crucial parameter in electronic components that refers to the voltage level produced by the component as a result of its operation. It represents the electrical potential difference between the output terminal of the component and a reference point, typically ground. The output voltage is a key factor in determining the performance and functionality of the component, as it dictates the level of voltage that will be delivered to the connected circuit or load. It is often specified in datasheets and technical specifications to ensure compatibility and proper functioning within a given system.
50V - Polarity
In electronic components, polarity refers to the orientation or direction in which the component must be connected in a circuit to function properly. Components such as diodes, capacitors, and LEDs have polarity markings to indicate which terminal should be connected to the positive or negative side of the circuit. Connecting a component with incorrect polarity can lead to malfunction or damage. It is important to pay attention to polarity markings and follow the manufacturer's instructions to ensure proper operation of electronic components.
NPN - Configuration
The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.
COMPLEX - Transistor Application
In the context of electronic components, the parameter "Transistor Application" refers to the specific purpose or function for which a transistor is designed and used. Transistors are semiconductor devices that can amplify or switch electronic signals and are commonly used in various electronic circuits. The application of a transistor can vary widely depending on its design and characteristics, such as whether it is intended for audio amplification, digital logic, power control, or radio frequency applications. Understanding the transistor application is important for selecting the right type of transistor for a particular circuit or system to ensure optimal performance and functionality.
SWITCHING - Transistor Type
Transistor type refers to the classification of transistors based on their operation and construction. The two primary types are bipolar junction transistors (BJTs) and field-effect transistors (FETs). BJTs use current to control the flow of current, while FETs utilize voltage to control current flow. Each type has its own subtypes, such as NPN and PNP for BJTs, and MOSFETs and JFETs for FETs, impacting their applications and characteristics in electronic circuits.
8 NPN Darlington - Collector Emitter Voltage (VCEO)
Collector-Emitter Voltage (VCEO) is a key parameter in electronic components, particularly in transistors. It refers to the maximum voltage that can be applied between the collector and emitter terminals of a transistor while the base terminal is open or not conducting. Exceeding this voltage limit can lead to breakdown and potential damage to the transistor. VCEO is crucial for ensuring the safe and reliable operation of the transistor within its specified limits. Designers must carefully consider VCEO when selecting transistors for a circuit to prevent overvoltage conditions that could compromise the performance and longevity of the component.
50V - Max Collector Current
Max Collector Current is a parameter used to specify the maximum amount of current that can safely flow through the collector terminal of a transistor or other electronic component without causing damage. It is typically expressed in units of amperes (A) and is an important consideration when designing circuits to ensure that the component operates within its safe operating limits. Exceeding the specified max collector current can lead to overheating, degradation of performance, or even permanent damage to the component. Designers must carefully consider this parameter when selecting components and designing circuits to ensure reliable and safe operation.
500mA - JEDEC-95 Code
JEDEC-95 Code is a standardized identification system used by the Joint Electron Device Engineering Council to categorize and describe semiconductor devices. This code provides a unique alphanumeric identifier for various memory components, ensuring consistency in documentation and communication across the electronics industry. The format includes information about the type, capacity, and technology of the device, facilitating easier specification and understanding for manufacturers and engineers.
MS-013AB - Vce Saturation (Max) @ Ib, Ic
The parameter "Vce Saturation (Max) @ Ib, Ic" in electronic components refers to the maximum voltage drop across the collector-emitter junction when the transistor is in saturation mode. This parameter is specified at a certain base current (Ib) and collector current (Ic) levels. It indicates the minimum voltage required to keep the transistor fully conducting in saturation mode, ensuring that the transistor operates efficiently and does not enter the cutoff region. Designers use this parameter to ensure proper transistor operation and to prevent overheating or damage to the component.
1.6V @ 500μA, 350mA - Emitter Base Voltage (VEBO)
Emitter Base Voltage (VEBO) is a parameter used in electronic components, particularly in transistors. It refers to the maximum voltage that can be applied between the emitter and base terminals of a transistor without causing damage to the device. Exceeding this voltage limit can lead to breakdown of the transistor and potential failure. VEBO is an important specification to consider when designing circuits to ensure the proper operation and reliability of the components. It is typically provided in the datasheet of the transistor and should be carefully observed to prevent any potential damage during operation.
50V - Max Junction Temperature (Tj)
Max Junction Temperature (Tj) refers to the maximum allowable temperature at the junction of a semiconductor device, such as a transistor or integrated circuit. It is a critical parameter that influences the performance, reliability, and lifespan of the component. Exceeding this temperature can lead to thermal runaway, breakdown, or permanent damage to the device. Proper thermal management is essential to ensure the junction temperature remains within safe operating limits during device operation.
150°C - Ambient Temperature Range High
This varies from person to person, but it is somewhere between 68 and 77 degrees F on average. The temperature setting that is comfortable for an individual may fluctuate with humidity and outside temperature as well. The temperature of an air conditioned room can also be considered ambient temperature.
85°C - Height2.65mm
- Length11.5mm
- Width7.5mm
- Thickness
Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.
2.35mm - REACH SVHC
The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.
No SVHC - Radiation Hardening
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
No - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant - Lead Free
Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.
Lead Free
Parts with Similar Specs
- ImagePart NumberManufacturerMountPackage / CaseTerminal PositionWidthTerminal FormECCN CodeThicknessPbfree CodeView Compare
ULN2803ADW
Surface Mount
18-SOIC (0.295, 7.50mm Width)
DUAL
7.5 mm
GULL WING
EAR99
2.35 mm
yes
Surface Mount
20-SOIC (0.295, 7.50mm Width)
DUAL
7.5 mm
GULL WING
EAR99
2.35 mm
yes
Surface Mount
20-SOIC (0.295, 7.50mm Width)
DUAL
7.5 mm
GULL WING
EAR99
2.35 mm
yes
Surface Mount
20-SOIC (0.295, 7.50mm Width)
DUAL
7.5 mm
GULL WING
EAR99
2.35 mm
yes
Surface Mount
SOIC
DUAL
7.5 mm
GULL WING
EAR99
-
-
Datasheet PDF
- PCN Assembly/Origin :
- PCN Design/Specification :
2N2219A NPN General Purpose Transistor: 40V, TO-39, 2N2219A Equivalents09 March 20221992
STM32F722RET6: Overview, Features, and Applications27 December 20232973
BD140 PNP Transistor: Datasheet, Pinout, and Equivalents11 August 202123094
AO3401 Transistor: Circuit, Pinout, and Datasheet [FAQ]20 October 20218748
TL081 Series JFET-Input Operational Amplifier Design Guide20 January 2026101
74HC04 Hex Inverter: Pinout, Circuit and Datasheet24 August 202116926
XC7S25-1FTGB196I FPGA Review: Performance vs Modern Alternatives06 June 2025529
L5973D:35V, 250kHz, Pinout and Datasheet07 March 20221433
In Circuit Design, What are the Differences Between the 6 Types of Grounding?25 March 20244421
Linear Induction Motor: Working Principle, Characteristics, and Applications02 March 202112967
Filter Circuit: Types, Characteristics and Principles01 December 20217261
EMI Filter: Introduction, Functions and Applications23 December 202011517
Good news | Warm Congratulations to UTMEL Electronic for Obtaining the Letter of Authorization from XKB Connectivity21 July 20252051
What is a Tactile Sensor?21 October 20213623
Introduction to Optical Amplifier27 March 20257888
What is Keyboard and How to Choose It?17 February 20225012
Texas Instruments
In Stock
United States
China
Canada
Japan
Russia
Germany
United Kingdom
Singapore
Italy
Hong Kong(China)
Taiwan(China)
France
Korea
Mexico
Netherlands
Malaysia
Austria
Spain
Switzerland
Poland
Thailand
Vietnam
India
United Arab Emirates
Afghanistan
Åland Islands
Albania
Algeria
American Samoa
Andorra
Angola
Anguilla
Antigua & Barbuda
Argentina
Armenia
Aruba
Australia
Azerbaijan
Bahamas
Bahrain
Bangladesh
Barbados
Belarus
Belgium
Belize
Benin
Bermuda
Bhutan
Bolivia
Bonaire, Sint Eustatius and Saba
Bosnia & Herzegovina
Botswana
Brazil
British Indian Ocean Territory
British Virgin Islands
Brunei
Bulgaria
Burkina Faso
Burundi
Cabo Verde
Cambodia
Cameroon
Cayman Islands
Central African Republic
Chad
Chile
Christmas Island
Cocos (Keeling) Islands
Colombia
Comoros
Congo
Congo (DRC)
Cook Islands
Costa Rica
Côte d’Ivoire
Croatia
Cuba
Curaçao
Cyprus
Czechia
Denmark
Djibouti
Dominica
Dominican Republic
Ecuador
Egypt
El Salvador
Equatorial Guinea
Eritrea
Estonia
Eswatini
Ethiopia
Falkland Islands
Faroe Islands
Fiji
Finland
French Guiana
French Polynesia
Gabon
Gambia
Georgia
Ghana
Gibraltar
Greece
Greenland
Grenada
Guadeloupe
Guam
Guatemala
Guernsey
Guinea
Guinea-Bissau
Guyana
Haiti
Honduras
Hungary
Iceland
Indonesia
Iran
Iraq
Ireland
Isle of Man
Israel
Jamaica
Jersey
Jordan
Kazakhstan
Kenya
Kiribati
Kosovo
Kuwait
Kyrgyzstan
Laos
Latvia
Lebanon
Lesotho
Liberia
Libya
Liechtenstein
Lithuania
Luxembourg
Macao(China)
Madagascar
Malawi
Maldives
Mali
Malta
Marshall Islands
Martinique
Mauritania
Mauritius
Mayotte
Micronesia
Moldova
Monaco
Mongolia
Montenegro
Montserrat
Morocco
Mozambique
Myanmar
Namibia
Nauru
Nepal
New Caledonia
New Zealand
Nicaragua
Niger
Nigeria
Niue
Norfolk Island
North Korea
North Macedonia
Northern Mariana Islands
Norway
Oman
Pakistan
Palau
Palestinian Authority
Panama
Papua New Guinea
Paraguay
Peru
Philippines
Pitcairn Islands
Portugal
Puerto Rico
Qatar
Réunion
Romania
Rwanda
Samoa
San Marino
São Tomé & Príncipe
Saudi Arabia
Senegal
Serbia
Seychelles
Sierra Leone
Sint Maarten
Slovakia
Slovenia
Solomon Islands
Somalia
South Africa
South Sudan
Sri Lanka
St Helena, Ascension, Tristan da Cunha
St. Barthélemy
St. Kitts & Nevis
St. Lucia
St. Martin
St. Pierre & Miquelon
St. Vincent & Grenadines
Sudan
Suriname
Svalbard & Jan Mayen
Sweden
Syria
Tajikistan
Tanzania
Timor-Leste
Togo
Tokelau
Tonga
Trinidad & Tobago
Tunisia
Turkey
Turkmenistan
Turks & Caicos Islands
Tuvalu
U.S. Outlying Islands
U.S. Virgin Islands
Uganda
Ukraine
Uruguay
Uzbekistan
Vanuatu
Vatican City
Venezuela
Wallis & Futuna
Yemen
Zambia
Zimbabwe











