TPS1H100AQPWPRQ1 High-Side Power Switch: Features, Pinout, and Datasheet

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Published: 26 March 2022 | Last Updated: 26 March 2022

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TPS1H100AQPWPRQ1

TPS1H100AQPWPRQ1

Texas Instruments

N-Channel PMIC Automotive, AEC-Q100 Series TPS1H100 14 Pin 13.5V 14-PowerTSSOP (0.173, 4.40mm Width)

Purchase Guide

N-Channel PMIC Automotive, AEC-Q100 Series TPS1H100 14 Pin 13.5V 14-PowerTSSOP (0.173, 4.40mm Width)

The TPS1H100AQPWPRQ1 is a fully protected high-side power switch with an integrated NMOS power FET and charge pump that is designed to intelligently regulate a variety of resistive, inductive, and capacitive loads. This article mainly introduces Features, Pinout, Datasheet and other detailed information about Texas Instruments TPS1H100AQPWPRQ1.

This video will show you the Transistor as a switch - low side or high side.

Transistor as a switch - low side or high side

TPS1H100AQPWPRQ1 Description

The TPS1H100AQPWPRQ1 is a fully protected high-side power switch with an integrated NMOS power FET and charge pump that is designed to intelligently regulate a variety of resistive, inductive, and capacitive loads. It stands out from the competition because of its accurate current sense and programmable current limit capabilities.

It has a single channel and is fully protected. The load may be intelligently controlled thanks to full diagnostics and high-accuracy current-sense features. The overall system's reliability is considerably improved by a programmable current-limit function. When diagnostics are disabled, both versions of the device diagnostic reporting can be set to the high-impedance state for multiplexing the MCU analog or digital interface among devices, and both can be set to the high-impedance state when diagnostics are removed.

The open-drain structure is used for version A of the digital status report. It pulls down to GND when a fault condition arises. To match the microcontroller supply level, a 3.3- or 5-V external pull-up is necessary.

High-accuracy current sensing in version B enables for a stronger real-time monitoring effect and more accurate diagnostics without the need for additional calibration. A current mirror is used to supply 1 / K of the load current, which is reflected on the CS pin as voltage. K remains constant regardless of temperature or supply voltage. The current-sensing function functions normally throughout a broad linear range of 0 to 4 V. By bringing up the voltage of VCS,h, the CS pin can also notify a defect.

For smart high-side power-switch devices, short-circuit reliability is crucial. The purpose of the AEC-Q100-012 standard is to verify the device's reliability when operating in a continuous short-circuit scenario. According to the past cycles, different grade levels are assigned. This device has the highest degree of qualification, Grade A, with a 1 million times short-to-GND certification.

Low-wattage bulbs, LEDs, relays, solenoids, and heaters can all benefit from the TPS1H100AQPWPRQ1 device, which can be utilized as a high-side power switch for a range of resistive, inductive, and capacitive loads.


TPS1H100AQPWPRQ1 Pinout

The following figure is TPS1H100AQPWPRQ1 Pinout.

pinout.jpg

Pinout

Pin NumberPin NameDescription
13CLProgrammable current-limit pin. Connect to device GND if external current limit is not used.
14CSCurrent-sense output. Leave floating if not used.
12DIAG_ENEnable and disable pin for diagnostic functions. Connect to device GND if not used.
2GNDGround pin
3INInput control for channel activation
1, 4, 11NCNo-connect pin; leave floating.
5, 6, 7OUTOutput, connected to load (NMOS source)
8, 9, 10VSPower supply; battery voltage

Thermal padThermal pad. Connect to device GND or leave floating.


TPS1H100AQPWPRQ1 CAD Model

The TPS1H100AQPWPRQ1 CAD Model is shown as follows.

symbol.png

Symbol

footprint.png

Footprint

3d model.jpg

3D Model


TPS1H100AQPWPRQ1 Features

• Qualified for automotive applications

• AEC-Q100 Qualified with the following results:

– Device temperature grade 1: –40°C to 125°C ambient operating temperature range

– Device HBM ESD classification level H3A

– Device CDM ESD classification level C4B

• Functional safety capable

– Documentation available to aid functional safety system design

• Single-channel smart high-side power switch with full diagnostics

– Version A: open-drain status output

– Version B: current sense analog output

• Wide operating voltage 3.5 to 40 V • Very-low standby current, <0.5 µA

• Operating junction temperature, –40 to 150°C • Input control, 3.3-V and 5-V logic compatible

• High-accuracy current sense, ±30 mA at 1 A, ±4 mA at 5 mA

• Programmable current limit with external resistor, ±20% at 0.5 A

• Diagnostic enable function for multiplexing of mcu analog or digital interface

• Tested according to AECQ100-12 Grade A, 1 million times Short to GND test

• Electrical transient disturbance immunity certification of ISO7637-2 and ISO16750-2

• Protection

– Overload and short-circuit protection

– Inductive load negative voltage clamp

– Undervoltage lockout ( UVLO ) protection

– Thermal shutdown/swing with self recovery

– Loss of GND, loss of supply protection

– Reverse battery protection with external circuitry

• Diagnostic

– On- and Off-state output open- and short-tobattery detection

– Overload and short to ground detection and current limit

– Thermal shutdown/swing detection

• 14-Pin Thermally-enhanced PWP package


Specifications

Texas Instruments TPS1H100AQPWPRQ1 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments TPS1H100AQPWPRQ1.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    ACTIVE (Last Updated: 5 days ago)
  • Factory Lead Time
    8 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    14-PowerTSSOP (0.173, 4.40mm Width)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    14
  • Turn Off Delay Time

    It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

    20 μs
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~125°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Automotive, AEC-Q100
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e4
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    14
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    13.5V
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    TPS1H100
  • Number of Outputs
    1
  • Output Type

    The "Output Type" parameter in electronic components refers to the type of signal or data that is produced by the component as an output. This parameter specifies the nature of the output signal, such as analog or digital, and can also include details about the voltage levels, current levels, frequency, and other characteristics of the output signal. Understanding the output type of a component is crucial for ensuring compatibility with other components in a circuit or system, as well as for determining how the output signal can be utilized or processed further. In summary, the output type parameter provides essential information about the nature of the signal that is generated by the electronic component as its output.

    N-Channel
  • Max Output Current

    The maximum current that can be supplied to the load.

    4A
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    40V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    5V
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    On/Off
  • Output Configuration

    Output Configuration in electronic components refers to the arrangement or setup of the output pins or terminals of a device. It defines how the output signals are structured and how they interact with external circuits or devices. The output configuration can determine the functionality and compatibility of the component in a circuit design. Common types of output configurations include single-ended, differential, open-drain, and push-pull configurations, each serving different purposes and applications in electronic systems. Understanding the output configuration of a component is crucial for proper integration and operation within a circuit.

    High Side
  • Output Current

    The rated output current is the maximum load current that a power supply can provide at a specified ambient temperature. A power supply can never provide more current that it's rated output current unless there is a fault, such as short circuit at the load.

    4A
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    Not Required
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    20 μs
  • Switch Type

    Based on their characteristics, there are basically three types of switches: Linear switches, tactile switches and clicky switches.

    General Purpose
  • Ratio - Input:Output

    The parameter "Ratio - Input:Output" in electronic components refers to the relationship between the input and output quantities of a device or system. It is a measure of how the input signal or energy is transformed or converted into the output signal or energy. This ratio is often expressed as a numerical value or percentage, indicating the efficiency or effectiveness of the component in converting the input to the desired output. A higher ratio typically signifies better performance or higher efficiency, while a lower ratio may indicate losses or inefficiencies in the conversion process. Understanding and optimizing the input-output ratio is crucial in designing and evaluating electronic components for various applications.

    1:1
  • Voltage - Load

    Voltage - Load refers to the voltage across a load component in an electronic circuit when it is connected and operational. It represents the electrical potential difference that drives current through the load, which can be a resistor, motor, or other devices that consume electrical power. The voltage - load relationship is crucial for determining how much power the load will utilize and how it will affect the overall circuit performance. Properly managing voltage - load is essential for ensuring devices operate efficiently and safely within their specified limits.

    5V~40V
  • Fault Protection

    Protection against electric shock under. single fault conditions.

    Current Limiting (Adjustable), Open Load Detect, Over Temperature, UVLO
  • Number of Drivers
    1
  • Turn On Time

    The time that it takes a gate circuit to allow a current to reach its full value.

    50 μs
  • Output Peak Current Limit-Nom

    Output Peak Current Limit-Nom is a parameter in electronic components that specifies the maximum current that can be delivered by the output under normal operating conditions. This limit is typically set to protect the component from damage due to excessive current flow. It ensures that the component operates within its safe operating limits and prevents overheating or other potential issues. Designers and engineers use this parameter to ensure proper functioning and reliability of the electronic system in which the component is used.

    7A
  • Rds On (Typ)

    The parameter "Rds On (Typ)" in electronic components refers to the typical on-state resistance of a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) when it is fully conducting. This parameter indicates the resistance encountered by the current flowing through the MOSFET when it is in the on-state, which affects the power dissipation and efficiency of the component. A lower Rds On value indicates better conduction and lower power loss in the MOSFET. Designers often consider this parameter when selecting components for applications where minimizing power loss and maximizing efficiency are critical factors.

    80m Ω
  • Max Junction Temperature (Tj)

    Max Junction Temperature (Tj) refers to the maximum allowable temperature at the junction of a semiconductor device, such as a transistor or integrated circuit. It is a critical parameter that influences the performance, reliability, and lifespan of the component. Exceeding this temperature can lead to thermal runaway, breakdown, or permanent damage to the device. Proper thermal management is essential to ensure the junction temperature remains within safe operating limits during device operation.

    150°C
  • Turn Off Time

    Turn Off Time is a parameter in electronic components, particularly in devices like transistors and diodes. It refers to the time taken for the component to switch from an ON state to an OFF state when a control signal is applied. This parameter is crucial in determining the speed and efficiency of the component's operation. A shorter turn off time indicates faster switching speeds, which is important in applications where rapid switching is required, such as in power electronics and digital circuits. Manufacturers provide this specification in datasheets to help engineers and designers select the right components for their specific requirements.

    50 μs
  • Built-in Protections

    Built-in protections in electronic components refer to the safety features and mechanisms that are integrated into the component to prevent damage or malfunction in various situations. These protections are designed to safeguard the component from overvoltage, overcurrent, overheating, short circuits, and other potential hazards that could occur during operation. By having built-in protections, electronic components can operate more reliably and safely, extending their lifespan and reducing the risk of failure. These protections are essential for ensuring the overall performance and longevity of electronic devices and systems.

    TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE
  • Ambient Temperature Range High

    This varies from person to person, but it is somewhere between 68 and 77 degrees F on average. The temperature setting that is comfortable for an individual may fluctuate with humidity and outside temperature as well. The temperature of an air conditioned room can also be considered ambient temperature.

    125°C
  • Features

    In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

    Status Flag
  • Height
    1.2mm
  • Length
    5mm
  • Width
    4.4mm
  • Thickness

    Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.

    1mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Parts with Similar Specs

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TPS1H100AQPWPRQ1 Functional Block Diagram

The following figure is TPS1H100AQPWPRQ1 Functional Block Diagram.

Functional Block Diagram.png

Functional Block Diagram


TPS1H100AQPWPRQ1 Typical Application Schematic

The following figure is TPS1H100AQPWPRQ1 Typical Application Schematic.

Typical Application Schematic.png

Typical Application Schematic


The following figure shows an example of how to design the external circuitry parameters.

Typical Application Circuitry.png

Typical Application Circuitry

Design Requirements

• VS range from 9 V to 16 V

• Nominal current of 2 A

• Current sense for fault monitoring

• Expected current limit value of 5 A

• Full diagnostics with 5-V MCU

• Reverse protection with GND network


TPS1H100AQPWPRQ1 Layout

TJ must be less than 150°C to avoid a thermal shutdown. The power dissipation may be significant if the output current is quite high. The thermal impedance of the HTSSOP package is excellent. The  PCB  layout, on the other hand, is critical. A good PCB design can improve heat transfer, which is critical for the device's long-term durability.

• Increase the heat conductivity of the board by increasing the copper covering on the PCB. The copper on the PCB is the primary heatflow channel from the package to the ambient. When there are no heat sinks attached to the PCB on the opposite side of the board from the package, maximum copper is critical.

• To improve the board's thermal conductivity, place as many thermal vias as feasible directly beneath the package ground pad.

• To avoid solder voids, all thermal vias should be plated shut or plugged and sealed on both sides of the board. Solder coverage should be at least 85% to assure reliability and performance.


Without a GND Network

Without a GND network, tie the thermal pad directly to the board GND copper for better thermal performance.

Layout Without a GND Network.png

Layout Without a GND Network

With a GND Network

With a GND network, tie the thermal pad with a single trace through the GND network to the board GND copper.

Layout With a GND Network.png

Layout With a GND Network


TPS1H100AQPWPRQ1 Applications

• High-side power switch for sub-module

• Power switch for low-wattage lamp

• High-side relays and solenoids

• PLC Digital output power switch

• General resistive, inductive, and capacitive loads


TPS1H100AQPWPRQ1 Package

The TPS1H100AQPWPRQ1 Package is shown as follows.

package.png

Package


TPS1H100AQPWPRQ1 Manufacturer

Texas Instruments Incorporated (TI) is an American technology corporation based in Dallas, Texas, that creates and manufactures semiconductors and integrated circuits for electronic designers and manufacturers around the world. Based on sales volume, it is one of the top ten semiconductor businesses in the world. Analog chips and embedded processors, which account for more than 80% of the company's revenue, are the company's main focus.


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Datasheet PDF

Download datasheets and manufacturer documentation for Texas Instruments TPS1H100AQPWPRQ1.
Frequently Asked Questions

What is the TPS1H100AQPWPRQ1 equipped with?

NMOS power FET and charge pump.

What features does the TPS1H100AQPWPRQ1 stand out from competition?

Accurate current sense and programmable current limit capabilities.

What channel does the TPS1H100AQPWPRQ1 have?

Single-channel.

What are the advantages of the TPS1H100AQPWPRQ1?

Full diagnostics and high-accuracy current-sense features.

What improves the reliability of the TPS1H100AQPWPRQ1?

A programmable current-limit function.

When can both versions of the TPS1H100AQPWPRQ1 be set to the high-impedance state?

When diagnostics are removed.

What is used for version A of the digital status report?

Open-drain structure.

What is required to match the microcontroller supply level?

3.3- or 5-V external pull-up.

What enables for a stronger real-time monitoring effect and more accurate diagnostics without the need for additional calibration?

High-accuracy current sensing.

What is crucial for smart high-side power-switch devices?

Short-circuit reliability.

What is the purpose of the AEC-Q100-012 standard?

To verify the devices reliability when operating in a continuous short-circuit scenario.

What is the highest grade of the TPS1H100AQPWPRQ1?

Grade A.
TPS1H100AQPWPRQ1

Texas Instruments

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