NXP USA Inc. TWR-56F8200DEV BRD, MC56F82748 TOWER SYSTEM MODULE; Silicon Manufacturer:NXP; Core Architecture:-; Core Sub-Architecture:-; Silicon Core Number:MC56F82748; Silicon Family Name:MC56F82xx; No. of Bits:32bit ;RoHS Compliant: Yes

NXP USA Inc. TWR-56F8200 Reference Design 2
NXP USA Inc. TWR-56F8200 Reference Design 1
NXP USA Inc. TWR-56F8200 Reference Design 2
NXP USA Inc. TWR-56F8200 Reference Design 1
NXP USA Inc. TWR-56F8200 Reference Design 1
NXP USA Inc. TWR-56F8200 Reference Design 2

Applications:

Embedded System >

Microcontroller

End Products:

Consumer ElectronicsConsumer Electronics

ECAD Model:

Description

The NXP Semiconductors TWR-56F8200 Tower Development Board is a powerful and versatile development platform based on the MC9S08JM60 MCU. It is designed for consumer electronics applications and provides a wide range of features and capabilities. The board includes a wide range of peripherals, including a USB 2.0 port, an LCD display, an audio codec, an accelerometer, and a temperature sensor. It also includes a variety of development tools, such as a debugger, a compiler, and a software library. The board is also compatible with a variety of operating systems, including Windows, Linux, and Mac OS X. With its powerful features and capabilities, the TWR-56F8200 Tower Development Board is an ideal choice for developing consumer electronics applications.

Specifications

NXP USA Inc. technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. .
  • Type
    Parameter
  • Factory Lead Time
    7 Weeks
  • Mounting Type
    Fixed
  • Published
    2010
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Type
    DSP
  • Core Processor
    56800EX
  • Utilized IC / Part
    MC56F823xx, MC56F827xx
  • Contents
    Board(s), Cable(s)
  • Board Type
    Evaluation Platform
  • Platform
    Tower System
  • RoHS Status
    ROHS3 Compliant
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