STMicroelectronics: The European Powerhouse in Silicon Carbide Semiconductor Technology

Published: 05 October 2023 | Last Updated: 05 October 20233404
STMicroelectronics (NYSE:STM), a leading semiconductor manufacturer in Europe, is making significant strides in the realm of silicon carbide technology.

STMicroelectronics (NYSE:STM), a leading semiconductor manufacturer in Europe, is making significant strides in the realm of silicon carbide technology. The company specializes in automotive chips, analog products, and microcontrollers, with a strong emphasis on silicon carbide technology. STMicroelectronics is one of the major players in the silicon carbide technology sector, alongside Infineon (OTCQX:IFNNY), ON Semiconductor (ON), and ROHM Semiconductor. The increasing use of silicon carbide and the growing semiconductor content per vehicle are major driving forces in the automotive semiconductor industry. The company's Automotive and Discrete Group (ADG) represents 37% of group revenue and has seen substantial growth in recent years. In FY21, it grew 32.5%, followed by a further 37.2% in FY22. This growth is driven by automotive electrification, ADAS systems, and 32-bit MCUs. The company's management expects the semiconductor content per car to accelerate in the coming years, driven by more technologies applied to premium cars and electric vehicles (EVs). STMicroelectronics is also a leader in silicon carbide technology, which is a new material better suited for longer-range electric vehicles. 


The advantages of silicon carbide include high system-level efficiencies, low power loss, and increased temperature operations. The company is targeting more than EUR 5 billion in revenue from silicon carbide by FY30, with customers including major automakers such as BMW, Tesla, BYD, Renault, and Hyundai. In Q2 FY23, STMicroelectronics announced a joint venture with Sanan Optoelectronics to manufacture high-volume 200mm silicon carbide devices in China. These devices will be used for automotive electrification, industrial power, and energy applications. The company plans to start production in Q4 FY25 and achieve full operation by FY28. Despite being in a volatile industry, STMicroelectronics has shown impressive growth, with a 3-year revenue CAGR of approximately 19% and a 5-year CAGR of around 14%. The company's Q2 FY23 revenue increased by 12.7% year over year, with an operating margin improvement to 26.5% from 26.2% in the same quarter of the previous year. However, the company does face key risks, particularly relating to its high capital expenditures. The increasing capital expenditure has impacted their free cash flow generation. While these investments in manufacturing can help STMicroelectronics better control their supply chain and input costs, it also makes their business capital-intensive. 


Despite these risks, STMicroelectronics is significantly undervalued, with a 'Strong Buy' rating assigned. The company's growth is expected to be driven by the increase in silicon content per car and the adoption of silicon carbide technology. The company will also benefit from the structural trend of automotive electrification.

UTMEL

We are the professional distributor of electronic components, providing a large variety of products to save you a lot of time, effort, and cost with our efficient self-customized service. careful order preparation fast delivery service

Related Articles

  • The 2026 Memory Super-Cycle: Navigating the 500% Surge in DRAM and NAND Flash Prices
    The 2026 Memory Super-Cycle: Navigating the 500% Surge in DRAM and NAND Flash Prices
    UTMEL17 June 20268078

    Driven by massive AI capital expenditures, the 2026 semiconductor market is experiencing a historic memory super-cycle, sending DRAM and NAND Flash prices soaring. With manufacturers prioritizing high-margin AI memory like HBM, severe shortages have spilled over to mature nodes, impacting automotive and IoT sectors. To navigate this volatility, procurement teams must secure long-term agreements, diversify suppliers, and optimize designs to mitigate rising BOM costs.

    Read More
  • HBM4 and the Shift to Customized AI Memory: The Advanced Packaging Bottleneck
    HBM4 and the Shift to Customized AI Memory: The Advanced Packaging Bottleneck
    UTMEL22 June 20261466

    The JEDEC HBM4 standard transitions high-bandwidth memory to a customized architecture featuring a 2048-bit interface and logic base dies. While delivering extreme bandwidth for AI accelerators, its resource-intensive production triggers a global DRAM supply squeeze. Procurement teams must navigate rising prices, advanced packaging bottlenecks, and extended lead times by adopting strategic supply chain planning.

    Read More
  • AI Computing Power Gap: How Token Consumption is Reshaping Server Component Sourcing
    AI Computing Power Gap: How Token Consumption is Reshaping Server Component Sourcing
    UTMEL23 June 2026468

    As global token consumption drives the transition to high-density 100kW+ AI data centers, power delivery networks require advanced Wide-Bandgap semiconductors (SiC/GaN) and high-capacitance MLCCs. This shift has triggered a component procurement crisis with lead times exceeding 24 weeks. To bypass shortages, hardware buyers must abandon just-in-time manufacturing and leverage independent global distributor networks to secure critical power and passive components.

    Read More
  • Power Semiconductor Procurement After the Nexperia Shake-Up—NXP for Stability, ON for Technology, or Nexperia for Value?
    Power Semiconductor Procurement After the Nexperia Shake-Up—NXP for Stability, ON for Technology, or Nexperia for Value?
    UTMEL04 November 20254565

    The recent supply chain turmoil surrounding Netherlands-based Nexperia has sent shockwaves through the global semiconductor industry, forcing procurement professionals to re-evaluate their sourcing strategies.

    Read More
  • The BSPDN Revolution: Overcoming IR Drop in Sub-2nm GAAFET Nodes with Backside Power Delivery
    The BSPDN Revolution: Overcoming IR Drop in Sub-2nm GAAFET Nodes with Backside Power Delivery
    UTMEL25 June 2026322

    As semiconductor manufacturing enters the sub-2nm era, Backside Power Delivery Networks (BSPDN) are replacing traditional front-side routing to overcome critical IR drop bottlenecks. By separating power and signal delivery, chipmakers like Intel and TSMC drastically improve performance and density in GAAFET designs. However, this radical shift introduces manufacturing complexities, thermal challenges, and demands advanced packaging and power management solutions.

    Read More

Subscribe to Utmel !

Featured Parts More