2N3819 JFET: Substitute, Pinout and Datasheet

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Published: 23 August 2021 | Last Updated: 23 August 2021

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2N3819

2N3819

Central Semiconductor Corp

RF JFET Transistors N-CH -25V 10mA BULK

Purchase Guide

RF JFET Transistors N-CH -25V 10mA BULK

Hello everyone, this is Rose. In today's post, we will detail the introduction to 2N3819. 2N3819 is a a TO-92 packaged N-Channel JFET designed for RF amplifier and mixer applications.This article mainly introduce substitute, pinout, datasheet and other detailed information about Central Semiconductor 2N3819.

Test on relationship of VGs and IDs of an JFET..

Drain characteristic curve and Dc transfer curve test for 2N3819(or any kind of JFET)

2N3819 Description

The Central Semiconductor 2N3819 is a a TO-92 packaged N-Channel JFET designed for RF amplifier and mixer applications. 


The transistor possesses some very good features like very low noise and distortion, high gain and sensitivity, quality signal amplification and can also be used for very low level signal amplification. 


Other than that it can also be used as a switch. When used as a switch it is capable of fast switching and can drive loads that falls under 10mA. It also provides high gain at 100MHz.


2N3819 Pinout

2N3819 Pinout.jpg

2N3819 CAD Model

Symbol

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Footprint

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3D Model

2N3819 3D Model.jpg

2N3819 Features

■Type: JFET - N - Channel - Depletion

■Drain to Source Voltage (VDS) = 25V

■Drain to Gate Voltage (VDG) = 25V

■Gate to Source Voltage (VGS) = 25V

■Drain Current (ID)= 0.1 A

■Gate-Source Cut-off Voltage (VGS(off)) = -8.0 Vdc (VDS = 15 Vdc, ID = 10 nAdc)

■Cut-off Frequency (Note 1) = 700 Mhz (VDS = 15 Vdc, VGS = 0)

■Power Dissipation (Ptot): 350mW

■Package Type: TO-92

■Transistor Type: N Channel

■Max Storage & Operating temperature Should Be: -65 to +150 Centigrade

■Low Noise & High Gain


Specifications

Central Semiconductor Corp 2N3819 technical specifications, attributes, parameters and parts with similar specifications to Central Semiconductor Corp 2N3819.
  • Type
    Parameter
  • Factory Lead Time
    6 Weeks
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    TO-226-3, TO-92-3 (TO-226AA)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Weight
    453.59237mg
  • Transistor Element Material

    The "Transistor Element Material" parameter in electronic components refers to the material used to construct the transistor within the component. Transistors are semiconductor devices that amplify or switch electronic signals and are a fundamental building block in electronic circuits. The material used for the transistor element can significantly impact the performance and characteristics of the component. Common materials used for transistor elements include silicon, germanium, and gallium arsenide, each with its own unique properties and suitability for different applications. The choice of transistor element material is crucial in designing electronic components to meet specific performance requirements such as speed, power efficiency, and temperature tolerance.

    SILICON
  • Number of Elements
    1
  • Operating Temperature (Max.)
    150°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Published
    2001
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e0
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    no
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    3
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin/Lead (Sn/Pb)
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8541.21.00.95
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    360mW
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    THROUGH-HOLE
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    not_compliant
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    NOT SPECIFIED
  • Pin Count

    a count of all of the component leads (or pins)

    3
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    O-PBCY-T3
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Element Configuration

    The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

    Single
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    DEPLETION MODE
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    360mW
  • Transistor Application

    In the context of electronic components, the parameter "Transistor Application" refers to the specific purpose or function for which a transistor is designed and used. Transistors are semiconductor devices that can amplify or switch electronic signals and are commonly used in various electronic circuits. The application of a transistor can vary widely depending on its design and characteristics, such as whether it is intended for audio amplification, digital logic, power control, or radio frequency applications. Understanding the transistor application is important for selecting the right type of transistor for a particular circuit or system to ensure optimal performance and functionality.

    AMPLIFIER
  • Drain to Source Voltage (Vdss)

    The Drain to Source Voltage (Vdss) is a key parameter in electronic components, particularly in field-effect transistors (FETs) such as MOSFETs. It refers to the maximum voltage that can be applied between the drain and source terminals of the FET without causing damage to the component. Exceeding this voltage limit can lead to breakdown and potentially permanent damage to the device.Vdss is an important specification to consider when designing or selecting components for a circuit, as it determines the operating range and reliability of the FET. It is crucial to ensure that the Vdss rating of the component is higher than the maximum voltage expected in the circuit to prevent failures and ensure proper functionality.In summary, the Drain to Source Voltage (Vdss) is a critical parameter that defines the maximum voltage tolerance of a FET component and plays a significant role in determining the overall performance and reliability of electronic circuits.

    25V
  • Transistor Type

    Transistor type refers to the classification of transistors based on their operation and construction. The two primary types are bipolar junction transistors (BJTs) and field-effect transistors (FETs). BJTs use current to control the flow of current, while FETs utilize voltage to control current flow. Each type has its own subtypes, such as NPN and PNP for BJTs, and MOSFETs and JFETs for FETs, impacting their applications and characteristics in electronic circuits.

    N-Channel JFET
  • Continuous Drain Current (ID)

    Continuous Drain Current (ID) is a key parameter in electronic components, particularly in field-effect transistors (FETs) such as MOSFETs. It refers to the maximum current that can flow continuously through the drain terminal of the FET without causing damage to the component. This parameter is crucial for determining the power handling capability of the FET and is specified by the manufacturer in the component's datasheet. Designers must ensure that the actual operating current does not exceed the specified Continuous Drain Current to prevent overheating and potential failure of the component.

    20mA
  • Gate to Source Voltage (Vgs)

    The Gate to Source Voltage (Vgs) is a crucial parameter in electronic components, particularly in field-effect transistors (FETs) such as MOSFETs. It refers to the voltage difference between the gate and source terminals of the FET. This voltage determines the conductivity of the FET and controls the flow of current through the device. By varying the Vgs, the FET can be switched on or off, allowing for precise control of electronic circuits. Understanding and properly managing the Vgs is essential for ensuring the reliable and efficient operation of FET-based circuits.

    25V
  • Drain Current-Max (Abs) (ID)

    The parameter "Drain Current-Max (Abs) (ID)" in electronic components refers to the maximum current that can flow from the drain to the source terminal of a field-effect transistor (FET) or a similar device. It is a crucial specification that indicates the maximum current handling capability of the component before it reaches its saturation point or gets damaged. This parameter is typically specified in amperes (A) and helps designers ensure that the component can safely handle the expected current levels in a circuit without exceeding its limits. It is important to consider this parameter when designing circuits to prevent overloading the component and ensure reliable operation.

    0.02A
  • FET Technology

    Field-Effect Transistor (FET) technology is a type of semiconductor device commonly used in electronic components such as transistors and integrated circuits. FETs operate by controlling the flow of current through a semiconductor channel using an electric field. There are several types of FETs, including Metal-Oxide-Semiconductor FETs (MOSFETs) and Junction FETs (JFETs), each with its own characteristics and applications. FET technology offers advantages such as high input impedance, low power consumption, and fast switching speeds, making it suitable for a wide range of electronic devices and circuits. Overall, FET technology plays a crucial role in modern electronics by enabling efficient and reliable signal processing and amplification.

    JUNCTION
  • Feedback Cap-Max (Crss)

    Feedback Cap-Max (Crss) refers to the maximum capacitance between the output and input of an electronic component, such as a transistor or an operational amplifier. It indicates the level of feedback capacitance that can negatively affect the performance, stability, and bandwidth of the device. A higher Crss value may introduce unintended phase shifts or frequency response issues, making it crucial to consider in circuit design to ensure optimal operation.

    4 pF
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
0 Similar Products Remaining

2N3819 Substitute

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Where to use 2N3819?

As described above 2N3819 is mostly built for VHF and UHF applications, Due to its low noise feature, it can be used for amplification of different type of low level signals whether it will be an audio signal or other type of signals in electronics. Other than that it can also be used as a switch and it can handle max load of 10mA. Moreover it also features high gain at 100MHz which also makes it ideal to use in RF applications.

 


2N3819 Applications

●VHF/UHF Amplifier system

●Receiver and Transmitter

●RF Module

●Tone control

●High frequency amplifier.

●Low capacitance switches.

●Amplification and analog switching

●Any Low Level Signal Amplification

●Sensor Circuits

●Audio Amplifier Stages


2N3819 Package

Package.png

2N3819 Manufacturer

Central Semiconductor is a leading provider of superior discrete semiconductors that have been applied in electronic products all over the world since 1974. Nowadays, the company's products lines contain MOSFETs, bridge rectifiers, silicon carbide devices, protection devices, rectifiers, current limiting diodes, bipolar power transistors, standard, and custom small-signal transistors, and thyristors. Except for the industry-standard surface mount, the company's products also support bare die, MDMs (Multi Discrete Modules™), through-hole packages. With the loyal and high-quality brand image it has built, Central keeps leveraging its service capability and benefit more and more customers through exclusive high-tech products.


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Datasheet PDF

Download datasheets and manufacturer documentation for Central Semiconductor Corp 2N3819.

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Frequently Asked Questions

1.What is 2N3819 transistor?

It is an N-channel junction field effect transistor with high frequency and low noise.

2.What other transistors can be used to replace 2N3819?

This is a field effect tube, 25V 20mA N-channel low power. We can use BF244, BF245, MPF102, 2N3822 to instead.

3.How to run 2N3819 safely in a circuit?

It is recommended to always stay 20% below from the max ratings. Does not drive load of more than 10mA through this transistor and the load voltage should be under 25V. Always store and operate it in temperature above -65 Celsius and below +150 Celsius.
2N3819

Central Semiconductor Corp

In Stock: 2237

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