ATMEGA328P-PU Microcontroller: Features, Pinout, and Datasheet

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Published: 08 February 2022 | Last Updated: 23 September 2023

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ATMEGA328P-PU

ATMEGA328P-PU

Microchip Technology

32KB 16K x 16 FLASH AVR 8-Bit Microcontroller AVR® ATmega Series ATMEGA328P 28 Pin 20MHz 5V 28-DIP (0.300, 7.62mm)

Purchase Guide

32KB 16K x 16 FLASH AVR 8-Bit Microcontroller AVR® ATmega Series ATMEGA328P 28 Pin 20MHz 5V 28-DIP (0.300, 7.62mm)

The ATMEGA328P-PU is a CMOS 8-bit microcontroller based on the AVR® improved RISC architecture with reduced power consumption. This article mainly introduces features, pinout, datasheet and other detailed information about Microchip Technology ATMEGA328P-PU.

This video will show you how to transfer your Arduino Uno projects to an ATmega328 Chip.

Arduino Uno to ATmega328 - Shrinking your Arduino Projects

ATMEGA328P-PU Description

The ATMEGA328P-PU  is a CMOS 8-bit microcontroller based on the AVR ® improved RISC architecture with reduced power consumption. The devices achieve CPU throughput approaching one million instructions per second (MIPS) per megahertz by executing instructions in a single clock cycle, allowing the system designer to optimize power consumption versus processing performance.

The picoPower 8bit AVR  RISC   -based microcontroller features 32KB ISP flash memory with read-while-write capabilities, 1024B EEPROM, 2KB SRAM, 23 general-purpose I/O lines, 32 general-purpose working registers, three flexible timer/counters with compare modes, internal and external interrupts, serial programmable USART, a byte-oriented 2-wire serial interface, SPI serial port, a 6-channel 10-bit A/D converter (8- The device works with a voltage range of 1.8 to 5.5 volts.


ATMEGA328P-PU Pinout

The following figure is ATMEGA328P-PU Pinout.

pinout.jpg

Pinout


ATMEGA328P-PU CAD Model

The following figures are ATMEGA328P-PU Symbol, Footprint and 3D Model.

symbol.png

Symbol

footprint.png

Footprint

3d model.jpg

3D Model


ATMEGA328P-PU Features

• High Performance, Low Power AVR®  8-Bit  Microcontroller Family

• Advanced RISC Architecture

̶ 131 Powerful Instructions – Most Single Clock Cycle Execution

̶ 32 x 8 General Purpose Working Registers

̶ Fully Static Operation

̶ Up to 20 MIPS Throughput at 20MHz

̶ On-chip 2-cycle Multiplier

• High Endurance Non-volatile Memory Segments

̶ 4/8/16/32KBytes of In-System Self-Programmable Flash program memory

̶ 256/512/512/1KBytes EEPROM

̶ 512/1K/1K/2KBytes Internal SRAM

̶ Write/Erase Cycles: 10,000 Flash/100,000 EEPROM

̶ Data retention: 20 years at 85°C/100 years at 25°C(1)

̶ Optional Boot Code Section with Independent Lock Bits

· In-System Programming by On-chip Boot Program

· True Read-While-Write Operation

̶ Programming Lock for Software Security

• QTouch® library support

̶ Capacitive touch buttons, sliders and wheels

̶ QTouch and QMatrix™ acquisition

̶ Up to 64 sense channels

• Peripheral Features

̶ Two 8-bit  Timer /Counters with Separate Prescaler and Compare Mode

̶ One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture Mode

̶  Real Time  Counter with Separate Oscillator

̶ Six PWM Channels

̶ 8-channel 10-bit  ADC  in  TQFP  and  QFN /MLF package

· Temperature Measurement

̶ 6-channel 10-bit ADC in  PDIP Package 

· Temperature Measurement

̶ Programmable Serial USART

̶ Master/Slave SPI Serial Interface

̶ Byte-oriented 2-wire Serial Interface (Philips I2C compatible)

̶ Programmable Watchdog Timer with Separate On-chip Oscillator

̶ On-chip Analog Comparator

̶ Interrupt and Wake-up on Pin Change

• Special Microcontroller Features

̶  Power-on Reset  and Programmable Brown-out Detection

̶ Internal Calibrated Oscillator

̶ External and Internal Interrupt Sources

̶ Six Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, Standby, and Extended Standby

•  I/O  and Packages

̶ 23 Programmable I/O Lines

̶ 28-pin PDIP, 32-lead TQFP, 28-pad QFN/MLF and 32-pad QFN/MLF

• Operating Voltage:

̶ 1.8 - 5.5V

• Temperature Range:

̶ -40°C to 85°C

• Speed Grade:

̶ 0 - 4MHz@1.8 - 5.5V, 0 - 10MHz@2.7 - 5.5.V, 0 - 20MHz @ 4.5 - 5.5V

• Power Consumption at 1MHz, 1.8V, 25°C

̶ Active Mode: 0.2mA

̶ Power-down Mode: 0.1µA

· Power-save Mode: 0.75µA (Including 32kHz RTC)


Specifications

Microchip Technology ATMEGA328P-PU technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology ATMEGA328P-PU.
  • Type
    Parameter
  • Factory Lead Time
    8 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Through Hole
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Through Hole
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    28-DIP (0.300, 7.62mm)
  • Number of Pins
    28
  • Data Converters
    A/D 6x10b
  • Number of I/Os
    23
  • Watchdog Timers
    Yes
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    AVR® ATmega
  • Published
    1997
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    28
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    5V
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54mm
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    20MHz
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    ATMEGA328P
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    5.5V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    2/5V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    4.5V
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    2-Wire, I2C, SPI, UART, USART
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    32kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    2K x 8
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    1.8V~5.5V
  • uPs/uCs/Peripheral ICs Type

    The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

    MICROCONTROLLER, RISC
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    AVR
  • Peripherals

    In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.

    Brown-out Detect/Reset, POR, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size

    Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.

    8-Bit
  • Program Memory Size

    Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.

    32KB 16K x 16
  • Connectivity

    In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.

    I2C, SPI, UART/USART
  • Bit Size

    In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.

    8
  • Has ADC

    Has ADC refers to the presence of an Analog-to-Digital Converter (ADC) in an electronic component. An ADC is a crucial component in many electronic devices as it converts analog signals, such as voltage or current, into digital data that can be processed by a digital system. Having an ADC allows the electronic component to interface with analog signals and convert them into a format that can be manipulated and analyzed digitally. This parameter is important for applications where analog signals need to be converted into digital form for further processing or control.

    YES
  • DMA Channels

    DMA (Direct Memory Access) Channels are a feature found in electronic components such as microcontrollers, microprocessors, and peripheral devices. DMA Channels allow data to be transferred directly between peripherals and memory without involving the CPU, thereby reducing the burden on the CPU and improving overall system performance. Each DMA Channel is typically assigned to a specific peripheral device or memory region, enabling efficient data transfer operations. The number of DMA Channels available in a system determines the concurrent data transfer capabilities and can vary depending on the specific hardware design. Overall, DMA Channels play a crucial role in optimizing data transfer efficiency and system performance in electronic devices.

    NO
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    8b
  • PWM Channels

    PWM Channels, or Pulse Width Modulation Channels, refer to the number of independent PWM outputs available in an electronic component, such as a microcontroller or a motor driver. PWM is a technique used to generate analog-like signals by varying the duty cycle of a square wave signal. Each PWM channel can control the output of a specific device or component by adjusting the pulse width of the signal. Having multiple PWM channels allows for precise control of multiple devices simultaneously, making it a valuable feature in applications such as motor control, LED dimming, and audio signal generation. The number of PWM channels available in a component determines the flexibility and complexity of the system it can control.

    YES
  • Number of Timers/Counters
    3
  • EEPROM Size

    EEPROM Size refers to the amount of memory capacity available in an Electrically Erasable Programmable Read-Only Memory (EEPROM) chip. This parameter indicates the total storage space in bytes or bits that can be used to store data in a non-volatile manner. The EEPROM size determines the maximum amount of information that can be written, read, and erased from the memory chip. It is an important specification to consider when selecting an EEPROM for a particular application, as it directly impacts the amount of data that can be stored and accessed by the electronic component.

    1K x 8
  • Number of ADC Channels
    6
  • Number of I2C Channels
    1
  • Height
    3.28mm
  • Length
    37.4mm
  • Width
    6.76mm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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ATMEGA328P-PU Functional Block Diagram

The following figure shows the ATMEGA328P-PU Functional Block Diagram.

Block Diagram.png

Functional Block Diagram

The  AVR  core has 32 general-purpose working registers and a large instruction set. The  Arithmetic Logic Unit  (ALU) is directly coupled to all 32 registers, allowing two independent registers to be accessed in a single instruction executed in one clock cycle. The resulting architecture is more code efficient than traditional  CISC  microcontrollers, with throughputs up to ten times faster.


ATMEGA328P-PU Applications

• Commonly used in many projects and autonomous systems where a simple, low-powered, low-cost microcontroller is needed.

• The most common implementation is on the popular Arduino development platform, namely the Arduino Uno, Arduino Pro Mini, and Arduino Nano models.


ATMEGA328P-PU Package

The ATMEGA328P-PU Package is shown as follows.

package.png

Package


ATMEGA328P-PU Manufacturer

Microchip Technology Incorporated is a leading manufacturer of smart, networked, and secure embedded control solutions. Customers may create optimal designs using the company's simple development tools and broad product choices, which reduce risk while lowering overall system costs and time to market. The company's technologies are used by over 120,000 clients in the industrial, automotive, consumer, aerospace and defense, communications, and computing sectors.


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Datasheet PDF

Download datasheets and manufacturer documentation for Microchip Technology ATMEGA328P-PU.
Frequently Asked Questions

What is the difference between ATMEGA328P-PU and ATMEGA328P-AU?

The same thing, just the packaging is different. PU is the PDIP20 package, AU is the TQFP32 package. The former is a dual in-line package and the latter is a thin quad-lead flat pack.

What is the difference between Atmega328p-pu and Atmega16?

The biggest difference between Atmega328p-PU and Atmega16 is that their FLSAH capacity is different, the former is 32KB, the latter is 16KB, the number of external interrupts is also different, the rest are basically the same, the ATMEGA series of microcontrollers mainly have different FLASH capacities, and increase Some functional modules are essentially the same, the assembly instructions are basically the same, and there is no substantial difference.

How to connect the reset circuit of ATMega328p?

For stability, a pull-up resistor and a reset button are generally connected to reset the microcontroller. In addition, the internal crystal oscillator is only 8Mhz. If you want to make it faster, you can use a crystal oscillator and two capacitors to form an external oscillator circuit. The frequency becomes 16Mhz.
ATMEGA328P-PU

Microchip Technology

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