SI3402 Switching Regulator: SI3402 Datasheet, Pinout, Schematic

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Published: 20 January 2022 | Last Updated: 20 January 2022

1742

SI3402-B-GM

SI3402-B-GM

Silicon Labs

IC POE PD LOW EMI SW REG 20VQFN

Purchase Guide

IC POE PD LOW EMI SW REG 20VQFN

The Si3402 integrates all power management and control functions required in a Power-over-Ethernet (PoE) powered device (PD) application. This article will unlock its datasheet, pinout, feature and more about Si3402. Welcome your RFQ!

SI3402 Pinout

SI3402 Pinout.jpg

SI3402 Pinout

SI3402 CAD Model

Symbol

SI3402 Symbol.jpg

SI3402 Symbol

Footprint

SI3402 Footprint.jpg

SI3402 Footprint

3D Model

SI3402 3D Model.jpg

SI3402 3D Model

SI3402 Description

The Si3402  integrates all power management and control functions required in a Power-over-Ethernet (PoE) powered device (PD) application. The Si3402  converts the high voltage supplied over the 10/100/1000BASE-T  Ethernet connection into a regulated, low-voltage output supply. The optimized architecture of the Si3402  minimizes the solution footprint, reduces external BOM cost, and enables the use of low-cost external components while maintaining high performance. The Si3402  integrates the required diode bridges and transient surge suppressor, thus enabling the direct connection of the IC to the Ethernet RJ-45  connector. The switching power FET and all associated functions are also integrated. The integrated switching regulator supports isolated (flyback) and nonisolated (buck) converter topologies. The Si3402  is available in a low-profile, 20-pin, 5 x 5 mm QFN package.

SI3402 Feature

  • Pin-compatible replacement for the obsolete  Si3402 -A

  •  IEEE  802.3 standard-compliant solution, including pre-standard (legacy) PoE support

  • Highly-integrated IC enables compact solution footprints

l Minimal external components

l Integrated diode bridges and transient surge suppressor

l Integrated switching regulator controller with on-chip power FET

l Integrated dual current-limited hot-swap switch

  • Programmable classification circuit

  • Incorporates switcher EMI reduction techniques

  • Supports non-isolated and isolated switching topologies

  • Comprehensive protection circuitry

l Transient overvoltage protection

l Undervoltage lockout

l Early power-loss indicator

l Thermal shutdown protection

l Foldback current limiting

  • Low-profile 5 x 5 mm 20-pin  QFN  n  RoHS -compliant


SI3402 Application

 Voice over IP telephones and adapters 

 Wireless access points 

 Security cameras

 Point-of-sale terminals 

 Internet appliances 

 Network devices 

 High power applications

SI3402 Schematic

The SI3402 Schematic is given below:

SI3402 Application Circuit-Isolated Flyback Topology.jpg

SI3402 Application Circuit-Isolated Flyback Topology

SI3402 Application Circuit-Non-Isolated Buck Topology.jpg

SI3402 Application Circuit-Non-Isolated Buck Topology

SI3402 Functional Block Diagram

The Si3402 consists of two major functions: a hot-swap controller/interface and a complete pulse-width-modulated switching regulator (controller and power FET). The following figure shows the functional diagram of Si3402.

SI3402 Funtional Block Diagram.jpg

SI3402 Functional Block Diagram


Specifications

Silicon Labs SI3402-B-GM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI3402-B-GM.
  • Type
    Parameter
  • Factory Lead Time
    8 Weeks
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    20-VQFN Exposed Pad
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Published
    1999
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    20
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Type
    Controller (PD), DC/DC
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    17W
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    2.8V~57V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8mm
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    350kHz
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    30
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-XQCC-N20
  • Input Voltage-Nom

    Input Voltage-Nom refers to the nominal or rated input voltage that an electronic component or device is designed to operate within. This parameter specifies the voltage level at which the component is expected to function optimally and safely. It is important to ensure that the actual input voltage supplied to the component does not exceed this nominal value to prevent damage or malfunction. Manufacturers provide this specification to guide users in selecting the appropriate power supply or input voltage source for the component. It is a critical parameter to consider when designing or using electronic circuits to ensure reliable performance and longevity of the component.

    5V
  • Number of Channels
    1
  • Operating Supply Current

    Operating Supply Current, also known as supply current or quiescent current, is a crucial parameter in electronic components that indicates the amount of current required for the device to operate under normal conditions. It represents the current drawn by the component from the power supply while it is functioning. This parameter is important for determining the power consumption of the component and is typically specified in datasheets to help designers calculate the overall power requirements of their circuits. Understanding the operating supply current is essential for ensuring proper functionality and efficiency of electronic systems.

    2mA
  • Output Current-Max

    Output Current-Max is a parameter in electronic components that specifies the maximum amount of current that can be safely drawn from the output of the component without causing damage. It is an important specification to consider when designing circuits to ensure that the component can handle the required current without overheating or failing. Exceeding the maximum output current can lead to performance issues, component damage, or even complete failure of the circuit. It is crucial to adhere to the specified maximum output current to ensure the reliable operation of the electronic component and the overall circuit.

    0.68A
  • Control Technique

    In electronic components, "Control Technique" refers to the method or approach used to regulate and manage the operation of the component. This parameter is crucial in determining how the component functions within a circuit or system. Different control techniques can include analog control, digital control, pulse-width modulation (PWM), and various feedback mechanisms. The choice of control technique can impact the performance, efficiency, and overall functionality of the electronic component. It is important to select the appropriate control technique based on the specific requirements and characteristics of the application in which the component will be used.

    PULSE WIDTH MODULATION
  • Nominal Input Voltage

    The actual voltage at which a circuit operates can vary from the nominal voltage within a range that permits satisfactory operation of equipment. The word “nominal” means “named”.

    57V
  • Switcher Configuration

    Switcher Configuration in electronic components refers to the arrangement or setup of a switcher circuit, which is a type of power supply that converts one form of electrical energy into another. The configuration of a switcher circuit includes the specific components used, such as transistors, diodes, capacitors, and inductors, as well as their interconnections and control mechanisms. The switcher configuration determines the efficiency, voltage regulation, and other performance characteristics of the power supply. Different switcher configurations, such as buck, boost, buck-boost, and flyback, are used for various applications depending on the desired output voltage and current requirements. Understanding and selecting the appropriate switcher configuration is crucial in designing reliable and efficient power supply systems for electronic devices.

    BUCK
  • Internal Switch(s)

    The term "Internal Switch(s)" in electronic components typically refers to a built-in mechanism within a device that allows for the control of electrical current flow. These internal switches can be used to turn circuits on or off, change the direction of current, or regulate the flow of electricity within the component. They are often designed to be controlled externally, either manually or automatically, to enable various functions or operations within the electronic device. Internal switches play a crucial role in the overall functionality and performance of electronic components by providing a means to manage and manipulate electrical signals effectively.

    Yes
  • Standards

    The parameter "Standards" in electronic components refers to established criteria or specifications that ensure interoperability, safety, and performance across various electronic devices and systems. These standards are often set by recognized organizations and describe the characteristics, dimensions, and testing methods for components. Adherence to these standards helps manufacturers produce compatible and reliable products, facilitates communication between devices, and ensures compliance with regulatory requirements. Standards play a crucial role in the consistency and quality of electronic components in the industry.

    802.3at (PoE+), 802.3af (PoE)
  • Auxiliary Sense

    Auxiliary Sense refers to an additional sensing capability in electronic components that allows for the measurement of parameters such as voltage or current for the purposes of improving accuracy and performance. This feature is often used in power electronics to monitor and compensate for variations in load or temperature. By utilizing auxiliary sense inputs, designs can achieve better regulation and operational stability in various applications.

    No
  • Length
    5mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    0.9mm
  • Width
    5mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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SI3402 Package

SI3402 Package.jpg

SI3402 Package

SI3402 Manufacturer

Silicon Labs (NASDAQ: SLAB) is a leading provider of silicon, software and system solutions for the Internet of Things, Internet infrastructure, industrial control, consumer and automotive markets. Resolving the electronics industry's toughest problems, providing customers with significant advantages in performance, energy savings, connectivity, and design simplicity. Backed by world-class engineering teams with unsurpassed software and mixed-signal design expertise,  Silicon Labs empowers developers with the tools and technologies they need to advance quickly and easily from initial idea to final product.

Datasheet PDF

Download datasheets and manufacturer documentation for Silicon Labs SI3402-B-GM.

Trend Analysis

Frequently Asked Questions

What type of application does the Si3402 integrate power management and control functions?

Power-over-Ethernet (PoE) powered device (PD).

What supports isolated (flyback) and nonisolated (buck) converter topologies?

Integrated switching regulator.

What does the Si3402 integrate?

The required diode bridges and transient surge suppressor switching power FET.

What interface of the Si3402 provides the complete?

Hot-swap.

How many full diode bridges does the Si3402?

Two.

How does the si3402 work?

The Si3402 converts the high voltage supplied over the 10/100/1000BASE-T Ethernet connection into a regulated, low-voltage output supply. The optimized architecture of the Si3402 minimizes the solution footprint, reduces external BOM cost, and enables the use of low-cost external components while maintaining high performance.

What is the si3402 power-over-Ethernet (PoE) device?

The Si3402 integrates all power management and control functions required in a Power-over-Ethernet (PoE) powered device (PD) application. The Si3402 converts the high voltage supplied over the 10/100/1000BASE-T Ethernet connection into a regulated, low-voltage output supply.

Is the si3402 compatible with legacy PSEs?

The Si3402 is compatible with compliant and legacy PSEs because it uses two levels for the hot-swap current limits. By setting the initial inrush current limit to a low level, a PD based on the Si3402 minimizes the current drawn from either a compliant or legacy PSE during startup.
SI3402-B-GM

Silicon Labs

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