SST25VF020B SPI Serial Flash: Pinout, Equivalent and Datasheet

Sophie

Published: 16 February 2022 | Last Updated: 16 February 2022

2420

SST25VF020B-80-4I-SAE

SST25VF020B-80-4I-SAE

Microchip Technology

SST25 8 Pin Memory IC SST25 Series SST25VF020B 2 Mb kb 4mm mm 20mA mA 8b b

Purchase Guide

SST25 8 Pin Memory IC SST25 Series SST25VF020B 2 Mb kb 4mm mm 20mA mA 8b b

The SST25VF020B devices are enhanced with improved operating frequency and even lower power consumption. The SST25VF020B devices significantly improve performance and reliability, while lowering power consumption. SST25VF020B SPI serial Flash memories are manufactured with SST proprietary, high-performance CMOS SuperFlash® technology. Furthermore, Huge range of Semiconductors, Capacitors, Resistors and IcS in stock. Welcome RFQ.

This video demonstrates all steps to generate SPI Flash Image followed by programming the image using FlashPro6 in Libero® SoC Design Suite.

How to Program External SPI Flash using FlashPro Programmer

SST25VF020B Pinout

The following figure is the diagram of SST25VF020B pinout.

Pinout.png

Pinout


SST25VF020B CAD Model

The followings are SST25VF020B Footprint, and 3D Model.

Footprint.png

Footprint


3D Model.png

3D Model


SST25VF020B Overview

The 25 series Serial Flash family features a four-wire, SPI compatible interface that allows for a low pin count package which occupies less board space and ultimately lowers total system costs. The SST25VF020B devices are enhanced with improved operating frequency and even lower power consumption. SST25VF020B SPI serial Flash memories are manufactured with SST proprietary, high-performance CMOS SuperFlash® technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The SST25VF020B devices significantly improve performance and reliability, while lowering power consumption. The devices write (Program or Erase) with a single power supply of 2.7V-3.6V for SST25VF020B. The total energy consumed is a function of the applied voltage, current and time of application. Since for any given voltage range the SuperFlash technology uses less current to program and has a shorter erase time, the total energy consumed during any erase or program operation is less than alternative Flash memory technologies. The SST25VF020B SuperFlash memory array is organized in uniform 4-Kbyte erasable sectors with 32-Kbyte overlay blocks and 64-Kbyte overlay erasable blocks.

This article provides you with a basic overview of the SST25VF020B SPI Serial Flash, including its pin descriptions, features and specifications, etc., to help you quickly understand what SST25VF020B is.


SST25VF020B Features

● Single Voltage Read and Write Operations: 2.7V-3.6V

● Serial Interface Architecture:

   ◆ SPI Compatible: Mode 0 and Mode 3

● High-Speed Clock Frequency:

   ◆ Up to 80 MHz

● Superior Reliability:

   ◆ Endurance: 100,000 cycles

   ◆ Greater than 100 years data retention

● Low-Power Consumption:

   ◆ Active Read current: 10 mA (typical)

   ◆ Standby Current: 5 µA (typical)

● Flexible Erase Capability:

   ◆ Uniform 4-Kbyte sectors

   ◆ Uniform 32-Kbyte overlay blocks

   ◆ Uniform 64-Kbyte overlay blocks

● Fast Erase and Byte Program:

   ◆ Chip Erase time: 35 ms (typical)

   ◆ Sector/Block Erase time: 18 ms (typical)

   ◆ Byte Program time: 7 µs (typical)

● Auto Address Increment (AAI) Programming:

   ◆ Decrease total chip programming time over Byte Program operations

● End-of-Write Detection:

   ◆ Software polling the BUSY bit in STATUS register

   ◆ Busy Status readout on SO pin in AAI mode

● Hold Pin (HOLD#):

   ◆ Suspends a serial sequence to the memory without deselecting the device

● Write Protection (WP#):

   ◆ Enables/Disables the Lock-Down function of the STATUS register

● Software Write Protection:

   ◆ Write protection through Block Protection bits in STATUS register

● Temperature Ranges:

   ◆ Commercial: 0 ℃ to +70 ℃

   ◆ Industrial (I): -40 ℃ to +85 ℃

● All devices are RoHS compliant


Specifications

Microchip Technology SST25VF020B-80-4I-SAE technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology SST25VF020B-80-4I-SAE.
  • Type
    Parameter
  • Factory Lead Time
    6 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    8-SOIC (0.154, 3.90mm Width)
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Number of Pins
    8
  • Weight
    540.001716mg
  • Memory Types
    Non-Volatile
  • Published
    2005
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    SST25
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    3A991.B.1.A
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    2.7V~3.6V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3V
  • Terminal Pitch

    The center distance from one pole to the next.

    1.27mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    SST25VF020B
  • Pin Count

    a count of all of the component leads (or pins)

    8
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    3.3V
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    3.6V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    2.7V
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    SPI, Serial
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    2Mb 256K x 8
  • Nominal Supply Current

    Nominal current is the same as the rated current. It is the current drawn by the motor while delivering rated mechanical output at its shaft.

    20mA
  • Max Supply Current

    Max Supply Current refers to the maximum amount of electrical current that a component can draw from its power supply under normal operating conditions. It is a critical parameter that ensures the component operates reliably without exceeding its thermal limits or damaging internal circuitry. Exceeding this current can lead to overheating, performance degradation, or failure of the component. Understanding this parameter is essential for designing circuits that provide adequate power while avoiding overload situations.

    30mA
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    80MHz
  • Access Time

    Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.

    6 ns
  • Memory Format

    Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.

    FLASH
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    SPI
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    8b
  • Write Cycle Time - Word, Page

    Write Cycle Time - Word, Page refers to the duration required to write data to a specific memory cell or a page of memory in electronic components, particularly in non-volatile memories like Flash or EEPROM. It indicates the time taken to complete a writing operation for a single word or an entire page of data. This parameter is crucial for determining the performance and speed of memory devices in applications where quick data storage is essential. It impacts the overall efficiency in data handling, affecting both read and write speeds in memory-related operations.

    10μs
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    1b
  • Density

    In electronic components, "Density" refers to the mass or weight of a material per unit volume. It is a physical property that indicates how tightly packed the atoms or molecules are within the material. The density of a component can affect its performance and characteristics, such as its strength, thermal conductivity, and electrical properties. Understanding the density of electronic components is important for designing and manufacturing processes to ensure optimal performance and reliability.

    2 Mb
  • Standby Current-Max

    Standby Current-Max refers to the maximum amount of current that an electronic component or device consumes while in a low-power standby mode. This parameter is critical for power management, especially in battery-operated devices, as it indicates how efficiently the device can conserve energy when not actively in use. A lower Standby Current-Max value is typically desirable, as it contributes to longer battery life and reduced energy consumption. Manufacturers specify this value to help engineers select components that meet specific power efficiency requirements in their designs.

    0.00002A
  • Sync/Async

    In the context of electronic components, the parameter "Sync/Async" refers to the synchronization mode of operation. Synchronous operation means that the component operates in coordination with an external clock signal. This ensures that data is transmitted or processed at specific intervals determined by the clock signal, allowing for precise timing and coordination between different components in a system.Asynchronous operation, on the other hand, means that the component does not rely on an external clock signal for its operation. Instead, it processes data at its own pace, which can lead to more flexibility but may also result in timing issues if not properly managed.The choice between synchronous and asynchronous operation depends on the specific requirements of the system and the desired level of coordination and timing precision.

    Synchronous
  • Word Size

    Word "size" refers to the amount of data a CPU's internal data registers can hold and process at one time.

    8b
  • Programming Voltage

    A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

    2.7V
  • Serial Bus Type

    Serial bus type refers to the method by which data is transmitted between components in an electronic system using a serial communication protocol. It involves the sequential transfer of data bits over a single channel or wire, allowing for a reduced number of interconnections compared to parallel communication. Common examples of serial bus types include I2C, SPI, USB, and UART, each with its own specific protocol and applications. The choice of serial bus type can affect the speed, complexity, and power consumption of the communication between devices.

    SPI
  • Endurance

    In electronic components, "Endurance" refers to the ability of a component to withstand repeated cycles of operation without degradation in performance or failure. It is a crucial parameter, especially in components that are subjected to frequent switching or high levels of stress during operation. Endurance testing is often conducted to evaluate the reliability and durability of electronic components under real-world conditions. Components with high endurance ratings are more likely to have a longer lifespan and provide consistent performance over time. Manufacturers typically provide endurance specifications in datasheets to help engineers and designers select components that meet the required durability for their applications.

    100000 Write/Erase Cycles
  • Data Retention Time-Min

    The parameter "Data Retention Time-Min" in electronic components refers to the minimum amount of time that data can be stored in a non-volatile memory device without requiring a refresh or rewrite operation to maintain its integrity. This parameter is crucial for applications where data integrity and reliability are essential, such as in embedded systems, IoT devices, and critical infrastructure. A longer data retention time indicates a more stable memory device that can retain data for extended periods without degradation or loss. It is important to consider the data retention time when selecting memory components for specific applications to ensure data reliability and longevity.

    100
  • Write Protection

    Write protection is a feature found in electronic components, such as memory devices, that prevents data from being modified or erased. When write protection is enabled, the data stored in the component is locked and cannot be altered, ensuring the integrity and security of the information. This feature is commonly used in devices like USB flash drives, SD cards, and EEPROMs to prevent accidental data loss or unauthorized access. Write protection can be implemented through hardware mechanisms, such as physical switches or jumpers, or through software settings that restrict write access to the component.

    HARDWARE/SOFTWARE
  • Width
    5mm
  • Length
    4mm
  • Height
    1.5mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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SST25VF020B Functional Block Diagram

The following is the Block Diagram of SST25VF020B.

Functional Block Diagram.png

Functional Block Diagram


SST25VF020B Equivalent

              Model number                       Manufacturer                                       Description
M25P20SVMN6TGMicron Technology IncFlash, 256KX8, PDSO8
MX25V2006EM1I-13GMacronix International Co LtdFlash, 1MX2, PDSO8, 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, MS-012, SOP-8
M25P20-VMN3PBAMicron Technology IncFlash, 2MX1, PDSO8, 0.150 INCH, ROHS COMPLIANT, SOP-8
M25P20-VMN3TPMicron Technology IncFlash, 256KX8, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SO-8
AT45DB021D-SH-SL955Atmel CorporationFlash, 2MX1, PDSO8, 0.208 INCH, GREEN, PLASTIC, EIAJ, SOIC-8
AT45DB021B-SCAtmel CorporationFlash, 2MX1, PDSO8, 0.209 INCH, PLASTIC, EIAJ, SOIC-8
AT45DB021D-SH-TAtmel CorporationFlash, 2MX1, PDSO8, 0.208 INCH, GREEN, PLASTIC, EIAJ, SOIC-8
EN25F20-100GIElite Semiconductor Memory Technology IncFlash, 256KX8, PDSO8, SOP-8
SST25VF020-20-4E-SASilicon Storage TechnologyFlash, 2MX1, PDSO8, 4.90 X 6 MM, MS-012AA, SOIC-8
SST25VF020-20-4E-SAESilicon Storage TechnologyFlash, 2MX1, PDSO8, 4.90 X 6 MM, ROHS COMPLIANT, MS-012AA, SOIC-8


Parts with Similar Specs

The three parts on the right have similar specifications to Microchip Technology & SST25VF020B-80-4I-SAE.

SST25VF020B Package

The following diagrams show the SST25VF020B package.

Top View.png

Top View


Side View.png

Side View


End View.png

End View


SST25VF020B Package Marking

The following is the Package Marking of SST25VF020B.

8-Lead SOIC (3.90 mm).png

8-Lead SOIC (3.90 mm)


Example.png

Example


SST25VF020B Manufacturer

Microchip Technology Inc. is a leading provider of microcontroller and analog semiconductors, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality.


Trend Analysis

Frequently Asked Questions

What is the essential property of the KSZ9031RNX?

SST25VF020B SPI serial Flash memories are manufactured with SST proprietary, high-performance CMOS SuperFlash® technology. The SST25VF020B devices are enhanced with improved operating frequency and even lower power consumption.

How is SST25VF020B accessed?

The SST25VF020B is accessed through the Serial Peripheral Interface (SPI) bus compatible protocol. 

Does the SST25VF020B provide software write protection?

SST25VF020B provides software write protection.
SST25VF020B-80-4I-SAE

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