STM32F767ZIT6 Microcontroller: Pinout, Applications and Datasheet
2MB 2M x 8 FLASH ARM® Cortex®-M7 32-Bit Microcontroller STM32F7 Series STM32F767 144 Pin 216MHz 3.3V 144-LQFP









2MB 2M x 8 FLASH ARM® Cortex®-M7 32-Bit Microcontroller STM32F7 Series STM32F767 144 Pin 216MHz 3.3V 144-LQFP
The STMicroelectronics STM32F767ZIT6 is a high-performance and DSP with FPU, Arm Cortex-M7 MCU with 2 Mbytes of Flash memory, 216 MHz CPU, Art Accelerator, L1 cache, SDRAM, TFT, JPEG codec, DFSDM. This article will introduce its features, applications and datasheet.
STM32F767ZIT6 Description
The STMicroelectronics STM32F767ZIT6 is a high-performance and DSP with FPU, Arm Cortex-M7 MCU with 2 Mbytes of Flash memory, 216 MHz CPU, Art Accelerator, L1 cache, SDRAM, TFT, JPEG codec, DFSDM. It is part of the STM32F7 series of microcontrollers, which are based on the 32-bit RISC core operating at up to 216 MHz frequency. The STM32F767ZIT6 has a wide range of enhanced I/Os and peripherals, such as three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers, two general-purpose 32-bit timers, a true random number generator (RNG), and standard and advanced communication interfaces. It also features a flexible memory control (FMC) interface, a Quad-SPI Flash memory interface, a camera interface for CMOS sensors, a LCD-TFT display controller, a Chrom-ART Accelerator, a SPDIFRX interface, and a HDMI-CEC interface. The STM32F767ZIT6 operates in the –40 to +105 °C temperature range from a 1.7 to 3.6 V power supply. It comes in a LQFP-144 package and has 114 I/O pins. The STM32F767ZIT6 is suitable for applications that require high performance, DSP capability, and advanced graphics features, such as industrial control, consumer electronics, audio and video processing, and smart home devices.
STM32F767ZIT6 Features
It has a 216 MHz Arm Cortex-M7 core with double-precision floating point unit (FPU) and adaptive real-time accelerator (ART Accelerator).
It has 2 Mbytes of Flash memory and 512 Kbytes of SRAM, as well as an external memory interface for SDRAM, SRAM, NOR, NAND and PSRAM.
It supports JPEG codec for image compression and decompression, and Chrom-ART Accelerator for 2D graphics acceleration.
It has a TFT-LCD controller with up to 24-bit parallel RGB interface, and a camera interface for CMOS sensors.
It has a Quad-SPI interface for high-speed serial Flash memory access.
It has a SPDIFRX interface for digital audio input, and a HDMI-CEC interface for consumer electronics control.
It has a low-power RTC with calendar and alarm functions, and a true random number generator (RNG).
It has a wide range of communication interfaces, such as USB OTG HS and FS, Ethernet MAC, CAN, I2C, SPI, I2S, UART, SAI, and SDMMC.
It has a rich set of analog peripherals, such as three 12-bit ADCs, two 12-bit DACs, and a digital filter for sigma-delta modulators (DFSDM).
It has a large number of timers, such as twelve general-purpose 16-bit timers, two general-purpose 32-bit timers, two basic timers, two advanced-control timers, a low-power timer, and a SysTick timer.
It operates in the –40 to +105 °C temperature range from a 1.7 to 3.6 V power supply.
It comes in a LQFP-144 package and has 114 I/O pins.
Specifications
- TypeParameter
- Lifecycle Status
Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.
ACTIVE (Last Updated: 7 months ago) - Factory Lead Time12 Weeks
- Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
144-LQFP - Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES - Number of Pins144
- Manufacturer Package Identifier
The Manufacturer Package Identifier is a unique code or label assigned by the manufacturer to identify a specific package or housing style of an electronic component. This identifier helps in distinguishing between different package types of the same component, such as integrated circuits, transistors, or diodes. It typically includes information about the package dimensions, lead configuration, and other physical characteristics of the component. The Manufacturer Package Identifier is crucial for ensuring compatibility and proper assembly of electronic components in various devices and circuits.
LQFP144-1A - Data ConvertersA/D 24x12b; D/A 2x12b
- Number of I/Os114
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~85°C TA - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
STM32F7 - JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e3 - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
3 (168 Hours) - Number of Terminations144
- Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Matte Tin (Sn) - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
QUAD - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING - Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
3.3V - Terminal Pitch
The center distance from one pole to the next.
0.5mm - Frequency
In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.
216MHz - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
STM32F767 - Interface
In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.
CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SPI, UART, USART, USB - Memory Size
The memory capacity is the amount of data a device can store at any given time in its memory.
2MB - Oscillator Type
Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.
Internal - RAM Size
RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.
512K x 8 - Voltage - Supply (Vcc/Vdd)
Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.
1.7V~3.6V - uPs/uCs/Peripheral ICs Type
The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.
MICROCONTROLLER, RISC - Core Processor
The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.
ARM® Cortex®-M7 - Peripherals
In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT - Program Memory Type
Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.
FLASH - Core Size
Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.
32-Bit - Program Memory Size
Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.
2MB 2M x 8 - Connectivity
In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG - Bit Size
In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.
32 - Has ADC
Has ADC refers to the presence of an Analog-to-Digital Converter (ADC) in an electronic component. An ADC is a crucial component in many electronic devices as it converts analog signals, such as voltage or current, into digital data that can be processed by a digital system. Having an ADC allows the electronic component to interface with analog signals and convert them into a format that can be manipulated and analyzed digitally. This parameter is important for applications where analog signals need to be converted into digital form for further processing or control.
YES - DMA Channels
DMA (Direct Memory Access) Channels are a feature found in electronic components such as microcontrollers, microprocessors, and peripheral devices. DMA Channels allow data to be transferred directly between peripherals and memory without involving the CPU, thereby reducing the burden on the CPU and improving overall system performance. Each DMA Channel is typically assigned to a specific peripheral device or memory region, enabling efficient data transfer operations. The number of DMA Channels available in a system determines the concurrent data transfer capabilities and can vary depending on the specific hardware design. Overall, DMA Channels play a crucial role in optimizing data transfer efficiency and system performance in electronic devices.
YES - Data Bus Width
The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.
32b - PWM Channels
PWM Channels, or Pulse Width Modulation Channels, refer to the number of independent PWM outputs available in an electronic component, such as a microcontroller or a motor driver. PWM is a technique used to generate analog-like signals by varying the duty cycle of a square wave signal. Each PWM channel can control the output of a specific device or component by adjusting the pulse width of the signal. Having multiple PWM channels allows for precise control of multiple devices simultaneously, making it a valuable feature in applications such as motor control, LED dimming, and audio signal generation. The number of PWM channels available in a component determines the flexibility and complexity of the system it can control.
YES - Number of Timers/Counters15
- Address Bus Width
A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.
26 - Core Architecture
In electronic components, the term "Core Architecture" refers to the fundamental design and structure of the component's internal circuitry. It encompasses the arrangement of key components, such as processors, memory units, and input/output interfaces, within the device. The core architecture plays a crucial role in determining the component's performance, power efficiency, and overall capabilities. Different core architectures are optimized for specific applications and requirements, such as high-speed processing, low power consumption, or specialized functions. Understanding the core architecture of electronic components is essential for engineers and designers to select the most suitable components for their projects.
ARM - Number of A/D Converters3
- Number of ADC Channels24
- Max Junction Temperature (Tj)
Max Junction Temperature (Tj) refers to the maximum allowable temperature at the junction of a semiconductor device, such as a transistor or integrated circuit. It is a critical parameter that influences the performance, reliability, and lifespan of the component. Exceeding this temperature can lead to thermal runaway, breakdown, or permanent damage to the device. Proper thermal management is essential to ensure the junction temperature remains within safe operating limits during device operation.
105°C - Number of I2C Channels4
- Ambient Temperature Range High
This varies from person to person, but it is somewhere between 68 and 77 degrees F on average. The temperature setting that is comfortable for an individual may fluctuate with humidity and outside temperature as well. The temperature of an air conditioned room can also be considered ambient temperature.
85°C - Number of SPI Channels6
- Number of Ethernet Channels1
- Height1.6mm
- Length20mm
- REACH SVHC
The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.
No SVHC - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant
STM32F767ZIT6 Pinout

STM32F767ZIT6 CAD Model
Symbol

Footprint

3D Model

STM32F767ZIT6 Applications
Motor drive and application control: The STM32F767ZIT6 can control different types of motors, such as BLDC, PMSM, ACIM, and stepper motors, using its PWM timers, ADCs, DACs, and communication interfaces. It can also implement advanced algorithms for speed, torque, and position control, as well as sensorless techniques, using its FPU and DSP instructions.
Medical equipment: The STM32F767ZIT6 can be used for medical devices that require high precision, reliability, and safety, such as blood pressure monitors, glucose meters, pulse oximeters, electrocardiographs, and ultrasound scanners. It can also process and display medical images and signals using its JPEG codec, Chrom-ART Accelerator, TFT-LCD controller, and camera interface.
Industrial applications: The STM32F767ZIT6 can be used for industrial applications such as PLC, inverters, circuit breakers, printers and scanners, alarm systems, video intercom and HVAC. It can handle complex and time-critical tasks, such as logic control, data acquisition, signal processing, communication, and human-machine interface, using its high-performance core, memory, and peripherals.
Home audio appliances: The STM32F767ZIT6 can be used for home audio devices that require high-quality sound and user-friendly interface, such as soundbars, wireless speakers, smart speakers, and audio receivers. It can support various audio formats and protocols, such as MP3, AAC, FLAC, WAV, MIDI, USB, Bluetooth, and Wi-Fi, using its SAI, SPDIFRX, I2S, USB OTG, and Ethernet interfaces. It can also provide graphical and touch-based user interface using its TFT-LCD controller and Chrom-ART Accelerator.
Mobile applications: The STM32F767ZIT6 can be used for mobile applications that require low power consumption, high performance, and connectivity, such as smartwatches, fitness trackers, smart glasses, and drones. It can support various sensors, such as accelerometer, gyroscope, magnetometer, barometer, and GPS, using its I2C, SPI, and UART interfaces. It can also communicate with smartphones and other devices using its USB OTG, Bluetooth, and Wi-Fi interfaces. It can also provide graphical and touch-based user interface using its TFT-LCD controller and Chrom-ART Accelerator.
Internet of Things: The STM32F767ZIT6 can be used for Internet of Things applications that require smart and connected devices, such as smart home, smart city, smart agriculture, and smart industry. It can collect and process data from various sensors and actuators, using its ADCs, DACs, DFSDM, and RNG. It can also communicate with cloud servers and other devices using its Ethernet, USB OTG, CAN, and SDMMC interfaces. It can also provide graphical and touch-based user interface using its TFT-LCD controller and Chrom-ART Accelerator.
STM32F767ZIT6 Manufacturer
STMicroelectronics is a global leader in creating products and solutions for smart mobility, extreme versatility, power and energy, and IoT and connectivity. It is a multinational corporation and technology company of French-Italian origin headquartered in Plan-les-Ouates near Geneva, Switzerland. It develops, manufactures and markets semiconductors, which are integrated circuits that are found in today’s most innovative electronics solutions. It has one of the industry’s broadest technology portfolios, covering a wide range of applications, such as motor drive and control, medical equipment, industrial applications, home audio appliances, mobile applications, and Internet of Things. It operates in 35 countries and has more than 46,000 employees. It is listed on the New York Stock Exchange, on the Euronext Paris in Paris (CAC 40) and on the Borsa Italiana in Milan (FTSE MIB). It is committed to protecting people and the planet and communicating to its stakeholders with transparency.
Parts with Similar Specs
- ImagePart NumberManufacturerPackage / CaseNumber of PinsCore ArchitectureData Bus WidthNumber of I/OInterfaceMemory SizeSupply VoltageView Compare
STM32F767ZIT6
144-LQFP
144
ARM
32 b
114
CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SPI, UART, USART, USB
2 MB
3.3 V
144-LQFP
144
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32 b
114
CAN, EBI/EMI, Ethernet, I2C, I2S, IrDA, LIN, SDIO, SPI, UART, USART, USB
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144
ARM
32 b
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CAN, EBI/EMI, Ethernet, I2C, I2S, IrDA, LIN, SDIO, SPI, UART, USART, USB
2 MB
3.3 V
144-LQFP
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ARM
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CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SPI, UART, USART, USB
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144-LQFP
-
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100
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3.3 V
Datasheet PDF
- Datasheets :
How can I get started with the STM32F767ZIT6?
You can use the STM32CubeIDE, which is an integrated development environment for STM32 microcontrollers. It includes a code editor, a debugger, a compiler, and a graphical configuration tool. You can also use the STM32CubeMX, which is a graphical tool that allows you to configure the STM32 microcontrollers and generate the initialization code5. You can also use the Nucleo-144 board, which is a development board that features the STM32F767ZIT6 and provides an easy way to test and prototype your applications.
How can I interface the STM32F767ZIT6 with Ethernet and Wi-Fi?
The STM32F767ZIT6 has an Ethernet MAC interface that supports 10/100 Mbit/s communication. You can use an external PHY chip to connect the STM32F767ZIT6 to an Ethernet network. You can also use the LwIP, which is a lightweight TCP/IP stack that can run on the STM32F767ZIT6. For Wi-Fi, you can use an external Wi-Fi module that communicates with the STM32F767ZIT6 via SPI, UART, or USB interfaces. You can also use the STM32CubeWiFi, which is a software package that provides drivers and middleware for Wi-Fi modules.
What is the state of the GPIO of the STM32F767ZIT6 during reset?
The GPIO of the STM32F767ZIT6 are mostly configured as input/floating during reset, which means that the transistors are both off and the pull up/down resistors are not connected. The exceptions are the BOOT0 and BOOT1 pins, which are configured as input/pull-up and input/pull-down respectively, and the NRST pin, which is configured as input/pull-up with an external reset circuit.
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