Revolutionizing Semiconductor Manufacturing with New Plasma Power Technologies

Published: 23 September 2023 | Last Updated: 23 September 20232374
The semiconductor industry is making strides towards angstrom-scale device features, driven by the need for speed, size, and complexity in chip designs. Vitaly Petrishchev, a lead engineer for plasma

The semiconductor industry is making strides towards angstrom-scale device features, driven by the need for speed, size, and complexity in chip designs. Vitaly Petrishchev, a lead engineer for plasma power applications at Advanced Energy, suggests that high-speed, precise and repeatable plasma power delivery with sophisticated controls is fundamental to process and device improvements. Over the past four decades, plasma power delivery has rapidly evolved in parallel with semiconductor devices. The earliest form of RF power delivery was based on linear power technology, which then evolved into switched-mode technology, offering greater efficiency, simplicity, and reliability. The industry then moved towards selectable fixed impedance matching systems, allowing for wider impedance ranges and multiple match positions. As the industry moves towards a new inflection, a new generation of RF technology has emerged to empower process innovation for sub-2 nm device architectures. This technology provides access to new energy regimes and distributions, increases process space, widens the stability window, and offers high-speed response and increased RF stability. The latest technologies also offer dynamically controllable multi-level pulsing, user-defined transition timing, dP/dZ stability with high-speed output response, programmable overshoot, high-speed, high-accuracy model-based frequency tuning with a wide frequency sweep range, and reliable ignition and RF stability independent of cable length. Moreover, these technologies provide actionable intelligence through high-resolution, high-bandwidth data acquisition and analysis platforms. This new generation of RF technology is setting the stage for future technology nodes, delivering another inflection point for the industry with the promise of even more powerful semiconductor devices. As process complexity grows, so do requirements for unprecedented precision, repeatability, and control. Ongoing developments in the field of RF generators and associated hardware and software will play a pivotal role in the success of next-generation processes.

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