STSPIN32F0 BLDC Controller: Features, Applications and Datasheet
1mm mm 7mm mm Interface - UARTs (Universal Asynchronous Receiver Transmitter) 7mm mm 48 NOT SPECIFIED









1mm mm 7mm mm Interface - UARTs (Universal Asynchronous Receiver Transmitter) 7mm mm 48 NOT SPECIFIED
The inbuilt STM32 MCU of the STMicroelectronics STSPIN32F0 Advanced BLDC Controllers allows them to drive three-phase BLDC motors in a variety of driving modes. This article will introduce its features, applications and datasheet.
STSPIN32F0 Description
The inbuilt STM32 MCU of the STMicroelectronics STSPIN32F0 Advanced BLDC Controllers allows them to drive three-phase BLDC motors in a variety of driving modes. A triple half-bridge gate driver embedded in the STSPIN32F0 can drive power MOSFETs or IGBTs with a 600mA (source and sink) current capability. An incorporated interlocking mechanism prevents the high- and low-side switches of the same half-bridge from being pushed high at the same time.
The STMicroelectronics STSPIN32F0A has protections against overheating and undervoltage lockout. It also has the ability to be placed in standby mode to lower power usage. With a 5V tolerance, the device has 16 general-purpose I/O ports (GPIO). One 12-bit analog-to-digital converter with up to nine channels that can execute conversions in single-shot or scan modes is also included in the STSPIN32F0A. Five general-purpose timers can be synchronized by the device, which also has an intuitive debugging serial interface (SWD).
STSPIN32F0 Features
It has an extended operating voltage range from 8 to 45 V.
It has a 32-bit ARM Cortex-M0 core with up to 48 MHz clock frequency, 4-kByte SRAM with HW parity, and 32-kByte Flash memory with write/readout protection.
It has a 3.3 V DC/DC buck converter regulator and a 12 V LDO linear regulator with overcurrent, short-circuit, and thermal protection.
It has a three-phase gate driver with 600 mA sink/source current capability, integrated bootstrap diodes, and cross-conduction prevention.
It has 16 general-purpose I/O ports (GPIO) with 5 V tolerant capability, 5 general-purpose timers, 12-bit ADC converter with up to 9 channels, I2C, USART and SPI interfaces, and SWD debug support.
It has 4 rail-to-rail operation amplifiers for signal conditioning of the analog Hall-effect sensors and the shunt resistor signal, and a comparator for overcurrent protection with programmable threshold.
It has a 3FG open-drain output providing the decoded result of 3 Hall sensors inputs, and a standby mode for low power consumption.
It has UVLO protection on each power supply: VM, VDD, VREG and VBOOTx, and overtemperature protection.
It supports different driving modes, such as field-oriented control, 6-step sensorless, and other advanced algorithms, including the speed control loop.
It has an extended temperature range from -40 to +125 °C.
It comes in a tiny 7 mm x 7 mm QFN package134, delivering the flexibility and power of a microcontroller-based motor drive with the convenience, simplicity, and space-efficiency of a single IC.
Specifications
- TypeParameter
- Lifecycle Status
Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.
ACTIVE (Last Updated: 7 months ago) - Factory Lead Time16 Weeks
- Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
48-VFQFN Exposed Pad - Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES - Number of I/Os16
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~125°C TJ - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
STSPIN32F0 - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
3 (168 Hours) - Number of Terminations48
- Applications
The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.
BLDC Controller - Voltage - Supply
Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.
8V~45V - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
QUAD - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
NO LEAD - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
NOT SPECIFIED - Terminal Pitch
The center distance from one pole to the next.
0.5mm - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
NOT SPECIFIED - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
STSPIN - JESD-30 Code
JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.
S-XQCC-N48 - Output Voltage
Output voltage is a crucial parameter in electronic components that refers to the voltage level produced by the component as a result of its operation. It represents the electrical potential difference between the output terminal of the component and a reference point, typically ground. The output voltage is a key factor in determining the performance and functionality of the component, as it dictates the level of voltage that will be delivered to the connected circuit or load. It is often specified in datasheets and technical specifications to ensure compatibility and proper functioning within a given system.
3.3V - Interface
In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.
I2C, SPI, UART/USART - RAM Size
RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.
4K x 8 - Output Current
The rated output current is the maximum load current that a power supply can provide at a specified ambient temperature. A power supply can never provide more current that it's rated output current unless there is a fault, such as short circuit at the load.
18mA - uPs/uCs/Peripheral ICs Type
The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.
MICROPROCESSOR CIRCUIT - Core Processor
The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.
ARM® Cortex®-M0 - Program Memory Type
Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.
FLASH (32kB) - Controller Series
Controller Series in electronic components refers to a specific line or family of controllers that are designed to perform a particular function or set of functions within a system. These controllers are typically integrated circuits that manage and regulate the operation of various components in a device or system. The series may include different models or versions of controllers with varying features, capabilities, and performance specifications to suit different applications. Engineers and designers often choose a controller series based on factors such as compatibility, functionality, and performance requirements for their specific project.
STM32F031x6x7 - Length7mm
- Height Seated (Max)
Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.
1mm - Width7mm
- RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant
STSPIN32F0 Pinout

STSPIN32F0 CAD Model
Symbol

Footprint

3D Model

STSPIN32F0 Applications
Kitchen robots, such as food processors, blenders, mixers, and juicers.
Portable vacuum cleaners, such as handheld, stick, and robot vacuums.
Hand dryers and air purifiers, such as those used in public restrooms, hotels, and offices.
Drones and aero. modeling, such as quadcopters, helicopters, and planes.
Power tools, such as drills, saws, and sanders.
Industrial and educational robots, such as robotic arms, grippers, and wheels.
Home appliance and air-con. fans, such as ceiling, table, and tower fans.
STSPIN32F0 Manufacturer
STMicroelectronics is a global leader in creating products and solutions for smart mobility, extreme versatility, power and energy, and IoT and connectivity. It is a multinational corporation and technology company of French-Italian origin headquartered in Plan-les-Ouates near Geneva, Switzerland. It develops, manufactures and markets semiconductors (integrated circuits) for various applications, such as automotive, industrial, consumer, medical, and communication. It has one of the industry’s broadest technology portfolios, and its products are found in today’s most innovative electronics solutions. It has offices, sales offices, distributors, and manufacturing facilities in 35 countries around the world. It is listed on the New York Stock Exchange, on the Euronext Paris in Paris (CAC 40) and on the Borsa Italiana in Milan (FTSE MIB)
Parts with Similar Specs
Datasheet PDF
- Datasheets :
What is the STSPIN32F0?
The STSPIN32F0 is a device that combines a 32-bit ARM Cortex-M0 microcontroller and a three-phase gate driver in a single package. It is designed for low-voltage brushless DC motor applications, such as fans, drones, and power tools.
How does the STSPIN32F0 work?
The STSPIN32F0 controls the power switches of a three-phase bridge using different driving modes, such as field-oriented control, 6-step sensorless, and other advanced algorithms. It also provides various features, such as current sensing, overcurrent protection, voltage regulation, and communication interfaces.
What are the benefits of the STSPIN32F0?
The STSPIN32F0 offers a compact, integrated, and flexible solution for motor control. It reduces the number of external components, simplifies the PCB design, and enables the customization of the motor control algorithm. It also supports a wide range of operating voltages and temperatures.
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