TPS27081ADDCR High-Side Load Switch: Diagram, Pinout, and Datasheet

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Published: 26 March 2022 | Last Updated: 26 March 2022

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TPS27081ADDCR

TPS27081ADDCR

Texas Instruments

0.95mm PMIC TPS27081 6 Pin 5V SOT-23-6 Thin, TSOT-23-6

Purchase Guide

0.95mm PMIC TPS27081 6 Pin 5V SOT-23-6 Thin, TSOT-23-6

The TPS27081ADDCR is a load switch that can handle up to 8 volts and 3 amps. This article mainly introduces Diagram, Pinout, Datasheet and other detailed information about Texas Instruments TPS27081ADDCR.

This video will show you the Transistor as a switch - low side or high side.

Transistor as a switch - low side or high side

TPS27081ADDCR Description

The TPS27081ADDCR is a load switch that can handle up to 8 volts and 3 amps. The device uses an ultra-low resistance P-channel MOSFET to reduce voltage drop for low voltage and high current rails, lowering the dropout voltage via the device.

The device includes a customizable slew rate that aids in reducing or eliminating power supply droop caused by large inrush currents. The device exhibits very low leakage currents when it is turned off.

The TPS27081ADDCR combines a Power PFET and a Control NFET into a single small package, and has ESD protection on all pins, allowing for better ESD compatibility with other onboard components.

The TPS27081ADDCR level shifts ON/OFF  logic signals to VIN levels and supports CPU or MCU logic as low as 1-V to manage higher voltage power sources without the need for an external level-shifter.

Using a quick ON/OFF  logic signal to switch a large value output capacitor CL may result in an excessive inrush current. Connect a resistor R2 and an external capacitor C1 as illustrated in the Simplified Schematic to manage the load inrush current. Refer to the Application and Implementation section to set the TPS27081ADDCR to obtain a specific slew rate.

In standby power switch applications, a single pullup resistor R1 is required. When inrush current regulation is not required, connect the R2 pin of the TPS27081ADDCR to system ground in such situations.


TPS27081ADDCR Pinout

The following shows TPS27081ADDCR Pinout.

pinout.jpg

Pinout

Pin NumberPin NameDescription
5ON/OFFActive high enable. When driven with a high-impedance driver, connect an external pull down resistor to GND
6R1/C1Gate terminal of power PFET (Q1)
1R2Source terminal of NMOS (Q2) . Connect to system GND directly or through a slew rate control resistor
4VINSource terminal of power PFET (Q1). Connect a pull-up resistor between the pins VIN/R1 and R1/C1
2,3VOUTDrain terminal of power PFET (Q1). Connect a slew control capacitor between pins VOUT and R1/C1


TPS27081ADDCR CAD Model

The followings are TPS27081ADDCR Symbol, Footprint and 3D Model.

symbol.png

Symbol

footprint.png

Footprint

3d model.jpg

3D Model


TPS27081ADDCR Features

• Low ON-Resistance, High-Current PFET

– RDS(on) = 32 mΩ at VGS = –4.5 V

– RDS(on) = 44 mΩ at VGS = –3 V

– RDS(on) = 82 mΩ at VGS = –1.8 V

– RDS(on) = 93 mΩ at VGS = –1.5 V

– RDS(on) = 155 mΩ at VGS = –1.2 V

• Adjustable Turnon and Turnoff Slew Rate Control Through External R1, R2, and C1

• Supports a Wide Range of 1.2-V to 8-V Supply Inputs

• Integrated  NMOS  for PFET Control

• NMOS ON/OFF Supports a Wide Range of 1-V to 8-V Control Logic Interface

• Full ESD Protection (All Pins)

– HBM 2 kV, CDM 500 V

• Ultra-Low Leakage Current in Standby (Typical 100 nA)

• Available in Tiny 6-Pin Package

– 2.9 mm × 2.8 mm × 0.75 mm SOT (DDC)


Specifications

Texas Instruments TPS27081ADDCR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments TPS27081ADDCR.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    ACTIVE (Last Updated: 5 days ago)
  • Factory Lead Time
    6 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    SOT-23-6 Thin, TSOT-23-6
  • Number of Pins
    6
  • Weight
    36.003894mg
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Cut Tape (CT)
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    6
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Resistance

    Resistance is a fundamental property of electronic components that measures their opposition to the flow of electric current. It is denoted by the symbol "R" and is measured in ohms (Ω). Resistance is caused by the collisions of electrons with atoms in a material, which generates heat and reduces the flow of current. Components with higher resistance will impede the flow of current more than those with lower resistance. Resistance plays a crucial role in determining the behavior and functionality of electronic circuits, such as limiting current flow, voltage division, and controlling power dissipation.

    82mOhm
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Matte Tin (Sn)
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    1.19W
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    5V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.95mm
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    TPS27081
  • Number of Outputs
    1
  • Max Output Current

    The maximum current that can be supplied to the load.

    3A
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    8V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    1V
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    On/Off
  • Output Configuration

    Output Configuration in electronic components refers to the arrangement or setup of the output pins or terminals of a device. It defines how the output signals are structured and how they interact with external circuits or devices. The output configuration can determine the functionality and compatibility of the component in a circuit design. Common types of output configurations include single-ended, differential, open-drain, and push-pull configurations, each serving different purposes and applications in electronic systems. Understanding the output configuration of a component is crucial for proper integration and operation within a circuit.

    High Side
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    1.19W
  • Output Current

    The rated output current is the maximum load current that a power supply can provide at a specified ambient temperature. A power supply can never provide more current that it's rated output current unless there is a fault, such as short circuit at the load.

    3A
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    Not Required
  • Switch Type

    Based on their characteristics, there are basically three types of switches: Linear switches, tactile switches and clicky switches.

    General Purpose
  • Nominal Input Voltage

    The actual voltage at which a circuit operates can vary from the nominal voltage within a range that permits satisfactory operation of equipment. The word “nominal” means “named”.

    8V
  • Ratio - Input:Output

    The parameter "Ratio - Input:Output" in electronic components refers to the relationship between the input and output quantities of a device or system. It is a measure of how the input signal or energy is transformed or converted into the output signal or energy. This ratio is often expressed as a numerical value or percentage, indicating the efficiency or effectiveness of the component in converting the input to the desired output. A higher ratio typically signifies better performance or higher efficiency, while a lower ratio may indicate losses or inefficiencies in the conversion process. Understanding and optimizing the input-output ratio is crucial in designing and evaluating electronic components for various applications.

    1:1
  • Voltage - Load

    Voltage - Load refers to the voltage across a load component in an electronic circuit when it is connected and operational. It represents the electrical potential difference that drives current through the load, which can be a resistor, motor, or other devices that consume electrical power. The voltage - load relationship is crucial for determining how much power the load will utilize and how it will affect the overall circuit performance. Properly managing voltage - load is essential for ensuring devices operate efficiently and safely within their specified limits.

    1.2V~8V
  • Number of Drivers
    2
  • Rds On (Typ)

    The parameter "Rds On (Typ)" in electronic components refers to the typical on-state resistance of a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) when it is fully conducting. This parameter indicates the resistance encountered by the current flowing through the MOSFET when it is in the on-state, which affects the power dissipation and efficiency of the component. A lower Rds On value indicates better conduction and lower power loss in the MOSFET. Designers often consider this parameter when selecting components for applications where minimizing power loss and maximizing efficiency are critical factors.

    32m Ω
  • Built-in Protections

    Built-in protections in electronic components refer to the safety features and mechanisms that are integrated into the component to prevent damage or malfunction in various situations. These protections are designed to safeguard the component from overvoltage, overcurrent, overheating, short circuits, and other potential hazards that could occur during operation. By having built-in protections, electronic components can operate more reliably and safely, extending their lifespan and reducing the risk of failure. These protections are essential for ensuring the overall performance and longevity of electronic devices and systems.

    TRANSIENT
  • Features

    In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

    Slew Rate Controlled
  • Height
    1.1mm
  • Length
    2.9mm
  • Width
    1.6mm
  • Thickness

    Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.

    870μm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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TPS27081ADDCR Functional Block Diagram

The following figure is TPS27081ADDCR Functional Block Diagram.

Functional Block Diagram.png

Functional Block Diagram

TPS27081ADDCR Simplified Schematic

The TPS27081ADDCR Simplified Schematic is shown as follows.

Simplified Schematic.png

Simplified Schematic


TPS27081ADDCR Layout

Use proper PCB layout techniques for the device's optimal operating performance, such as: 

•  VIN  and VOUT traces should be as short and wide as feasible to allow high current.

• Ceramic bypass capacitors with low ESR should be used to connect the VIN pin to ground. 1-F ceramic with X5R or X7R dielectric is a standard recommended bypass capacitance. This capacitor should be as close as feasible to the device pins.

Ceramic bypass capacitors with low ESR should be used to connect the VOUT pin to ground. The suggested bypass capacitance is one-tenth of the VIN bypass capacitor with dielectric ratings of X5R or X7R.

This capacitor should be as close as feasible to the device pins.

layout.png

Layout


TPS27081ADDCR Typical Application

Standard Load Switching Application

The TPS27081ADDCR is a high-side load switch with a power PFET and a control NMOS integrated in a small package. Internal components of the device are rated for an 8-V supply and can handle up to 3 A of load current.

The device can be used for a wide range of purposes. The TPS27081ADDCR device is used to manage the load inrush current as shown in the diagram below.

Standard Application Diagram.png

Standard Application Diagram


TPS27081ADDCR Applications

• High-Side Load Switches

• Inrush Current Control

• Power Sequencing and Control

• Standby Power Isolation

• Portable Power Switches


TPS27081ADDCR Package

The TPS27081ADDCR Package is shown as follows.

package.png

Package


TPS27081ADDCR Manufacturer

Texas Instruments Incorporated (TI) is an American technology corporation based in Dallas, Texas, that creates and manufactures semiconductors and integrated circuits for electronic designers and manufacturers around the world. Based on sales volume, it is one of the top ten semiconductor businesses in the world. Analog chips and embedded processors, which account for more than 80% of the company's revenue, are the company's main focus. TI also makes calculators, microcontrollers, and multi-core processors, as well as TI digital light processing technologies and education technology.


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Datasheet PDF

Download datasheets and manufacturer documentation for Texas Instruments TPS27081ADDCR.
Frequently Asked Questions

What does a high side switch do?

High-side switches can safely drive high currents into complex (resistive, inductive, and capacitive) grounded loads in compliance with the harsh automotive environment. This requires both a robust, low on-resistance power switch and accurate analog circuitry for diagnostic, protection, and control functions.

What is the high and low side of a switch?

The low-side switch is switching ground while the high-side switch is connecting the voltage supply. Generally in a circuit, you want to keep the ground connected and switch the power.

What is load switching?

A load switch is simply a switch, mechanical or electronic, that connects or disconnects a load to the high side of a power source. A wall light switch is a load switch. Any off/on switch on an appliance or electronic product is a load switch. A relay can be a load switch.

How many volts does the TPS27081ADDCR handle?

8 volts and 3 amps.

What type of P-channel MOSFET does the TPS27081ADDCR use?

Ultra-low resistance.

What is the slew rate of the TPS27081ADDCR?

Reducing or eliminating power supply droop.

What does the TPS27081ADDCR exhibit when it is turned off?

Very low leakage currents.

What two components does the TPS27081ADDCR combine into a single small package?

Power PFET and a Control NFET.

What does the TPS27081ADDCR support as low as 1-V to manage higher voltage power sources without the need for an external level-shifter?

CPU or MCU logic.

What happens when using a quick ON/OFF logic signal to switch a large value output capacitor CL?

Using a quick ON/OFF logic signal to switch a large value output capacitor CL may result in an excessive inrush current.

In what document is the TPS27081ADDCR illustrated?

Simplified Schematic.

What section of the TPS27081ADDCR provides a specific slew rate?

Application and Implementation.

What is required in standby power switch applications?

A single pullup resistor R1.

What pin does the TPS27081ADDCR connect to when inrush current regulation is not required?

R2 pin.
TPS27081ADDCR

Texas Instruments

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