Xilinx XC7A200T-2FBG676C FPGA Overview
2.54mm mm 1GB B FPGAs Artix-7 Series 676-BBGA, FCBGA 1mm mm 676
Discover user reviews of the XC7A200T-2FBG676C FPGA, highlighting its performance in 5G, low latency, energy efficiency, and challenges like its learning curve.
Product Introduction
User reviews play a vital role in understanding the real-world performance of the XC7A200T-2FBG676C FPGA. They offer insights into how this advanced technology performs under different conditions. You can rely on these reviews to evaluate its reliability and efficiency. This FPGA is a game-changer for high-performance applications, especially in 5G and 4G networks. Its ability to handle complex tasks makes it a preferred choice for engineers and developers working on cutting-edge telecommunications systems.
Overview of the XC7A200T-2FBG676C FPGA
Key Applications in 5G and 4G
The XC7A200T-2FBG676C FPGA plays a critical role in advancing 5G and 4G technologies. You can find it at the heart of systems like software defined radio, which powers modern communication networks. Its ability to process high-speed data streams makes it ideal for 5G standalone networks. This FPGA also supports RAN applications, enabling efficient management of wireless communication between devices.
In 5G and 4G networks, the FPGA ensures low latency and high bandwidth. These features are essential for applications like video streaming, online gaming, and real-time communication. Its flexibility allows you to adapt it for various tasks, making it a valuable tool for engineers working on SDR and other wireless technologies.
Industries Benefiting from the XC7A200T-2FBG676C FPGA
Telecommunications is the primary industry benefiting from this FPGA. It supports the development of 5G and 4G infrastructure, including base stations and RAN systems. You can also see its impact in the IoT sector. Devices connected through the internet of things rely on fast and reliable communication, which this FPGA helps achieve.
The FPGA is also widely used in industries that require SDR technology. For example, aerospace and defense sectors use it for secure and efficient communication systems. Its adaptability makes it suitable for various applications, from high-speed data processing to real-time signal analysis.
Tip: If you're working on 5G or 4G projects, consider the XC7A200T-2FBG676C FPGA for its performance and versatility.
Features and Specifications of the XC7A200T-2FBG676C FPGA
Performance and Logic Capacity
The XC7A200T-2FBG676C FPGA delivers exceptional performance, making it a reliable choice for high-demand applications. Its logic cell capacity reaches 215,360, enabling you to handle complex designs with ease. With 740 DSP slices, this FPGA excels in tasks requiring high-speed mathematical computations. The system logic cells, totaling 160,800, further enhance its ability to manage intricate operations.
This FPGA also supports advanced clock management, ensuring precision and low jitter. You can achieve high data transfer speeds while maintaining low average packet latency. Its efficient design reduces CPU load, allowing your system to operate smoothly even under heavy workloads.
Technical Specifications
The technical specifications of the XC7A200T-2FBG676C FPGA highlight its robust capabilities. Here's a detailed breakdown:
| Specification | Value |
|---|---|
| Logic Cells | 215,360 |
| System Logic Cells | 160,800 |
| DSP Slices | 740 |
| Block RAM | 44,300 Kb |
| Max CLB Flip-Flops | 1,021,440 |
| Max Distributed RAM | 10,400 Kb |
| Package | FBG676C |
| Core Voltage | 1.0V (0.9V option) |
| Process Technology | 28 nm, HKMG, HPL |
| I/O Bandwidth | Up to 28.05 Gb/s |
| DDR3 Interface Support | Up to 1,866 Mb/s |
| PCI Express Support | Up to x8 Gen3 |
These specifications ensure that the FPGA meets the demands of modern applications. Its low power consumption and high bandwidth make it an efficient solution for industries requiring reliable performance.
Unique Features for High-Bandwidth Applications
The XC7A200T-2FBG676C FPGA stands out for its suitability in high-bandwidth applications. It offers an impressive I/O bandwidth of 2.9 Tb/s, ensuring seamless data transfer. The FPGA's DSP performance reaches 5.3 TMAC/s, making it ideal for tasks like signal processing and real-time analytics.
Its advanced serial connectivity supports speeds from 600 Mb/s to 28.05 Gb/s, enabling you to achieve low latency in data-intensive environments. The DDR3 interface, with speeds up to 1,866 Mb/s, further enhances its ability to handle high-speed operations. Additionally, the FPGA's power consumption is 50% lower than previous generations, reducing operational costs while maintaining top-tier performance.
Note: The XC7A200T-2FBG676C FPGA's unique features make it a top choice for applications requiring high bandwidth and low round-trip packet latency.
User Feedback on the XC7A200T-2FBG676C FPGA
Real-World Performance Insights
Users have shared valuable insights about the real-world performance of the xc7a200t-2fbg676c. Many reviews highlight its ability to handle demanding applications in 5g and 4g networks. You can rely on this FPGA for tasks like software defined radio and 5g standalone systems. Its high bandwidth and low latency make it a top choice for engineers working on 5g testbed projects.
One standout feature is its efficient data processing. Users report that the FPGA maintains low average packet latency even under heavy workloads. This ensures smooth operation in applications like RAN and SDR. Additionally, its power consumption is significantly lower than older models, which helps reduce operational costs.
The FPGA's performance in ultra-reliable low latency communications has also impressed users. It delivers consistent results in environments requiring high-speed data transfer and minimal delays. Whether you're working on 5g or 4g infrastructure, this FPGA provides the reliability and speed you need.
Note: Users rate the xc7a200t-2fbg676c highly for its performance, with an average rating that reflects its reliability and efficiency in real-world scenarios.
Usability and Learning Curve
The usability of the xc7a200t-2fbg676c has received mixed feedback. Some users find it easy to integrate into existing systems, especially for 5g and 4g applications. Its compatibility with SDR and software defined radio projects makes it a versatile tool for engineers. However, others mention a steep learning curve for beginners.
If you're new to FPGA development, you might need time to understand its features and capabilities. Users recommend starting with smaller projects to get familiar with its design tools and workflows. Once you gain experience, you can leverage its full potential for complex tasks like RAN and open radio access network systems.
The FPGA's documentation and community support have been praised by many users. You can find in-depth reviews and tutorials online, which can help you overcome initial challenges. These resources make it easier to learn and use the FPGA effectively.
Compatibility with Design Tools
The xc7a200t-2fbg676c offers excellent compatibility with popular design tools. Users appreciate its seamless integration with software like Vivado Design Suite. This allows you to create and test designs efficiently, whether you're working on 5g standalone systems or SDR applications.
Its support for advanced features like high-speed data transfer speeds and low round-trip packet latency makes it a preferred choice for developers. You can use it to design systems with high bandwidth and low CPU load, ensuring optimal performance.
Some users have noted minor issues with tool compatibility when working on older systems. However, these problems are rare and can often be resolved with updates or patches. Overall, the FPGA's compatibility with modern design tools enhances its usability and makes it a reliable option for 5g and 4g projects.
Tip: Ensure your design tools are up-to-date to maximize the FPGA's compatibility and performance.
Pros and Cons of the XC7A200T-2FBG676C FPGA
Advantages Highlighted by Users
The XC7A200T-2FBG676C FPGA offers several advantages that make it a standout choice for 5G and 4G applications. Its high-speed serial connectivity, supporting data rates up to 6.6 Gb/s, ensures smooth data transfer in bandwidth-intensive environments. This feature is particularly beneficial for 5G standalone systems, where low latency and high bandwidth are critical. You can rely on its advanced DSP slices for efficient filtering and signal processing, which enhances performance in real-time applications like RAN and SDR.
Users also appreciate its adaptability across industries. Whether you're working on 5G testbeds, IoT devices, or industrial automation, this FPGA delivers consistent results. Its low power consumption reduces operational costs, making it an eco-friendly option for large-scale deployments. Additionally, the FPGA's ability to maintain low average packet latency under heavy CPU load ensures reliable performance in demanding scenarios.
The FPGA's robust design supports a wide range of operating conditions. With a maximum operating temperature of +85°C and 400 I/Os, it performs well in challenging environments. Its embedded memory of 12.83 Mbit and 8 transceivers further enhance its capability to handle complex tasks. These features make it a preferred choice for applications requiring high bandwidth and low latency, such as 4G multi-carrier systems and medical imaging processing.
Challenges and Limitations
Despite its strengths, the XC7A200T-2FBG676C FPGA has some limitations. Beginners often find its learning curve steep, especially when integrating it into 5G and 4G projects. While its compatibility with tools like Vivado Design Suite is excellent, you may encounter minor issues when working with older systems. These challenges can slow down your development process if you're not familiar with FPGA design workflows.
Another concern is its cost. Although the FPGA offers exceptional performance, some users feel its price point may not suit smaller projects or budget-constrained teams. Its advanced features, such as high-speed data rates and low power consumption, come at a premium. This makes it more suitable for large-scale or high-performance applications rather than entry-level tasks.
Lastly, while the FPGA excels in reducing CPU load, its complexity can lead to higher initial setup times. You might need to invest additional effort in optimizing your designs to fully leverage its capabilities. However, with proper planning and resources, these challenges can be mitigated, allowing you to unlock the full potential of this powerful FPGA.
Tip: If you're new to FPGA development, start with smaller projects to familiarize yourself with its features before tackling complex 5G or 4G systems.
Pricing and Value for Money
Cost and Affordability
The XC7A200T-2FBG676C FPGA is known for its advanced features, but its cost reflects its high-end capabilities. You might find its price higher than entry-level FPGAs, making it more suitable for large-scale or high-performance projects. Its ability to handle complex tasks in 5G and 4G networks, such as software defined radio and RAN systems, justifies its premium pricing.
Real-time monitoring of price fluctuations and historical trends can help you make informed purchasing decisions. These trends provide insights into the FPGA's value for money by comparing its specifications and performance with its cost. If you're working on projects requiring high bandwidth and low latency, this FPGA offers a strong return on investment despite its higher price point.
User Opinions on Price Justification
Users often highlight the FPGA's exceptional performance and versatility as key factors justifying its price. Its ability to support 5G and 4G applications, such as SDR and RAN, makes it a valuable asset for engineers. Many users appreciate its low power consumption and reduced CPU load, which contribute to long-term cost savings.
However, some users feel the price may not suit smaller projects or teams with limited budgets. They recommend evaluating your project's requirements before investing in this FPGA. If your application demands high bandwidth and ultra-low latency, the cost becomes easier to justify. For simpler tasks, you might consider alternative options.
Tip: Compare the FPGA's features with your project's needs to determine if its price aligns with your budget and goals.
Availability and Sourcing
You can source the XC7A200T-2FBG676C FPGA from multiple global suppliers. Platforms like FPGAkey track its inventory and pricing in real time, ensuring you have access to the latest data. This helps you identify reliable suppliers and secure the best deals.
Historical price data is also available, allowing you to analyze trends and plan your purchase accordingly. The FPGA's widespread availability ensures you can find it for your 5G and 4G projects without significant delays. Whether you're working on SDR systems or RAN applications, sourcing this FPGA is straightforward with the right tools.
Note: Use inventory tracking platforms to stay updated on availability and pricing, ensuring a smooth procurement process.
Comparison with Other FPGAs
Comparison with Other Xilinx 7-Series FPGAs
When comparing the xc7a200t-2fbg676c to other Xilinx 7-Series FPGAs, you’ll notice its superior performance in 5g and 4g applications. While other models like the XC7A100T or XC7A50T are suitable for smaller projects, the xc7a200t-2fbg676c stands out for its higher logic capacity and bandwidth. It offers 215,360 logic cells, which is significantly more than its counterparts. This makes it ideal for handling complex designs in 5g standalone systems and SDR applications.
The xc7a200t-2fbg676c also excels in latency-sensitive tasks. Its advanced DSP slices and high-speed serial connectivity ensure low latency, which is crucial for RAN systems. In contrast, other 7-Series FPGAs may struggle to deliver the same level of efficiency in high-bandwidth environments. If your project involves ultra-reliable low latency communication, this FPGA provides a clear advantage.
Another key difference lies in power consumption. The xc7a200t-2fbg676c consumes 50% less power compared to older models in the series. This makes it a cost-effective choice for large-scale deployments in 5g and 4g networks. Its ability to support high-speed DDR3 interfaces and PCI Express Gen3 further enhances its versatility, setting it apart from other Xilinx 7-Series FPGAs.
Tip: Choose the xc7a200t-2fbg676c if your project demands high bandwidth, low latency, and efficient power usage.
Performance Against Competing Brands
The xc7a200t-2fbg676c outperforms many competing brands in the FPGA market, especially in 5g and 4g applications. Brands like Intel and Lattice offer alternatives, but they often fall short in terms of bandwidth and latency. For example, Intel’s Stratix series provides high logic capacity but consumes more power, making it less efficient for large-scale 5g deployments.
In SDR applications, the xc7a200t-2fbg676c delivers unmatched performance. Its 740 DSP slices and 2.9 Tb/s I/O bandwidth enable seamless data processing, which is essential for real-time signal analysis. Competing brands may offer similar features, but their higher latency can impact the overall efficiency of RAN systems.
Another area where this FPGA excels is adaptability. Its compatibility with Vivado Design Suite and support for advanced features like PCI Express Gen3 give it an edge over competitors. While other brands may offer lower-cost options, they often lack the robust performance and reliability needed for 5g and 4g projects.
Note: If you’re evaluating FPGAs for high-performance tasks, the xc7a200t-2fbg676c offers a balanced combination of speed, efficiency, and adaptability.
Best Use Cases for the XC7A200T-2FBG676C FPGA
The xc7a200t-2fbg676c is best suited for applications requiring high bandwidth and low latency. In 5g and 4g networks, it plays a vital role in RAN systems and SDR technology. You can use it to develop 5g standalone systems that demand ultra-reliable low latency communication. Its ability to handle high-speed data streams makes it ideal for tasks like video streaming, online gaming, and real-time analytics.
This FPGA is also a top choice for industries like aerospace and defense. Its robust design and low power consumption make it suitable for secure communication systems and high-speed data processing. In the IoT sector, you can rely on it to manage large volumes of data efficiently, ensuring seamless connectivity between devices.
Another excellent use case is medical imaging. The FPGA’s high DSP performance and advanced memory capabilities enable precise and fast image processing. Whether you’re working on 5g testbeds, industrial automation, or SDR applications, the xc7a200t-2fbg676c delivers consistent results.
Tip: Consider this FPGA for projects that prioritize high bandwidth, low latency, and reliable performance in demanding environments.
The XC7A200T-2FBG676C has received positive feedback for its performance in demanding applications. You can rely on this fpga for tasks like sdr, where high bandwidth and low latency are essential. Users praise its adaptability and energy efficiency, making it a strong choice for industries like telecommunications and aerospace. However, its steep learning curve and premium price may challenge beginners or budget-conscious teams.
If you need a solution for sdr projects or 5G systems, this fpga offers excellent value. Start with smaller designs to familiarize yourself with its tools. For large-scale deployments, its advanced features justify the investment.
FAQ
1. What makes the XC7A200T-2FBG676C FPGA suitable for 5G applications?
The FPGA offers high bandwidth, low latency, and advanced DSP slices. These features ensure smooth data processing and real-time communication, which are essential for 5G systems. Its adaptability also allows you to optimize it for specific 5G tasks like RAN and SDR.
2. Can beginners use the XC7A200T-2FBG676C FPGA effectively?
Beginners may find the learning curve steep. However, you can start with smaller projects and use the available documentation and tutorials. These resources simplify the process and help you gradually understand its features and design tools.
3. How does the XC7A200T-2FBG676C FPGA compare to other Xilinx 7-Series FPGAs?
This FPGA offers higher logic capacity, better power efficiency, and advanced connectivity options. It outperforms other models like the XC7A100T in handling complex designs and high-bandwidth tasks, making it ideal for demanding applications like 5G and IoT.
4. Is the XC7A200T-2FBG676C FPGA energy-efficient?
Yes, it consumes 50% less power compared to older models. This efficiency reduces operational costs and makes it suitable for large-scale deployments in industries like telecommunications and aerospace.
5. Where can you buy the XC7A200T-2FBG676C FPGA?
You can purchase it from global suppliers or platforms like FPGAkey. These sources provide real-time inventory and pricing updates, helping you find the best deals for your project needs.
Tip: Check for supplier reviews and historical price trends before making a purchase.
Specifications
- TypeParameter
- Factory Lead Time10 Weeks
- Contact Plating
Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.
Copper, Silver, Tin - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
676-BBGA, FCBGA - Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES - Number of Pins676
- Memory TypesDDR3
- Number of I/Os400
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
0°C~85°C TJ - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
Artix-7 - Published2009
- JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e1 - Pbfree Code
The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.
yes - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
4 (72 Hours) - Number of Terminations676
- ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
3A991.D - Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) - HTS Code
HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.
8542.39.00.01 - Voltage - Supply
Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.
0.95V~1.05V - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
BOTTOM - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
BALL - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
NOT SPECIFIED - Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
1V - Terminal Pitch
The center distance from one pole to the next.
1mm - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
NOT SPECIFIED - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
XC7A200T - Pin Count
a count of all of the component leads (or pins)
676 - Number of Outputs400
- Qualification Status
An indicator of formal certification of qualifications.
Not Qualified - Power Supplies
an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?
1V - Memory Size
The memory capacity is the amount of data a device can store at any given time in its memory.
1GB - RAM Size
RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.
1.6MB - Clock Frequency
Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.
1286MHz - Programmable Logic Type
Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).
FIELD PROGRAMMABLE GATE ARRAY - Number of Logic Elements/Cells215360
- Total RAM Bits
Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.
13455360 - Number of LABs/CLBs16825
- Speed Grade
Speed grade is a specification in electronic components that indicates the maximum operating speed at which the component can reliably function. It is commonly used for integrated circuits, particularly in digital logic devices and programmable logic devices. The speed grade is typically denoted by a number or letter code that correlates to the maximum frequency or propagation delay of the device, influencing its performance in high-speed applications. Components with higher speed grades are capable of faster processing and lower signal delay compared to those with lower grades.
-2 - Number of Registers269200
- Combinatorial Delay of a CLB-Max
The Combinatorial Delay of a CLB-Max in electronic components refers to the time it takes for a signal to propagate through a combinational logic block (CLB) within a Field-Programmable Gate Array (FPGA) to reach its output. This delay is influenced by factors such as the complexity of the logic function being implemented, the routing resources available, and the physical distance the signal needs to travel within the CLB. Understanding and optimizing the Combinatorial Delay of a CLB-Max is crucial in designing efficient and high-performance digital circuits, as it directly impacts the overall speed and functionality of the FPGA design. By minimizing this delay, designers can achieve faster operation and improved performance in their electronic systems.
1.05 ns - Length27mm
- Height Seated (Max)
Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.
2.54mm - Width27mm
- RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant
Parts with Similar Specs
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Logic Elements/CellsNumber of I/ORAM SizeSupply VoltageLengthTerminal PitchView Compare
XC7A200T-2FBG676C
676-BBGA, FCBGA
676
215360
400
1.6 MB
1 V
27 mm
1 mm
676-BBGA, FCBGA
676
162240
400
1.4 MB
1 V
27 mm
1 mm
676-BBGA, FCBGA
676
162240
400
1.4 MB
1 V
27 mm
1 mm
676-BBGA, FCBGA
676
162240
400
1.4 MB
1 V
27 mm
1 mm
Datasheet PDF
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
- Environmental Information :
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