The purpose of this article is to briefly illustrate what is possible with IGBTMOSFET gate drivers and the features and applications of these drivers manufactured by Broadcom under the ACPL series.

The purpose of this article is to briefly illustrate what is possible with Niobium oxide capacitors and the features and applications of these capacitors manufactured by AVX Corporation under the OxiCap series.

The purpose of this article is to briefly illustrate what is possible with Ceramic capacitors and the features and applications of these capacitors manufactured by AVX Corporation under the Kyocera series.

The purpose of this article is to briefly illustrate what is possible with ARM-based mixed-signal processors and the features and applications of these processors manufactured by Analog Devices under the ADSP-SC5xx series.

The purpose of this article is to briefly illustrate what is possible with Fixed-point digital signal processors and the features and applications of these processors manufactured by Analog Devices under the ADSP-21xx series.

The purpose of this article is to briefly illustrate what is possible with Film capacitors and the features and applications of these capacitors manufactured by KEMET Corporation under the KC-LINK-PG series.

The purpose of this article is to briefly illustrate what is possible with Film capacitors and the features and applications of these capacitors manufactured by KEMET Corporation under the KC-LINK series.

A range of highly accurate tilt sensors from Murata Manufacturing called SCA103T series inclinometers are made to measure precise tilt angles in a variety of applications. These inclinometers provide reliable measurement of both pitch and roll angles using dual-axis measurement. This article introduce its features and applications.

High-performance EMI/RFI filters from the EMIFIL®, BNX series from Murata Manufacturing are made to reduce radio frequency interference (RFI) and electromagnetic interference (EMI) noise in electrical equipment. This article introduce its features and applications.

The Molex MX150 series Rectangular Connector Housings are a family of high-performance connectors designed for harsh environment applications that require reliable and robust power and signal interconnects. The housings feature a compact design with sealed and unsealed configurations to fit specific application requirements. This article introduce its features and applications.

For applications needing high power contacts and signal interconnects, Molex Mega-Fit series Connector Kits are a line of dependable, high-performance power connectors. The kits include a sturdy housing design that safeguards the connector system's integrity and protects against unintentional unmating. This article introduce its features and applications.

Aimed towards embedded system designs, the Microsemi Corporation SmartFusion®2 System-on-Chip (SoC) series combines an ARM Cortex-M3-based microcontroller with an FPGA fabric. This article introduce its features and applications.