ATTINY25V 8-bit AVR Microcontroller: Pinout, Equivalent and Datasheet
2KB 1K x 16 FLASH AVR 8-Bit Microcontroller AVR® ATtiny Series ATTINY25 8 Pin 10MHz 3V 8-SOIC (0.154, 3.90mm Width)









2KB 1K x 16 FLASH AVR 8-Bit Microcontroller AVR® ATtiny Series ATTINY25 8 Pin 10MHz 3V 8-SOIC (0.154, 3.90mm Width)
The ATTINY25V is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATTINY25V achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed. Furthermore, Huge range of Semiconductors, Capacitors, Resistors and IcS in stock. Welcome RFQ.

Introduction to AVR Microcontroller
ATTINY25V Pinout
The following figure is the diagram of ATTINY25V Pinout.
Pinout
ATTINY25V CAD Model
The followings are ATTINY25V Symbol, Footprint, and 3D Model.
PCB Symbol
PCB Footprint
3D Model
ATTINY25V Overview
The ATTINY25V is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATTINY25V achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed.
This article provides you with a basic overview of the ATTINY25V 8-bit AVR Microcontroller, including its pin descriptions, features and specifications, etc., to help you quickly understand what ATTINY25V is.
ATTINY25V Features
● High Performance, Low Power AVR® 8-Bit Microcontroller
● Advanced RISC Architecture
◆ 120 Powerful Instructions – Most Single Clock Cycle Execution
◆ 32 x 8 General Purpose Working Registers
◆ Fully Static Operation
● Non-volatile Program and Data Memories
◆ 2K Bytes of In-System Programmable Program Memory Flash
★ Endurance: 10,000 Write/Erase Cycles
◆ 128 Bytes In-System Programmable EEPROM
★ Endurance: 100,000 Write/Erase Cycles
◆ 128 Bytes Internal SRAM
◆ Programming Lock for Self-Programming Flash Program and EEPROM Data Security
● Peripheral Features
◆ 8-bit Timer/Counter with Prescaler and Two PWM Channels
◆ 8-bit High Speed Timer/Counter with Separate Prescaler
★ 2 High Frequency PWM Outputs with Separate Output Compare Registers
★ Programmable Dead Time Generator
◆ USI – Universal Serial Interface with Start Condition Detector
◆ 10-bit ADC
★ 4 Single Ended Channels
★ 2 Differential ADC Channel Pairs with Programmable Gain (1x, 20x)
★ Temperature Measurement
◆ Programmable Watchdog Timer with Separate On-chip Oscillator
◆ On-chip Analog Comparator
● Special Microcontroller Features
◆ debugWIRE On-chip Debug System
◆ In-System Programmable via SPI Port
◆ External and Internal Interrupt Sources
◆ Low Power Idle, ADC Noise Reduction, and Power-down Modes
◆ Enhanced Power-on Reset Circuit
◆ Programmable Brown-out Detection Circuit
◆ Internal Calibrated Oscillator
● I/O: Six Programmable I/O Lines
● Operating Voltage: 1.8 - 5.5V
● Speed Grade: 0 – 4 MHz @ 1.8 - 5.5V, 0 - 10 MHz @ 2.7 - 5.5V
● Industrial Temperature Range
● Low Power Consumption
◆ Active Mode: 1 MHz, 1.8V: 300 µA
◆ Power-down Mode: 0.1 µA at 1.8V
Specifications
- TypeParameter
- Factory Lead Time8 Weeks
- Contact Plating
Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.
Tin - Mount
In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.
Surface Mount - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
8-SOIC (0.154, 3.90mm Width) - Number of Pins8
- Data ConvertersA/D 4x10b
- Number of I/Os6
- Watchdog TimersYes
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~85°C TA - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tube - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
AVR® ATtiny - Published1997
- JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e3 - Pbfree Code
The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.
yes - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
2 (1 Year) - Number of Terminations8
- Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
DUAL - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
3V - Frequency
In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.
10MHz - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
40 - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
ATTINY25 - Supply Voltage-Max (Vsup)
The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.
5.5V - Interface
In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.
SPI - Memory Size
The memory capacity is the amount of data a device can store at any given time in its memory.
2kB - Oscillator Type
Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.
Internal - RAM Size
RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.
128 x 8 - Voltage - Supply (Vcc/Vdd)
Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.
1.8V~5.5V - uPs/uCs/Peripheral ICs Type
The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.
MICROCONTROLLER, RISC - Core Processor
The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.
AVR - Peripherals
In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.
Brown-out Detect/Reset, POR, PWM, WDT - Program Memory Type
Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.
FLASH - Core Size
Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.
8-Bit - Program Memory Size
Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.
2KB 1K x 16 - Connectivity
In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.
USI - Bit Size
In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.
8 - Has ADC
Has ADC refers to the presence of an Analog-to-Digital Converter (ADC) in an electronic component. An ADC is a crucial component in many electronic devices as it converts analog signals, such as voltage or current, into digital data that can be processed by a digital system. Having an ADC allows the electronic component to interface with analog signals and convert them into a format that can be manipulated and analyzed digitally. This parameter is important for applications where analog signals need to be converted into digital form for further processing or control.
YES - DMA Channels
DMA (Direct Memory Access) Channels are a feature found in electronic components such as microcontrollers, microprocessors, and peripheral devices. DMA Channels allow data to be transferred directly between peripherals and memory without involving the CPU, thereby reducing the burden on the CPU and improving overall system performance. Each DMA Channel is typically assigned to a specific peripheral device or memory region, enabling efficient data transfer operations. The number of DMA Channels available in a system determines the concurrent data transfer capabilities and can vary depending on the specific hardware design. Overall, DMA Channels play a crucial role in optimizing data transfer efficiency and system performance in electronic devices.
NO - Data Bus Width
The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.
8b - EEPROM Size
EEPROM Size refers to the amount of memory capacity available in an Electrically Erasable Programmable Read-Only Memory (EEPROM) chip. This parameter indicates the total storage space in bytes or bits that can be used to store data in a non-volatile manner. The EEPROM size determines the maximum amount of information that can be written, read, and erased from the memory chip. It is an important specification to consider when selecting an EEPROM for a particular application, as it directly impacts the amount of data that can be stored and accessed by the electronic component.
128 x 8 - Number of ADC Channels4
- Number of PWM Channels2
- Number of I2C Channels1
- Height1.75mm
- Length4.98mm
- Width3.99mm
- REACH SVHC
The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.
No SVHC - Radiation Hardening
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
No - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant - Lead Free
Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.
Lead Free
ATTINY25V Functional Block Diagram
The following is the Block Diagram of ATTINY25V.
Block Diagram
ATTINY25V Equivalent
Model number | Manufacturer | Description |
AT90LS2323-10SI | Microchip Technology Inc | RISC Microcontroller, 8-Bit, FLASH, 10MHz, CMOS, PDSO8 |
AT90S2343-10PI | Atmel Corporation | RISC Microcontroller, 8-Bit, FLASH, AVR RISC CPU, 10MHz, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 |
ATTINY25V-10PI | Atmel Corporation | RISC Microcontroller, 8-Bit, FLASH, 10MHz, CMOS, PDIP8, 0.300 INCH, PLASTIC, MS-001BA, DIP-8 |
AT90S2323-10PC | Atmel Corporation | RISC Microcontroller, 8-Bit, FLASH, AVR RISC CPU, 10MHz, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 |
AT90LS2343-4SC | Atmel Corporation | RISC Microcontroller, 8-Bit, FLASH, AVR RISC CPU, 4MHz, CMOS, PDSO8, 0.200 INCH, EIAJ, PLASTIC, SOIC-8 |
AT90LS2343-4PI | Atmel Corporation | RISC Microcontroller, 8-Bit, FLASH, AVR RISC CPU, 4MHz, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 |
AT90LS2323-10SJ | Microchip Technology Inc | RISC Microcontroller, 8-Bit, FLASH, 10MHz, CMOS, PDSO8 |
AT90LS2343-4SI | Atmel Corporation | RISC Microcontroller, 8-Bit, FLASH, AVR RISC CPU, 4MHz, CMOS, PDSO8, 0.200 INCH, EIAJ, PLASTIC, SOIC-8 |
AT90LS2323-4PI | Atmel Corporation | RISC Microcontroller, 8-Bit, FLASH, AVR RISC CPU, 4MHz, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 |
AT90LS2323-4PC | Atmel Corporation | RISC Microcontroller, 8-Bit, FLASH, AVR RISC CPU, 4MHz, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 |
Parts with Similar Specs
- ImagePart NumberManufacturerPackage / CaseNumber of PinsData Bus WidthNumber of I/OInterfaceMemory SizeSupply VoltagePeripheralsView Compare
ATTINY25V-10SSU
8-SOIC (0.154, 3.90mm Width)
8
8 b
6
SPI
2 kB
3 V
Brown-out Detect/Reset, POR, PWM, WDT
8-SOIC (0.209, 5.30mm Width)
8
8 b
6
SPI
1 kB
3 V
Brown-out Detect/Reset, POR, PWM, WDT
8-SOIC (0.154, 3.90mm Width)
8
8 b
6
SPI
1 kB
3 V
Brown-out Detect/Reset, POR, PWM, WDT
8-SOIC (0.209, 5.30mm Width)
8
8 b
6
SPI
8 kB
3 V
Brown-out Detect/Reset, POR, PWM, WDT
ATTINY25V Package
The following diagrams show the ATTINY25V Package.
Top View
Side View
End View
ATTINY25V Manufacturer
Microchip Technology Inc. is a leading provider of microcontroller and analog semiconductors, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality.
Datasheet PDF
- Datasheets :
- PCN Design/Specification :
- PCN Packaging :
- ConflictMineralStatement :
How many pins of ATTINY25V-10SSU?
8 Pins.
What’s the operating temperature of ATTINY25V-10SSU?
-40°C~85°C TA.
What is the essential property of the ATTINY25V?
The ATTINY25V is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture.
- LIS2DW12TR Motion Sensor: Datasheet, Pinout, Application Hint
07 April 20222303
- MOC3022 Random-Phase Optoisolator: Datasheet, Pinout and Circuit
30 July 20217375
- AV101KE Through Hole Resistor: Datasheet, Application, Features
30 July 2021910
- MJE15030G NPN Transistor: Datasheet, Equivalent, and Pinout
28 August 20213827
- BCP56 Transistor: Features, Pinout, and Datasheet
13 October 20212650
- RF101 Diode: Datasheet, Features, Dimensions
21 July 2021599
- BC550 NPN Transistor: Pinout, Datasheet, and Equivalents
18 August 20215947
- LM63625 Step-down Voltage Converter: Datasheet, Price, Circuit
02 April 20225436
- What is PCB Reflow? High-Speed Signal Reflow Path Analysis
24 November 20212597
- Semiconductor Devices: Impact on IoT and Modern Communication (Part-1)
22 July 20242175
- What is Digital Signal Processing (DSP)?
17 March 20223736
- What is a Servo Motor?
09 March 20214404
- Microwave Diode: Introduction and Types
07 January 202120895
- Toroidal transformer: Principles, Features, Types and Applications
13 November 20206924
- Infrared Thermometer: How it Works? How to Use it?
12 August 20216376
- Introduction to DC Amplifier
11 January 202114213
Microchip Technology
In Stock: 5
United States
China
Canada
Japan
Russia
Germany
United Kingdom
Singapore
Italy
Hong Kong(China)
Taiwan(China)
France
Korea
Mexico
Netherlands
Malaysia
Austria
Spain
Switzerland
Poland
Thailand
Vietnam
India
United Arab Emirates
Afghanistan
Åland Islands
Albania
Algeria
American Samoa
Andorra
Angola
Anguilla
Antigua & Barbuda
Argentina
Armenia
Aruba
Australia
Azerbaijan
Bahamas
Bahrain
Bangladesh
Barbados
Belarus
Belgium
Belize
Benin
Bermuda
Bhutan
Bolivia
Bonaire, Sint Eustatius and Saba
Bosnia & Herzegovina
Botswana
Brazil
British Indian Ocean Territory
British Virgin Islands
Brunei
Bulgaria
Burkina Faso
Burundi
Cabo Verde
Cambodia
Cameroon
Cayman Islands
Central African Republic
Chad
Chile
Christmas Island
Cocos (Keeling) Islands
Colombia
Comoros
Congo
Congo (DRC)
Cook Islands
Costa Rica
Côte d’Ivoire
Croatia
Cuba
Curaçao
Cyprus
Czechia
Denmark
Djibouti
Dominica
Dominican Republic
Ecuador
Egypt
El Salvador
Equatorial Guinea
Eritrea
Estonia
Eswatini
Ethiopia
Falkland Islands
Faroe Islands
Fiji
Finland
French Guiana
French Polynesia
Gabon
Gambia
Georgia
Ghana
Gibraltar
Greece
Greenland
Grenada
Guadeloupe
Guam
Guatemala
Guernsey
Guinea
Guinea-Bissau
Guyana
Haiti
Honduras
Hungary
Iceland
Indonesia
Iran
Iraq
Ireland
Isle of Man
Israel
Jamaica
Jersey
Jordan
Kazakhstan
Kenya
Kiribati
Kosovo
Kuwait
Kyrgyzstan
Laos
Latvia
Lebanon
Lesotho
Liberia
Libya
Liechtenstein
Lithuania
Luxembourg
Macao(China)
Madagascar
Malawi
Maldives
Mali
Malta
Marshall Islands
Martinique
Mauritania
Mauritius
Mayotte
Micronesia
Moldova
Monaco
Mongolia
Montenegro
Montserrat
Morocco
Mozambique
Myanmar
Namibia
Nauru
Nepal
New Caledonia
New Zealand
Nicaragua
Niger
Nigeria
Niue
Norfolk Island
North Korea
North Macedonia
Northern Mariana Islands
Norway
Oman
Pakistan
Palau
Palestinian Authority
Panama
Papua New Guinea
Paraguay
Peru
Philippines
Pitcairn Islands
Portugal
Puerto Rico
Qatar
Réunion
Romania
Rwanda
Samoa
San Marino
São Tomé & Príncipe
Saudi Arabia
Senegal
Serbia
Seychelles
Sierra Leone
Sint Maarten
Slovakia
Slovenia
Solomon Islands
Somalia
South Africa
South Sudan
Sri Lanka
St Helena, Ascension, Tristan da Cunha
St. Barthélemy
St. Kitts & Nevis
St. Lucia
St. Martin
St. Pierre & Miquelon
St. Vincent & Grenadines
Sudan
Suriname
Svalbard & Jan Mayen
Sweden
Syria
Tajikistan
Tanzania
Timor-Leste
Togo
Tokelau
Tonga
Trinidad & Tobago
Tunisia
Turkey
Turkmenistan
Turks & Caicos Islands
Tuvalu
U.S. Outlying Islands
U.S. Virgin Islands
Uganda
Ukraine
Uruguay
Uzbekistan
Vanuatu
Vatican City
Venezuela
Wallis & Futuna
Yemen
Zambia
Zimbabwe