EP2C35F672I8N FPGA: Features, Specifications and Pins
2.6mm mm FPGAs Cyclone® II Series 672-BGA 1mm mm 672
EP2C35F672I8N is of Cyclone II FPGA Devices. To ensure rapid availability and low cost, Cyclone II FPGAs are manufactured on 300-mm wafers using TSMC's 90-nm low-k dielectric process. Cyclone II devices can support complex digital systems on a single chip at a cost comparable to ASICs by minimizing silicon region.
EP2C35F672I8N Description
EP2C35F672I8N is of Cyclone II FPGA Devices. To ensure rapid availability and low cost, Cyclone II FPGAs are manufactured on 300-mm wafers using TSMC's 90-nm low-k dielectric process. Cyclone II devices can support complex digital systems on a single chip at a cost comparable to ASICs by minimizing the silicon region. Unlike other FPGA vendors who compromise power consumption and performance for low-cost, Altera’s latest generation of low-cost FPGAs—Cyclone II FPGAs, offers 60% higher performance and half the power consumption of competing 90-nm FPGAs. The low cost and optimized feature set of Cyclone II FPGAs make them ideal solutions for a wide array of automotive, consumer, communications, video processing, test and measurement, and other end-market solutions.
EP2C35F672I8N Features
■ High-density architecture with 4,608 to 68,416 LEs
M4K embedded memory blocks
Up to 1.1 Mbits of RAM available without reducing available logic
4,096 memory bits per block (4,608 bits per block including 512 parity bits)
Variable port configurations of ×1, ×2, ×4, ×8, ×9, ×16, ×18, ×32, and ×36
True dual-port (one read and one write, two reads, or two writes) operation for ×1, ×2, ×4, ×8, ×9, ×16, and ×18 modes ● Byte enables for data input masking during writes
Up to 260-MHz operation
■ Embedded multipliers
Up to 150 18- × 18-bit multipliers are each configurable as two independent 9- × 9-bit multipliers with up to 250-MHz performance
Optional input and output registers
■ Advanced I/O support
High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL, differential HSTL, and differential SSTL
Single-ended I/O standard support, including 2.5-V and 1.8-V, SSTL class I and II, 1.8-V and 1.5-V HSTL class I and II, 3.3-V PCI and PCI-X 1.0, 3.3-, 2.5-, 1.8-, and 1.5-V LVCMOS, and 3.3-, 2.5-, and 1.8-V LVTTL
Peripheral Component Interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 3.0 compliance for 3.3-V operation at 33 or 66 MHz for 32- or 64-bit interfaces
PCI Express with an external TI PHY and an Altera PCI Express ×1 Megacore® function
133-MHz PCI-X 1.0 specification compatibility
High-speed external memory support, including DDR, DDR2, and SDR SDRAM, and QDRII SRAM supported by drop in Altera IP MegaCore functions for ease of use
Three dedicated registers per I/O element (IOE): one input register, one output register, and one output-enable register
Programmable bus-hold feature
Programmable output drive strength feature
Programmable delays from the pin to the IOE or logic array
I/O bank grouping for unique VCCIO and/or VREF bank settings
MultiVolt™ I/O standard support for 1.5-, 1.8-, 2.5-, and 3.3-interfaces
Hot-socketing operation support
Tri-state with weak pull-up on I/O pins before and during configuration
Programmable open-drain outputs
Series on-chip termination support
■ Flexible clock management circuitry
Hierarchical clock network for up to 402.5-MHz performance
Up to four PLLs per device provide clock multiplication and division, phase shifting, programmable duty cycle, and external clock outputs, allowing system-level clock management and skew control
Up to 16 global clock lines in the global clock network that drive throughout the entire device
■ Device configuration
Fast serial configuration allows configuration times less than 100 ms
Decompression feature allows for smaller programming file storage and faster configuration times
Supports multiple configuration modes: active serial, passive serial, and JTAG-based configuration
Supports configuration through low-cost serial configuration devices
Device configuration supports multiple voltages (either 3.3, 2.5, or 1.8 V)
■ Intellectual property
Altera megafunction and Altera MegaCore function support, and Altera Megafunctions Partners Program (AMPPSM) megafunction support, for a wide range of embedded processors, on-chip and off-chip interfaces, peripheral functions, DSP functions, and communications functions and protocols. Visit the Altera IPMegaStore at www.altera.com to download IP MegaCore functions.
Nios II Embedded Processor support


EP2C35F672I8N Pins

Notes:
(1) Cyclone II devices support vertical migration within the same package (for example, you can migrate between the EP2C20 device in the 484-pin FineLine BGA package and the EP2C35 and EP2C50 devices in the same package).
(2) The Quartus® II software I/O pin counts include four additional pins, TDI, TDO, TMS, and TCK, which are not available as general purpose I/O pins.
(3) TQFP: thin quad flat pack.
(4) PQFP: plastic quad flat pack.
(5) Vertical migration is supported between the EP2C5F256 and the EP2C8F256 devices. However, not all of the DQ and DQS groups are supported. Vertical migration between the EP2C5 and the EP2C15 in the F256 package is not supported. (6) The I/O pin counts for the EP2C5, EP2C8, and EP2C15A devices include 8 dedicated clock pins that can be used for data inputs. The I/O counts for the EP2C20, EP2C35, EP2C50, and EP2C70 devices include 16 dedicated clock pins that can be used for data inputs.
(7) EP2C8A, EP2C15A, and EP2C20A have a Fast On feature that has a faster POR time. The EP2C15A is only available with the Fast On option.
EP2C35F672I8N Equivalents
Specifications
- TypeParameter
- Factory Lead Time8 Weeks
- Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
672-BGA - Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES - Number of I/Os475
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~100°C TJ - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
Cyclone® II - JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e1 - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
3 (168 Hours) - Number of Terminations672
- ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
3A991 - Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
TIN SILVER COPPER - Additional Feature
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
ALSO REQUIRES 3.3 SUPPLY - HTS Code
HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.
8542.39.00.01 - Voltage - Supply
Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.
1.15V~1.25V - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
BOTTOM - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
BALL - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
1.2V - Terminal Pitch
The center distance from one pole to the next.
1mm - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
40 - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
EP2C35 - JESD-30 Code
JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.
S-PBGA-B672 - Number of Outputs459
- Qualification Status
An indicator of formal certification of qualifications.
Not Qualified - Power Supplies
an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?
1.21.5/3.33.3V - Clock Frequency
Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.
402.5MHz - Number of Inputs475
- Programmable Logic Type
Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).
FIELD PROGRAMMABLE GATE ARRAY - Number of Logic Elements/Cells33216
- Total RAM Bits
Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.
483840 - Number of LABs/CLBs2076
- Length27mm
- Height Seated (Max)
Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.
2.6mm - Width27mm
- RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
RoHS Compliant
EP2C35F672I8N Manufacturer
Altera Corporation was established in 1983, with the Chinese name: Altera, headquartered in San Jose, California, with more than 2,600 employees in 19 countries, and annual revenue in 2006 reached $ 1.29 billion. Altera is a company specializing in the design, production, and sales of high-performance, high-density programmable logic devices (PLDs) and corresponding development tools.
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