5SGXMA3K2F40I3N Integrated Circuit: Features, Specification, Datasheet

Sophie

Published: 28 April 2021 | Last Updated: 17 April 2025

641

5SGXMA3K2F40I3N

5SGXMA3K2F40I3N

Intel

3.5mm mm FPGAs Stratix® V GX Series 1517-BBGA, FCBGA 1mm mm

Purchase Guide

3.5mm mm FPGAs Stratix® V GX Series 1517-BBGA, FCBGA 1mm mm

The 5SGXMA3K2F40I3N is of the Stratix V GX systems. They have up to 66 integrated transceivers with a data rate of 14.1 Gbps. Backplane and optical interface implementations are also supported by these transceivers. These systems are designed for high-performance, high-bandwidth applications in the wireline, military communications, and network test equipment industries, such as 40G/100G optical transport, packet processing, and traffic management.

5SGXMA3K2F40I3N Description

An improved core architecture, optimized transceivers up to 28.05 gigabits per second (Gbps), and a specific collection of integrated hard intellectual property (IP) blocks are among the features of Altera's 28-nm Stratix® V FPGAs. Stratix V FPGAs introduce a new class of application-targeted devices that are designed for: 

• Bandwidth-intensive applications and protocols, such as PCI Express® (PCIe®) Gen3

• 40G/100G and beyond data-intensive applications 

• High-performance, high-precision digital signal processing (DSP) applications

Each of the four Stratix V variants (GT, GX, GS, and E) is aimed at a particular group of applications.

5SGXMA3K2F40I3N Features

Feature
Description
Technology

• 28-nm TSMC process technology

• 0.85-V or 0.9-V core voltage

Low-power serial transceivers

• 28.05-Gbps transceivers on Stratix V GT devices

• Electronic dispersion compensation (EDC) for XFP, SFP+, QSFP, CFP optical module support 

• Adaptive linear and decision feedback equalization 

• Transmitter pre-emphasis and de-emphasis 

• Dynamic reconfiguration of individual channels 

• On-chip instrumentation (EyeQ non-intrusive data eye monitoring)

Backplane capability• 600-Megabits per second (Mbps) to 12.5-Gbps data rate capability
General-purpose I/Os (GPIOs)

• 1.6-Gbps LVDS

 • 1,066-MHz external memory interface 

• On-chip termination (OCT) 

• 1.2-V to 3.3-V interfacing for all Stratix V devices

Embedded HardCopy Block• PCIe Gen3, Gen2, and Gen1 complete protocol stack, x1/x2/x4/x8 end point and root port
Embedded transceiver hard IP

• Interlaken physical coding sublayer (PCS)

 • Gigabit Ethernet (GbE) and XAUI PCS 

• 10G Ethernet PCS • Serial RapidIO® (SRIO) PCS 

• Common Public Radio Interface (CPRI) PCS 

• Gigabit Passive Optical Networking (GPON) PCS

Power management

• Programmable Power Technology

• Quartus II integrated PowerPlay Power Analysis

High-performance core fabric

• Enhanced ALM with four registers

 • Improved routing architecture reduces congestion and improves compile times

Embedded memory blocks

• M20K: 20-Kbit with hard error correction code (ECC)

• MLAB: 640-bit

Variable precision DSP blocks

• Up to 600 MHz performance

• Natively support signal processing with precision ranging from 9x9 up to 54x54 

• New native 27x27 multiply mode 

• 64-bit accumulator and cascade for systolic finite impulse responses (FIRs) 

• Embedded internal coefficient memory 

• Pre-adder/subtractor improves efficiency 

• Increased number of outputs allows more independent multipliers

Fractional PLLs

• Fractional mode with third-order delta-sigma modulation 

• Integer mode

• Precision clock synthesis, clock delay compensation, and zero delay buffer (ZDB)

Clock networks

• 800-MHz fabric clocking

• Global, quadrant, and peripheral clock networks 

• Unused clock networks can be powered down to reduce dynamic power

Device configuration

• Serial and parallel flash interface

• Enhanced advanced encryption standard (AES) design security features 

• Tamper protection 

• Partial and dynamic reconfiguration 

• Configuration via Protocol (CvP)

High-performance packaging

• Multiple device densities with identical package footprints enables seamless migration between different FPGA densities

• FBGA packaging with on-package decoupling capacitors 

• Lead and RoHS-compliant lead-free options

HardCopy V migration


Specifications

Intel 5SGXMA3K2F40I3N technical specifications, attributes, parameters and parts with similar specifications to Intel 5SGXMA3K2F40I3N.
  • Type
    Parameter
  • Factory Lead Time
    8 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    1517-BBGA, FCBGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of I/Os
    696
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~100°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Stratix® V GX
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    3A001.A.7.A
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    0.82V~0.88V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    0.85V
  • Terminal Pitch

    The center distance from one pole to the next.

    1mm
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    5SGXMA3
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PBGA-B1517
  • Number of Outputs
    696
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    0.851.52.52.5/31.2/3V
  • Number of Inputs
    696
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    12830 CLBS
  • Programmable Logic Type

    Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    340000
  • Total RAM Bits

    Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.

    19456000
  • Number of LABs/CLBs
    128300
  • Length
    40mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    3.5mm
  • Width
    40mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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5SGXMA3K2F40I3N Manufacturer

With up to 1.1 million logic components, integrated transceivers up to 28 Gbit/s, up to 1.6 Tbit/s of serial switching capacity, up to 1,840 GMACs of signal-processing performance, and up to 7 x72 DDR3 memory interfaces at 800 MHz, the Stratix series FPGAs were the company's largest and highest bandwidth devices. Northwest Logic was acquired by the company in September 2000 in order to extend its design services for the delivery of full system-on-chip solutions. Altera released the SDK for OpenCL in May 2013, allowing software developers to access the high-performance capabilities of programmable logic devices.

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